Abstract: A cost effective method is provided for assembly of hybrid optoelectronic circuits requiring flip-chip bonding of multiple active optoelectronic devices onto common substrate or optical bench platform with fine pitch and high accuracy “after-bonding” alignment to the alignment features on substrate and/or to other elements of the hybrid circuit. A Flip-Chip Bonder equipped with high precision Bonding Arm and optical and mechanical system, heated substrate chuck and heated pick-up tool may be used both for alignment and thermal bonding of active component dies to corresponding bonding pads on the common substrate using gold-tin (Au—Sn) solder disposed between die bonding pad and the corresponding substrate bonding pad.

Abstract: A point-of-presence (POP) call center system capable of answering, servicing, queuing and routing of calls at local points of presence to reduce communications costs and enhance operational efficiency for toll-free inbound call centers. The POP call center system includes a set of point-of-presence call center gateways distributed at points of presence close to the point of call origination that are connected by a virtual private network to premises call center gateways at business locations where the call centers reside.