Patents Represented by Attorney, Agent or Law Firm Bernard Lau
  • Toughening of brittle epoxy resin matrices with functionalized particulate elastomers
    Patent number: 5464902
    Abstract: Relatively brittle epoxy resin systems which may be employed as structural film adhesives and matrix resins for fiber-reinforced prepregs are toughened against impact-induced damage by the addition of minor quantities of functionalized elastomer particles having a glass transition temperature of less than 10.degree. C.
    Type: Grant
    Filed: February 4, 1994
    Date of Patent: November 7, 1995
    Assignee: Cytec Technology Corp.
    Inventor: Hans G. Recker
  • Hybrid yarn comprising a core of intermixed polyamide filaments and reinforcing rilaments wherein the core is wrapped by a polyamide fiber
    Patent number: 5464684
    Abstract: A hybrid yarn which comprises an intimate blend of reinforcing fibers and matrix-forming thermoplastic fibers made of low viscosity polyamide and has been overwrapped with a further polyamide yarn is useful for producing laid, woven, knitted, braided and wound structures, which in turn can be consolidated into fiber composites.
    Type: Grant
    Filed: November 2, 1992
    Date of Patent: November 7, 1995
    Assignee: Cytec Technology Corp.
    Inventors: Joerg Vogelsang, Giorgio Greening, Regina Laws, Peter Ittemann
  • Aqueous, essentially VOC-free adhesive epoxy primer
    Patent number: 5461090
    Abstract: Aqueous primer compositions containing substantially no volatile organic solvents, suitable for promoting the bonding of a metal adherend to a second adherend, are prepared by dispersing one or more solid epoxy resins and a solid curing agent into water such that the particle sizes of the solids are less than 30 .mu.m. The primer compositions are environmentally superior to solvent based primers without loss of physical properties, are storage stable, and exhibit excellent solvent resistance.
    Type: Grant
    Filed: October 1, 1993
    Date of Patent: October 24, 1995
    Assignee: Cytec Technology Corp.
    Inventor: David E. Sweet