Abstract: This invention provides improved components (e.g. array “pins”, print head, substrate platen, print head platen, and the like) for microarray printing devices as well as microarray printing devices incorporating such components. In one embodiment, this invention provides a microarray print head comprising a plurality of glass or quartz spotting capillaries disposed in a support that maintains a fixed spacing between the spotting capillaries and that permits the spotting capillaries to move in a direction parallel to the long axis of the capillaries.

Abstract: The present invention provides for novel reagents whose fluorescence increases in the presence of particular proteases. The reagents comprise a characteristically folded peptide backbone conjugated to two fluorophores such that the fluorophores are located opposite sides of a cleavage site. When the folded peptide is cleaved, as by digestion with a protease, the fluorophores provide a high intensity fluorescent signal at a visible wavelength. Because of their high specificity and their high fluorescence signal in the visible wavelengths, these protease indicators are particularly well suited for detection of protease activity in biological samples, in particular in frozen tissue sections. Thus this invention also provides for methods of detecting protease activity in situ in frozen sections.

Abstract: A player tracking system for tracking customer activity for a casino establishment having gaming sections and non-gaming sections. The player tracking system includes a plurality of player tracking cards for distribution to respective participating customers that incorporate respective customer accounts associated with respective customer IDs. The system further includes a plurality of gaming activity player tracking units positioned in the gaming section of the casino establishment proximate the gaming activity which cooperates with the player tracking cards to monitor the gaming activity data of the respective customer, and a plurality of non-gaming activity player tracking units positioned in the non-gaming section of the casino establishment proximate the non-gaming activity which cooperates with the player tracking cards to monitor the non-gaming activity data of the respective customer.

Abstract: This invention pertains to methods assembly of organic molecules and electrolytes in hybrid electronic. In one embodiment, a method is provided that involves contacting a surface/electrode with a compound of formula: R-L2-M-L1-Z1 where Z1 is a surface attachment group; L1 and L2 are independently linker or covalent bonds; M is an information storage molecule; and R is a protected or unprotected reactive site or group; where the contacting results in attachment of the redox-active moiety to the surface via the surface attachment group; and ii) contacting the surface-attached information storage molecule with an electrolyte having the formula: J-Q where J is a charged moiety (e.g., an electrolyte); and Q is a reactive group that is reactive with the reactive group (R) and attaches J to the information storage molecule thereby patterning the electrolyte on the surface.

Abstract: Inexpensive yet effective three-dimensional image displays for gaming machines are disclosed. Images are implemented onto a medium via a lenticular process, and the medium is applied to various gaming machine surfaces whereby a viewer can perceive effects such as motion and depth. Steps can include developing a game theme, designing visual images for this game theme, generating digital files containing these visual images, previewing these digital files, modeling the visual images in a computer assisted simulation, implementing these visual images onto a medium, attaching the medium to a movable base, and installing the movable base to the gaming machine. The medium can be a multi-image sheet containing regions of overlapping images where different images are visually predominant at different viewing angles, and the movable base can comprise a gaming reel. Multiple gaming reels can be used, and can be adapted to rotate in any direction.

Abstract: The present invention provides a method of forming a high-k dielectric layer on a semiconductor wafer. A metal silicate dielectric layer is initially deposited on the wafer. A dopant having dissociable oxygen is introduced into the metal silicate on the wafer. According to one embodiment the metal silicate comprises a group IV metal and the dopant is an oxide of one of an alkaline metal and an alkaline earth metal. According to another embodiment the metal silicate comprises a group III metal.

Abstract: A logic element includes memory elements, multiplexers, and controls. The multiplexers are arranged in levels including a highest level of multiplexers with inputs connected to the memory elements and outputs connected to inputs of a next-to-highest level of multiplexers and a first level of multiplexers with inputs connected to outputs of a second level of multiplexers and at least one output. The controls are connected to the multiplexers. In a first operational mode the controls determine a first-mode output at the at least one output of the first level of multiplexers, and in a second operational mode the controls determine a plurality of second-mode outputs at selected outputs of multiplexers not at the first level of multiplexers.

Abstract: A computing device having an improved enclosure arrangement is disclosed. One aspect of the enclosure pertains to enclosure parts that are structurally bonded together to form a singular composite structure. In one embodiment, structural glue is used to bond at least two unique parts together. Another aspect of the enclosure pertains to enclosure parts that are electrically bonded together to form a singular integrated conductive member. In one embodiment, conductive paste is used to bond at least two unique parts together. The improved enclosure is particularly useful in portable computing devices such as laptop computers.

Abstract: A dual damascene interconnect structure is formed by patterning a first dielectric to form a metal line. A second dielectric is disposed on the first dielectric and patterned to form a via. The first metal line is patterned in a configuration relative to a via landing so that a cavity is formed when the via etch into the second dielectric is extended into the first dielectric. The cavity is filled with a conductive metal in an integral manner with the formation of the via to form a via projection for improved electrical contact between the via and the metal line.

Abstract: An electronic system for selectively detecting and identifying a plurality of chemical species, which comprises an array of nanostructure sensing devices, is disclosed. Within the array, there are at least two different selectivities for sensing among the nanostructure sensing devices. Methods for fabricating the electronic system are also disclosed. The methods involve modifying nanostructures within the devices to have different selectivity for sensing chemical species. Modification can involve chemical, electrochemical, and self-limiting point defect reactions. Reactants for these reactions can be supplied using a bath method or a chemical jet method. Methods for using the arrays of nanostructure sensing devices to detect and identify a plurality of chemical species are also provided.

Abstract: A gaming apparatus is disclosed that includes a housing, a value input device, a transparent panel having an outer surface and an inner surface, and a plurality of mechanically rotatable slot reels disposed in the housing so that the mechanically rotatable reels are visible to a player through the transparent panel. The gaming apparatus also having a light valve that includes a suspended particle device disposed between the inner surface and the slot reels, and a controller coupled to the light valve to cause the light valve to become opaque to substantially block the view of the slot reels to the player.

Abstract: A solar cell or solar module is measured during a short pulse of light in such a way that the resulting data for current and voltage at each light intensity is the same as would be measured under steady-state illumination conditions and therefore predictive of the actual performance of the solar cell or solar module in sunlight. A varying voltage is applied to the terminals of the solar cell during a light pulse so that the instantaneous current at a given voltage and light intensity during the light pulse is the same as would be measured under constant illumination at that same given intensity. A constant voltage is modified by a small signal correction that is proportional to the terminal current. Or, the small signal correction is proportional to the light intensity. An analog feedback circuit is constructed using the terminal current or light intensity for feedback in order to provide the requisite varying voltage. The varying voltage may also be supplied by digital synthesis.

Abstract: Improved approaches to stacking integrated circuit chips within an integrated circuit package are disclosed. The improved approaches enable increased integrated circuit density within integrated circuit packages, yet the resulting integrated circuit packages are thin or low profile. These improved approaches are particularly useful for stacking same size (and often same function) integrated circuit chips with integrated circuit packages. One example of such an integrated circuit package is a non-volatile memory integrated circuit package that contains multiple, like-sized memory storage integrated circuit chips stacked on one or both sides of a leadframe.

Abstract: A feature in a layer is provided. A photoresist layer is formed over the layer. The photoresist layer is patterned to form photoresist features with photoresist sidewalls, where the photoresist features have a first critical dimension. A fluorine-containing conformal layer is deposited over the sidewalls of the photoresist features to reduce the critical dimensions of the photoresist features. Fluorine is removed from the conformal layer, while the remaining conformal layer is left in place. Features are etched into the layer, wherein the layer features have a second critical dimension, which is less than the first critical dimension.

Abstract: A data storage device is provided. A disk device is combined with a non-volatile memory device to provide much shorter write access time and much higher data write speed than can be achieved with a disk device alone. Interleaving bursts of sector writes between the two storage devices can effectively eliminate the effect of the seek time of the disk device. Following a non-contiguous logical address transition from a host system, the storage controller can perform a look-ahead seek operation on the disk device, while writing current data to the non-volatile memory device. Such a system can exploit the inherently faster write access characteristics of a non-volatile memory device, eliminating the dead time normally caused by the disk seek time.

Abstract: On a production line for component mounting substrate, mutually communicating inspection apparatus are each provided to a different one of production processes that are carried out sequentially such as the solder printing, component mounting and soldering processes. Each inspection apparatus can generate an X-ray transmission image of the substrate. Each inspection apparatus on the downstream side inputs an image from another inspection apparatus on the upstream side and generates a differential image of the inputted image and an X-ray transmission image of the same substrate generated by itself after the production process associated with itself is carried out. The differential image thus generated is used for inspecting the substrate such that the effect of the associated production process can be more accurately inspected.

Abstract: A package substrate is provided with a side/edge-mounted decoupling capacitor that can provide substantially instant power or control simultaneous switching noise (SSN) associated with a semiconductor device package. A fabrication method for such a package substrate is also provided. Further, a semiconductor device package that includes such a package substrate is provided. According to various embodiments, the decoupling capacitor is connected to edges or sides of a power plane and a ground plane in the package substrate for connection via the semiconductor device package's power delivery system to a power source or component.