Abstract: Methods and apparatus for registering a mobile device such as a mobile node or mobile router with a Home Agent in an asymmetric link environment. A Foreign Agent associates each of one or more interfaces of the Foreign Agent with a different care-of address. An agent advertisement including the care-of address for the one or more interfaces of the Foreign Agent is then sent via one or more uplinks. A registration request is received via a downlink router. The registration request identifies a care-of address associated with one of the one or more interfaces of the Foreign Agent. One of the interfaces identified by the care-of address is ascertained, thereby identifying the interface to which the mobile device has roamed. The registration request is forwarded to the Home Agent. A registration reply is received from the Home Agent. The registration reply is then forwarded to the mobile device via the ascertained interface.

Abstract: A gaming system is disclosed. The gaming system includes at least two gaming components. Each gaming component includes a controller and a communications interface. The gaming system also includes a communication link to allow the controllers of the gaming components to communicate with other controllers of other gaming components on a peer-to-peer basis through the communication interfaces.

Abstract: A transparent pad having a polishing surface with an average surface roughness of 5 ?m or less is used as a polishing pad. An indentation is formed on the back surface of the transparent pad such that its rate of light transmission is locally changed. The transparent pad has a rate of light transmission equal to or greater than 10% or preferably 30% for light of at least one wavelength in the range of 350 nm–900 nm.

Abstract: A device for measuring thickness of an object has a vibration generator for generating vibrations in the object, a vibration detector for detecting vibrations generated in the object by the vibration generator and a frequency analyzer for calculating resonance frequency of the object. The vibration generator includes a light-emitting part which emits light towards the object to irradiate and to be absorbed by the object. A plurality of vibration detectors may be used and the frequency analyzer may include a sound speed analyzer for calculating speed of sound inside the object from vibrations detected by these plurality of vibration detectors.

Abstract: A fluid-filled vibration damping device including: a rubber elastic body elastically connecting a first and second mounting member and partially defining a pressure-receiving chamber filled with a non-compressible fluid; a flexible layer partially defining an equilibrium chamber filled with the non-compressible fluid; an orifice passage permitting a fluid communication between the pressure-receiving chamber and equilibrium chamber; and a cushion surface situated opposite to an opening of the orifice passage to the pressure-receiving chamber in a first direction of flow of the fluid into and out of the opening, with a predetermined distance therebetween, while extending in a second direction approximately perpendicular to the first direction.

Abstract: Methods and apparatus are provided for harnessing the effects of process variations in a semiconductor device. In one example, implementing an electronic design based on collected performance parameters is provided. In general, a core is segmented into multiple core regions. A performance parameter can be collected from each of the core regions. The performance parameter can be collected with a performance measuring mechanism associated with the core region. The performance parameter can be correlated to the performance requirements of an electronic device portion, and the electronic design portion can be implemented in a core region that has a performance parameter matched to the needs of the electronic design portion. In this way, process variation effects are harnessed by optimizing the implementation of the electronic design in regions of the semiconductor device best suited the needs of each electronic design portion. Therefore, performance/power optimization of the semiconductor device can be realized.

Abstract: Methods and apparatus are described for distributing gaming applications to a plurality of gaming sites located in a plurality of regulatory regions via a wide area network. Each regulatory region has a regulatory scheme associated therewith. A plurality of gaming applications are stored on at least one central server. A subset of the gaming applications are distributed from the at least one central server to at least one of the gaming sites located in one of regulatory regions via the wide area network, the subset of gaming applications being determined according to the associated regulatory scheme.

Abstract: Methods for forming a diffusion barrier on low aspect features of an integrated circuit include at least three operations. The first operation deposits a barrier material and simultaneously etches a portion of an underlying metal at the bottoms of recessed features of the integrated circuit. The second operation deposits barrier material to provide some minimal coverage over the bottoms of the recessed features. The third operation deposits a metal conductive layer. Controlled etching is used to selectively remove barrier material from the bottom of the recessed features, either completely or partially, thus reducing the resistance of subsequently formed metal interconnects.

Abstract: A direct current detection circuit has a zero-phase current transformer with source lines inserted therethrough for detecting current differences among them and generates a comparison voltage value based on a divided voltage value obtained between the zero-phase current transformer and a voltage divider resistor according to a change in the self-impedance of the zero-phase current transformer. An offset current is passed through the zero-phase current transformer to make it possible to detect on the basis of the comparison voltage value a direct current value in a range which is otherwise difficult to detect accurately on the basis of the comparison voltage value because of influence of hysteresis characteristic of the zero-phase current transformer. A control circuit detects a present direct current value based on the comparison voltage value and the value of the offset current.

Abstract: A macroscopic fluorescence illumination assembly is provided for use with an a imaging apparatus with a light-tight imaging compartment. The imaging apparatus includes an interior wall defining a view port extending into the imaging compartment to enable viewing of a specimen contained therein. The illumination assembly includes a specimen support surface sized and dimensioned for receipt in the imaging compartment, and oriented to face toward the view port of the imaging apparatus. The support surface is substantially opaque and defines a window portion that enables the passage of light there through. The window portion is selectively sized and dimensioned such that the specimen, when supported atop the support surface, can be positioned and seated over the window portion in a manner forming a light-tight seal substantially there between.

Abstract: Methods of preparing a low-k dielectric material on a substrate are provided. The methods involve using plasma techniques to remove porogen from a precursor layer comprising porogen and a dielectric matrix and to protect the dielectric matrix with a silanol capping agent, resulting in a low-k dielectric matrix. Porogen removal and silanol capping can occur concurrently or sequentially. If performed sequentially, silanol capping is performed without first exposing the dielectric matrix to moisture or ambient conditions.

Abstract: A method of separating signals from water and lipid in a body using spin-echo magnetic resonance imaging comprising steps of acquiring image signals at three acquisition times asymmetrically positioned with respect to a spin-echo time, the three acquisition times being separated by 2?/3 and the middle signal acquisition is centered at ?/2+?k where k is an integer, and combining the plurality of image signals iterative using a least squares decomposition method.

Abstract: An image processing system to be mounted to a vehicle includes a radar adapted to measure distance and direction to an object based on reflected electromagnetic waves which are outputted to scan the exterior of the vehicle, an image-taking device such as a camera for obtaining an image, and an image processor for carrying out image processing on a specified image processing area in an image obtained by the image-taking device. The image processor is adapted to determine a center position of the image processing area according to a measurement point of an object detected by the radar and the size of the image processing area according to a beam profile of electromagnetic waves outputted from the radar.

Abstract: A carrier for use in processing of a plurality of wafers or other substrates includes a support frame on which the wafers are mounted and in one embodiment at least one auxiliary frame for holding the substrates on the support frame. A plurality of clips extend from the auxiliary frame and engage the substrates in pressure engagement, and fasteners retain the auxiliary frame in position with respect to the support frame. In one embodiment two auxiliary frames can be employed for holding wafers on opposing surfaces of the support frame. The support frame has electrically non-conducting surfaces whereby the processing does not affect the support frame, and the auxiliary frame is made of electrically non-conductive material. The clips are electrically conductive and bridge current from the support frame to the wafers during plating operations. In another embodiment, auxiliary frame are not used and the wafer retention clips are mounted on the support frame.

Abstract: Disclosed is a method for non-destructive removal of cured epoxy from a wafer backside. A wafer back-coated with epoxy is soaked in an acetone bath for a period of time, allowing degradation of the epoxy coating adhesion strength. The epoxy coating is then peeled or scraped away, leaving the wafer backside ready for a rework or for a reapplication of a new epoxy coating.