Abstract: A method for the deposition of a silicon dioxide film onto a substrate using plasma enhanced chemical vapor deposition and TEOS is disclosed. The method includes controlling the deposition rate of silicon dioxide on a substrate by pulsing the radio frequency power supply used to generate a TEOS oxide plasma. The obtained silicon dioxide film is good in electrical and mechanical film properties for the application of forming thin film transistors.
Type:
Grant
Filed:
April 6, 2000
Date of Patent:
September 17, 2002
Assignee:
Applied Materials, Inc.
Inventors:
Haruhiro H. Goto, Takako Takehara, Carl A. Sorensen, William R. Harshbarger, Kam S. Law