Patents Represented by Attorney Blake Biederman
  • Patent number: 6936541
    Abstract: A method for planarizing metal interconnects of a semiconductor wafer includes the steps of polishing the semiconductor wafer with a polishing solution and a polishing pad to planarize the metal interconnects. The polishing solution has by weight percent, 0.15 to 5 benzotriazole, 0 to 1 abrasive, 0 to 10 polymeric particles, 0 to 5 polymer-coated particles and balance water at a pH of less than 5 and a removal rate-pressure sensitivity (dr/dp) of at least 750 (?/min/psi). The polishing simultaneously accelerates removal of projecting metal from the metal interconnects with the polishing pad providing a first pressure that increases removal rate of the projecting metal; and it inhibits removal of recessed metal from the metal interconnects with the polishing pad providing a second pressure that decreases removal of the recessed metal.
    Type: Grant
    Filed: March 28, 2003
    Date of Patent: August 30, 2005
    Assignee: Rohn and Haas Electronic Materials CMP Holdings, Inc.
    Inventors: Jinru Bian, Tirthankar Ghosh, Terence M. Thomas