Abstract: A method and device for local delivery of water-soluble or water-insoluble therapeutic agents to the surface of a normal or diseased body lumen is disclosed. An expandable structure of a medical disposable device, such as a balloon of a balloon catheter, is coated with an amphiphilic polymer coating comprising a therapeutic agent and an amphiphilic polymer or co-polymer. The medical disposable device is inserted into a body lumen, and expanded to contact the amphiphilic polymer coating against the body lumen. The total solubility of the polymer or co-polymer in vivo prevents any embolic hazard associated with the amphiphilic polymer coating.

Abstract: According to one embodiment, an electronic apparatus extracts face images of persons from video content data and outputs timestamp information indicating time points at which each extracted face image appears in the video content data, and displays face images in each column of a plurality of face image display areas arranged in a matrix based on the time stamp information. The apparatus detects presence or absence of a face area in each frame consisting of the video content data and decides a cutout range of the detected face area. And, the apparatus adjusts a case in which the cutout range of the decided face area protrudes outside the frame.

Abstract: Systems and methods for message endpoint activation are disclosed. Under an embodiment of the invention, a method includes identifying an active resource adapter for a server; identifying a message listener type that is supported by the active computer resource adapter; establishing a message subscription to provide messages from a message provider to a server component, a subscription request from the server component comprising the active resource adapter and the supported message listener type; and transferring messages from the message provider to a message listener component for the server component utilizing the active resource adapter.

Abstract: A disk drive having a connection-blocking device for use with a Serial Advanced Technology Attachment (SATA) power receptacle. The disk drive has a moveable head for writing and reading to and from a disk, a printed circuit board assembly (PCBA) for controlling operations in the disk drive, a Serial Advanced Technology Attachment (SATA) section attached to the PCBA having a SATA power receptacle and a SATA data receptacle, a legacy Integrated Drive Electronics (IDE) power receptacle attached to the PCBA, and a connection-blocking device. The legacy IDE power receptacle is electrically common with the SATA power receptacle. The connection-blocking device is attachable to either one of the SATA power receptacle or the legacy IDE power receptacle, respectively, to prevent redundant power connections within the disk drive.

Abstract: A circuit to detect predetermined power supply levels so that sufficient power is provided for an integrated circuit to function properly and drive a bus. A first circuit indicates whether a first voltage has reached a first level, a second circuit indicates whether a second voltage has reached a second level, and a third circuit causes the second circuit to operate in a low power mode when the second voltage has reached a predetermined level. The first voltage is provided by an I/O power supply and the second voltage is provided by a core power supply.

Abstract: A method and apparatus for removing particles and residue that build up inside a substrate processing system during a substrate processing operation, without overetching system components, is described. One method includes the steps of: flowing an etchant gas comprising chlorine trifluoride (ClF.sub.3), diluted with an inert carrier gas, into a processing chamber after completion of the substrate processing operation. The parts of the system within the chamber with the greatest amount of build-up are preferentially heated to facilitate more extensive cleaning of those parts. Parts of the system within the chamber with less build up are protected from overetching by keeping them about 200.degree. C. cooler than the heavily-deposited parts. Heating the heavily-deposited chamber parts to a temperature of at least about 400.degree. C. allows using a lower concentration of etchant gas for the cleaning process than a lower temperature process would allow.