Abstract: Mold dumping apparatus. Means are provided for dumping excess slip from a mold after desired wall thickness of greenware is obtained. Clamp structure is arranged on a first pair of uprights which latter are both vertically and pivotally movable on a pivot axis with respect to a second pair of uprights. Said second pair of uprights are supported rigidly on a base. The mold is received within said clamp structure and the mechanism operated to lift the first pair of uprights upwardly with respect to the second pair thereof. As same reaches a substantially predeterminable point near but above the point of the above-mentioned pivot axis, same becomes overbalanced and will automatically tip and dump the excess slip out from the mold. Any suitable receptacle may be provided for receiving said slip as it flows out of the mold.