Patents Represented by Attorney Brain P. Verminski
  • Patent number: 7335599
    Abstract: A semiconductor processing method includes providing a substrate, forming a plurality of semiconductor layers in the substrate, each of the semiconductor layers being distinct and selected from different groups of semiconductor element types. The semiconductor layers include a first, second, and third semiconductor layers. The method further includes forming a plurality of lateral void gap isolation regions for isolating portions of each of the semiconductor layers from portions of the other semiconductor layers.
    Type: Grant
    Filed: October 19, 2005
    Date of Patent: February 26, 2008
    Assignee: International Business Machines Corporation
    Inventors: Howard Hao Chen, Louis Lu-Chen Hsu, Jack Allan Mandelman