Abstract: A Test Adapter for actively testing chip package such as a ball grid array in operation with a printed circuit board are disclosed. The test adapter provides accessible test points for monitoring input and output signals of an operating chip package. The adapter includes an interface adapter board having a plurality of contact pads disposed on its surface, in a pattern corresponding to the footprint of the chip package. A plurality of contact terminals protrude from the bottom of the interface adapter board and are connected to the contact pads on the upper surface, and are configured to engage a receiving socket mounted to a printed circuit board. A plurality of test pins are also connected to the contact pins such that test probes can be connected to the test pins and the input/output signals associated with the chip package can be monitored by the probes.