Patents Represented by Attorney Brooks, Cameron & Huesbch, PLLC

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  • Wafer processing including forming trench rows and columns at least one of which has a different width
    Patent number: 7897485
    Abstract: Methods for processing semiconductor wafers are described herein. One embodiment includes removing portions of a first side of the semiconductor wafer to form a number of trenches of a particular depth in rows and columns. The method further includes forming a passivation layer on side walls of the number of trenches. The method also includes cutting a second side of the semiconductor wafer in rows and columns aligned with the number of trenches such that the semiconductor wafer singulates into a number of dice.
    Type: Grant
    Filed: July 16, 2009
    Date of Patent: March 1, 2011
    Assignee: Micron Technology, Inc.
    Inventor: Kunal R. Parekh