Abstract: Storage-stable thermosetting compositions, well adopted for molding or the production of prepregs, and characterized by the absense of gas release upon crosslinking, are comprised of (A) an imido/hydroxylated organosilicon compound prepolymer, (B) triallyl isocyanurate or an acrylic ester of an ethoxyphenylated siloxane, and (C) an imidazole compound.