Abstract: A coaxial connector for connecting a coaxial member to a mating component includes a front body, a rear body, a center conductor, and a nut. The nut surrounds the front body and is locked against rotation relative to the front body; however, the nut can slide axially relative to the front body. A first end of the front body has a threaded surface for engaging a mating threaded component. The rear body includes a central bore coaxial with the longitudinal axis of the front body. A first end of the rear body surrounds the second end of the front body and is rotatably and slidably secured thereto, as by a retaining ring, between retracted and extended positions. The second end of the rear body is adapted to engage a coaxial member, e.g., the end of a coaxial cable. The center conductor is supported within the central bore of the front body by a supporting insulator to electrically and mechanically couple a center conductor of the coaxial member to a center conductor of the aforementioned mating component.

Abstract: A capacitive vacuum measuring cell includes first and second ceramic housing bodies (1, 4) joined by an edge seal (3). A thin ceramic membrane (2) is supported between first and second housing bodies (1, 4) by the edge seal (3) at a small distance from the first housing body (1) creating a reference vacuum chamber (25) therebetween. An electrically conductive material (7) coats opposing surfaces of the first housing body (1) and the membrane (2) to form a capacitor. A measurement vacuum chamber (26) is provided between the membrane (2) and the second housing body (4). A port (5) communicates with the second housing body (4) to connect the measurement vacuum chamber (26) of the measuring cell to the medium to be measured. The membrane (2) is made from an Al2O3 slurry that is sintered in a first heating step, cooled, and then reheated to smooth the membrane.

Abstract: A method of forming a polymer support ring, or collar, around the base of solder balls used to form solder joints includes forming patterned regions of uncured polymer material over each of the conductive solder bump pads on an IC package or other substrate to which the solder balls are to be attached. Preferably, the uncured polymer material is a no-flow underfill material that fluxes the solder bump pads. Pre-formed solder balls are then placed into the uncured polymer material onto their respective solder bump pads. A subsequent heating cycle raises the assembly to the reflow temperature of the solder balls, thereby attaching the solder balls to the underlying solder bump pads, and at least partially curing the polymer material to form a support collar at the base region of each attached solder ball.

Abstract: An apparatus for assisting the loading of a plurality of wafer boats into a multi-level wafer boat loading system (1) includes a vertical elevator mechanism (10) attached to the wafer boat loading system (1). A vertically movable horizontal wafer boat platform (18B) is attached to a vertically movable carriage (31) included in the elevator mechanism and vertically movable along a linear track (30) therein. A control system (25) associated with the vertical elevator mechanism includes a processor for executing a stored program which stores information representing a plurality of elevation levels the plurality of cantilever paddles (5), respectively, and which responds to a selection signal corresponding to manual selection of one of the elevator levels to control a drive mechanism (22,27) which moves the wafer boat support platform (18B) from an initial position to the selected elevator level.

Abstract: A method of creating an undercut sidewall profile within an opening formed in a positive resist layer disposed upon a transparent substrate includes the step of forming a positive resist layer on the upper surface of the substrate, and optically patterning the resist layer by selectively directing light at the resist layer from above the upper surface of the substrate. The lower surface of the substrate is flooded with light to partially expose the lowermost region of the resist layer, and the exposed resist is dissolved to form patterned openings therein. The resulting sidewalls of the patterned resist openings have an enlarged width adjacent the upper surface of the substrate. The sidewalls of the resist layer are then flooded with light from above the substrate, the upper region of the resist layer is cured by an electron beam, and the resist layer is developed a second time to dissolve exposed portions of the resist sidewalls, thereby forming an undercut resist sidewall profile.

Abstract: A disposable, expandable/collapsible medication inhalation apparatus for use with an MDI inhaler includes an elongated housing for receiving a plume of medication particles ejected by the MDI inhaler, a mouthpiece, and an inhalation valve disposed between the mouthpiece and the housing. A pair of foldable side sections are pressed together to expand the apparatus. An exhalation port in the mouthpiece allows exhalation through the mouthpiece. A collapsible boot adapter receives a mouthpiece of the MDI inhaler. The inhalation apparatus is constructed from a single sheet of foldable sheet material.

Abstract: A portable dog-training transmitter unit for controlling remote collar-mounted receiver/stimulus units includes first, second, and third switches for causing corresponding transmitted stimulus control signals to be recognized by corresponding first, second, or third receiver/stimulus units. A multiple-position switch sets the use of transmitted codes that control the amplitudes of stimulus signals produced by the recognizing receiver/stimulus unit. The transmitter unit is supported in a holster that is pivotally supported by a belt clip through the use of a pivot pin that is pivotally retained in a receiving slot of the belt clip. The transmitter unit includes a controller which polls the states of the various switches to produce a digital signal that is shaped by a buffer circuit, FM modulated, preamplified, and coupled by a simplified matching network to the input of a power amplifier. A single pi matching network is coupled to match an output of the power amplifier to an antenna of the transmitter unit.

Abstract: A distribution valve includes a fluid inlet port and a plurality of fluid outlet ports, wherein the distribution valve includes a housing including a fluid inlet (3). The housing includes an upper section (15B) and a lower section (15B). A gear reduction assembly (2) located in the housing includes a gear reduction mechanism (2A) and impeller (2B) located near the inlet port and connected to a rotary input shaft of the gear reduction mechanism (2A). A cam device (6) engages a rotary output shaft of the gear reduction mechanism so as to rotate the cam device in response to rotation of the impeller. The cam device (6) includes a raised section (6A having their own a raised camming surface (6B) which rotates in response to rotation of an impeller of the impeller (2B). A plurality of valve assemblies disposed in the lower section (15A) are arranged to open or close fluid paths through the plurality of fluid outlet ports (4), respectively, in response to rotation of the camming surface (6B).

Abstract: An apparatus for automatically and simultaneously loading/unloading a plurality of wafer boats (24) onto/from a cantilever paddle includes a cantilever paddle (47-1) and a carriage (42-1) supporting the cantilever paddle First and second vertical translation mechanisms (34A,B) each include a stationary part (62,63) and a vertically moveable support (61). First and second horizontal translation mechanisms (50A,B) each have a base (86) supported by one of the vertically moveable supports and a horizontally moveable arm (51) supported by the base (86). A horizontal boat support assembly (102) supports the loaded wafer boats and has an end supported by a first horizontally moveable arm (51A) and another end supported by a second horizontally moveable arm (51B).

Abstract: An environmental test chamber provides a fast cool down to a temperature of about −125° F. and a fast heat up of an element under test. The environmental test chamber fast cool down and heat up system comprises: an environmental test chamber having a fast cool down evaporator and fast heat up condenser coil, wherein the coil is selectively coupled either to receive a hot refrigerant gas flow or to receive a sub-cooled refrigerant flow; a cascade condenser coupled to the environmental test chamber; a primary stage sub-system coupled to the cascade condenser; a secondary stage sub-system coupled to the cascade condenser; and a thermal storage unit coupled to the primary stage sub-system and to the secondary stage sub-system. Wherein the environmental test chamber has an operational temperature down to about −125° F.