Abstract: A central route table design in a fiber channel switch for providing one location for D_ID and exit port combinations. The fiber channel switch has a plurality of ports, each are coupled to the central route look-up table.

Abstract: The present invention relates a Pulse Width Modulation (PWM)/linear driver for an electromagnetic load by a bridge circuit of the type having a signal input and a signal output and at least two conduction control inputs for driving a voice coil motor in a linear mode and in a pulse width modulation. The bridge circuit is driven by a PWM converter coupled to one of said two control inputs and by a linear amplifier coupled to the other of said two control inputs.

Abstract: An enhanced bus turnaround integrated circuit dynamic random access memory (“DRAM”) device of particular utility in providing maximum DRAM performance while concomitantly affording a device with may be readily integrated into systems designed to use zero bus turnaround (“ZBT”), or pipeline burst static random access memory (“SRAM”) devices. The enhanced bus turnaround DRAM device of the present invention provides much of the same benefits of a conventional ZBT SRAM device with a similar pin-out, timing and function set while also providing improvements in device density, power consumption and cost approaching that of straight DRAM memory.

Abstract: A multi-layer ferroelectric thin film includes a nucleation layer, a bulk layer, and an optional cap layer. A thin nucleation layer of a specific composition is implemented on a bottom electrode to optimize ferroelectric crystal orientation and is markedly different from the composition required in the bulk of a ferroelectric film. The bulk film utilizes the established nucleation layer as a foundation for its crystalline growth. A multi-step deposition process is implemented to achieve a desired composition profile. This method also allows for an optional third composition adjustment near the upper surface of the film to ensure compatibility with an upper electrode interface and to compensate for interactions resulting from subsequent processing.

Abstract: A memory cell layout for use in a 1T/1C ferroelectric memory array includes an access transistor having a gate coupled to a word line and a current path coupled between a bit line and an internal cell node, a shunt word line extending across the memory cell that is electrically isolated from the word line and the access transistor within the physical boundary of the memory cell, and a ferroelectric capacitor coupled between the internal cell node and a plate line.

Abstract: A continuous barrier layer is formed after a local interconnect metal layer is formed between the top electrode of a ferroelectric capacitor and the source/drain contact of a memory cell transistor in an integrated ferroelectric memory. After contact has been made to the top electrode of the ferroelectric capacitor, a thin dielectric layer is deposited using a material that provides an effective hydrogen barrier to the ferroelectric capacitor. The barrier layer minimizes damage to the ferroelectric capacitor and thus improves electrical performance.

Abstract: Ferroelectric switching properties are severely degraded in a hydrogen ambient atmosphere. By controlling the polarity of the capacitors in a ferroelectric memory during the manufacturing process, the amount of degradation can be significantly reduced. After metalization of a ferroelectric memory wafer, all of the ferroelectric capacitors are poled in the same direction. The polarization vector is in a direction that helps to counteract hydrogen damage. A hydrogen gas anneal is subsequently performed to control underlying CMOS structures while maintaining ferroelectric electrical properties. The wafer is then passivated and tested.

Abstract: A plastic package assembly method suitable for ferroelectric-based integrated circuits includes a strict thermal budget that reduces the time at temperature for four key processing steps: die attach cures, die coat cures, molding cures, and marking cures. The plastic package assembly method uses low temperature mold and die coat materials, as well as low temperature curable inks or laser marking in order to minimize degradation of electrical performance, thus improving yields and reliability. The assembly method uses a snap cure die attach step, a die coat followed by a room temperature cure, and formation of the plastic package with room temperature curable molding compounds not requiring a post mold cure. Front and back marking of the plastic package is accomplished using either an infrared or ultraviolet curable ink followed by minimum cure time at elevated temperature, or by using laser marking.

Abstract: A ferroelectric capacitor includes a bottom electrode, a top electrode, an a ferroelectric layer located between the top and bottom electrodes that extends to completely encapsulate the top electrode, except for a contact hole to allow metalization of the top electrode. The total encapsulation of the top electrode reduces the sensitivity of the ferroelectric capacitor to hydrogen and thus improves electrical switching performance. The encapsulation technique can also be used to improve the performance of ferroelectric transistors and other devices.

Abstract: A non-volatile ferroelectric latch includes a sense amplifier having at least one input/output coupled to a bit-line node, a ferroelectric storage capacitor coupled between a plate-line node and the bit-line node, and a load element coupled to the bit-line node. The sense amplifier further includes a second input/output coupled to a second bit-line node and the latch further includes a second ferroelectric storage capacitor coupled between a second plate-line node and the second bit-sine node, and a second load element coupled to the second bit-line node. The load element includes a dynamic, switched ferroelectric capacitor a static, nonswitched ferroelectric capacitor, a linear capacitor, or even a resistive load.

Abstract: An RC equivalent delay circuit includes an input node, an output node, a feedback node, and an intermediate node; a first inverter having an input coupled to the input node and an output coupled to the intermediate node; a second inverter having an input coupled to the intermediate node and an output coupled to the feedback node; a third inverter having an input coupled to the feedback node and an output coupled to the output node; and one or two switches having a first input coupled to the input node, a second input coupled to the feedback node, and an output coupled to the intermediate node.

Abstract: A multi-layer ferroelectric thin film includes a nucleation layer, a bulk layer, and an optional cap layer. A thin nucleation layer of a specific composition is implemented on a bottom electrode to optimize ferroelectric crystal orientation and is markedly different from the composition required in the bulk of a ferroelectric film. The bulk film utilizes the established nucleation layer as a foundation for its crystalline growth. A multi-step deposition process is implemented to achieve a desired composition profile. This method also allows for an optional third composition adjustment near the upper surface of the film to ensure compatibility with an upper electrode interface and to compensate for interactions resulting from subsequent processing.

Abstract: A memory cell layout for use in a 1T/1C ferroelectric memory array includes an access transistor having a gate coupled to a word line and a current path coupled between a bit line and an internal cell node, a shunt word line extending across the memory cell that is electrically isolated from the word line and the access transistor within the physical boundary of the memory cell, and a ferroelectric capacitor coupled between the internal cell node and a plate line.

Abstract: A method of driving a sense amplifier having at least one input/output node and at least one latch node the method includes the steps of initially setting the latch node to a first logic state such that the sense amplifier is disabled, adjusting the latch node voltage in one or more discrete levels, and finally setting the latch node to a second logic state such that the sense amplifier is enabled.

Abstract: A reference cell layout for use in a 1T/1C ferroelectric memory array includes a transistor of a first polarity type having a gate coupled to a reference word line and a current path coupled between a bit line and an internal cell node, a transistor of a second polarity type having a gate coupled to a pre-charge line and a current path coupled between a source of power supply voltage and the internal cell node, a shunt reference word line extending across the reference cell that is electrically isolated from the reference word line, the pre-charge line and the transistors within the physical boundary of the memory cell, and a ferroelectric capacitor coupled between the internal cell node and a reference plate line.

Abstract: A method of driving a selected plate line segment in a 1T/1C memory, the method including the steps of logically combining an odd word line signal and an even word line signal to form a first logic signal, logically combining the first logic signal with a plate clock signal to form a second logic signal, latching the second logic signal, and driving the selected plate line segment with the latched second logic signal.

Abstract: A sense amplifier cell layout for use in a 1T/1C ferroelectric memory array includes a first sense amplifier having two input/output nodes for receiving a first bit line signal and a first inverted bit line signal and a second sense amplifier having two input/output nodes for receiving a second bit line signal and a second inverted bit line signal, wherein the combined width of the first and second sense amplifiers is substantially the same as the width of two columns of 1T/1C memory cells used in the array.

Abstract: A method and apparatus for use in computer systems utilizes a memory chip employing multiple distributed SRAM caches directly linked to a single DRAM main memory block. Each cache is directly linked to a different bus. Each chip further contains a partially distributed arbitration and control circuit for implementing cache policy and arbitrating memory refresh cycles.