Abstract: This invention combines the precision spray process with in-flight laser treatment in order to produce direct write electronic components. In addition to these components, the process can lay down lines of conductive, inductive, and resistive materials. This development has the potential to change the approach to electronics packaging. This process is revolutionary in that components can be directly produced on small structures, thus removing the need for printed circuit boards.
Type:
Grant
Filed:
May 5, 1999
Date of Patent:
June 26, 2001
Assignee:
Optomec Design Company
Inventors:
W. Doyle Miller, David M. Keicher, Marcelino Essien