Abstract: The present invention includes a package for housing an integrated circuit device. The present invention also includes leadframes and methods for making such packages. In one embodiment, the package includes an integrated circuit device on a metal die pad. A metal ring is between the die pad and leads and surrounds the die pad. The ring is connected to the die pad by a nonconductive adhesive tape. Encapsulant material covers the entire structure, except for portions of the leads. The ring is electrically connected to a lead identified for connection to an external power voltage supply. The ring in turn is electrically connected to a power voltage input pad on the integrated circuit device. The potential of the die pad may float, or the die pad may be electrically connected through a lead to an external ground voltage. The package is made from a leadframe that has a die pad, a metal ring between the die pad and radiating leads, and a nonconductive adhesive tape that connects the ring to the die pad.
Type:
Grant
Filed:
June 13, 2000
Date of Patent:
January 15, 2002
Assignees:
Amkor Technology, Inc., Anam Semiconductor Inc.
Inventors:
Eulogia A. Niones, Nhun Thun Kham, Ludovico Bancod, Yeon Ho Choi, Sean T. Crowley