Patents Represented by Attorney Charles Bergene

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  • Method and apparatus for molding substrate
    Patent number: 8062424
    Abstract: A method for encapsulating a substrate includes placing a hardened encapsulant material in a container. The encapsulant material is then heated and stirred until it is in a liquid or gel state. The liquid encapsulant material is held in the container in a vacuum state and dispensed over semiconductor dies along a guide, which allows the liquid encapsulant material to cool slightly before it covers a die.
    Type: Grant
    Filed: November 13, 2009
    Date of Patent: November 22, 2011
    Assignee: Freescale Semiconductor, Inc.
    Inventors: Vermal Raja Manikam, Boon Yew Low, Vittal Raja Manikam