Patents Represented by Attorney Charles S. Neave
  • Patent number: 3999004
    Abstract: This is a microelectronic multilayer circuit structure having circuit compatibility encapsulated within the circuit package including conductive electrical interconnection means formed by uniquely metallizing the "via" and/or blind interconnection holes within the circuit package. The assembly process provides means of uniformly metallizing the interlayer connecting holes.
    Type: Grant
    Filed: September 27, 1974
    Date of Patent: December 21, 1976
    Assignee: International Business Machines Corporation
    Inventors: Octavio I. Chirino, Joseph Hromek, Kailash C. Joshi, George C. Phillips, Jr.
  • Patent number: D254151
    Type: Grant
    Filed: October 31, 1977
    Date of Patent: February 5, 1980
    Inventor: Henry Wolff