Abstract: A printer and a process for correlating printed subject matter with subject matter that is meant to be printed by a printer with a printing mechanism or print engine such as a thermal printer including a print head, a platen, a media upon which labels are printed and a printer controller for imparting print data to the print head. An imager sends printed data as imaged to a read after print (RAP) controller for comparing the data received from the imager to data imparted to the print head or other printing mechanism. A tap, taps the data imparted from the print head and correlates it with the imaged data to determine the media speed, the image alignment, label analysis, weighing of blemishes, the gaps printed on a label, and other criteria.

Abstract: The present invention provides a method to improve adhesion of barrier, metal, dielectric interfaces. In the process flow, a first barrier material is formed on a dielectric layer and bombarded with a plasma to effectively push the barrier material into the dielectric interface while leaving a portion of the barrier material over the dielectric. A second barrier material, which may or may not be the same as the first barrier material, is then formed on the remaining first barrier material. Advantageously, the method of the present invention allows the barrier material to be pushed into the dielectric to insure excellent adhesion, which prevents chemical mechanical polishing delamination. Furthermore, the presence of the first barrier material on the sidewalls of via apertures through the dielectric can prevent Cu poisoning from sputtered Cu or CxOy.

Abstract: Systems and methods provide common mode termination for input/output circuits. For example, common mode termination may be provided to a bank of input/output circuits by programmably coupling a bus to each pair of input/output circuits. The bus provides a path to ground for common mode signals through a capacitor or, alternatively, the bus may be designed to provide or assist in providing the necessary capacitance.