Patents Represented by Attorney Chris A. Caseiro, Esq.

Find this attorney in the Justia Lawyer Directory

  • Die attach method and integrated circuit device
    Patent number: 5904504
    Abstract: Die attach methods are provided. These methods include (a) providing a supply of die attach adhesive, (b) applying a portion of the die attach adhesive to a transfer member, and (c) contacting the lead frame paddle with the transfer member to print a layer of adhesive onto the lead frame paddle. Integrated circuit (IC) devices are also provided.
    Type: Grant
    Filed: February 19, 1998
    Date of Patent: May 18, 1999
    Assignee: Fairchild Semiconductor Corp.
    Inventor: Howard Allen