Patents Represented by Attorney Christopher Hayden
  • Patent number: 8163049
    Abstract: A chemical-mechanical planarization composition containing surface-modified abrasive particles such as silica where at least a portion of the surface of the particles has bound thereto a surface-modifying aluminum-containing stabilizer and fluoride that is used to polish semiconductor substrates. The use of a CMP slurry containing surface-modifying aluminum-containing stabilizer and fluoride bound to a silica abrasive provides high metal polishing rates relative to the removal rate of a dielectric.
    Type: Grant
    Filed: April 6, 2007
    Date of Patent: April 24, 2012
    Assignee: DuPont Air Products Nanomaterials LLC
    Inventor: Junaid Ahmed Siddiqui