Patents Represented by Attorney Chun I. Chiang

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  • Temperature gradient zone melting process employing a buffer layer
    Patent number: 4398974
    Abstract: A process is provided for fabricating a semiconductor device by thermal gradient zone melting, whereby metal-rich droplets such as aluminum migrate through a semiconductor wafer such as silicon to create conductive paths. One surface of the wafer in provided with a buffer layer thereon, which is placed directly on a heating surface. The buffer layer terminates the migration of the droplets to prevent alloying of the droplets with the heating surface.
    Type: Grant
    Filed: April 9, 1982
    Date of Patent: August 16, 1983
    Assignee: Hughes Aircraft Company
    Inventors: Kuen Chow, Jan Grinberg