Abstract: A high speed circuit interconnection apparatus involves an electrical connection assembly between a multilayer printed circuit board (PCB) and a connector for receiving the PCB. The PCB has a plurality of logic signal lines and a plurality of power and ground lines, each of the logic signal lines terminating in a contact tab, the PCB having a contacting edge with power and ground conductors affixed thereto, electrically connected to the power and ground lines. The logic and power and ground lines are positioned to provide a desired transmission line impedance. The connector has a plurality of logic contactors, each firmly contacted by a corresponding contact tab when the PCB is inserted, closing a secondary contact. The secondary contact is made at a point on the logic contactor to minimize the length of each logic signal path made up of the corresponding contact tab and the corresponding contactor.