Abstract: Methods and apparatus for increasing the yield achieved during high density interconnect (HDI) production. In particular, processes in which panels are tested to identify good cells/parts, good cells are removed from the panels, and new panels created entirely of identified/known good cells allow increases in the number of layers used in a HDI without incurring the decrease in yield normally associated with such a layering process.

Abstract: A metal-clad laminate product including a carrier film, a release agent layer, a semi-transparent metal layer and a photo dielectric layer deposited on the conductive metal layer and a method for using the metal-clad laminate product to form an interlayer via by exposing at least a portion of an circuit board intermediate prepared from the metal-clad laminate product to light through the semi-transparent metal layer for a period of time sufficient to form an exposed or an unexposed photo dielectric portion and thereafter removing the exposed or unexposed portion of the photo dielectric layer and a corresponding portion of the semi-transparent metal layer overlying the exposed or unexposed portion of the photo dielectric layer to form an interlayer via.

Abstract: A method of producing a highly stable packaging substrate in which are provided a first precursor having a first backbone and a first ethynyl group, and a second precursor having a second backbone and a second ethynyl group. Furthermore provided is a crosslinker having a first and a second reactive group. The first precursor, the second precursor, the crosslinker, and a solvent are applied onto a surface to form an electrically insulating layer. The first ethynyl group is reacted with the first reactive group in a first carbon-carbon bond formation reaction and the second ethynyl group is reacted with the second reactive group in a second carbon-carbon bond formation reaction to crosslink the first backbone with the second backbone, thereby forming the packaging substrate. The solvent is removed in a further step.

Abstract: The invention pertains to benzocyclobutene resins having flame retardant properties. Such resins have a high glass transition temperature (Tg>250° C.), low moisture absorption, low dielectric constant, good mechanical properties, flame retardancy (meets or exceeds UL94 V-O and/or VTM-O requirements), and can be cast onto a reinforcement to prepare a laminate for use as a substrate for electronic circuitry. The flame resistant compound is reaction product of a halogen containing compound of the formulae R&Parenopenst; DA)n or R&Parenopenst; DA&Parenclosest;n R2 wherein R is a halogen containing aromatic group, a halogen containing aliphatic group or a combination thereof; R2 is hydrogen, an aromatic group, an aliphatic group or an combination of an aromatic group and an aliphatic group which may contain halogen atoms; DA is a Diels-Alder reactive diene or a group that can act as a dienophile in a Diels-Alder reaction; and n is greater than or equal to 1; with a benzocyclobutene compound.

Abstract: The present invention is directed to allowing a work piece to stabilize in regard to temperature and humidity/water content prior to precision operations so as to minimize any problems resulting from dimensional changes.

Abstract: A rack suitable for holding a flexible substrate panel, the rack having a plurality of clamps for providing current to a panel clamped to the rack, the clamps being positioned to uniformly distribute current to the substrate. Seven clamps are used to hold a flexible substrate panel bearing a copper seed or other conductive layer in place on the rack wherein one tautens the substrate while attaching the clamps so as to clamp the substrate in a “wrinkle free” manner. The seven clamps are arranged with 3 clamps on each of the left and right sides and one clamp on the bottom, the clamps making electrical contact with conductive layers of both the front and back surfaces of the substrate panel. The arrangement of the clamps provides adequate support to the substrate, provides for a good and uniform current distribution on the substrate, and allows a relatively large amount of current to flow through the panel without burning off the conductive/seed layers.

Abstract: A method for coating substrates having sides of the substrate with unequal adhesion properties includes the steps of non-symmetrically coating the substrate by coating a first side under a first set of coating conditions and coating a second side under a second set of operating conditions wherein the operating conditions used to coat each side are varied so as to compensate for the unequal adhesion properties of the sides.

Abstract: A printed circuit assembly and method of making the same utilize in one embodiment an adhesive layer including a plurality of non-conductive “gauge particles” disposed within a non-conductive adhesive. When the adhesive layer is disposed between opposing printed circuit layers (be they insulating substrates, conductive layers, or other layers), individual gauge particles are interposed or sandwiched at various points between the layers such that the diameters of the particles control the layer separation throughout overlapping areas of thereof, thereby permitting careful control over layer separation. A printed circuit assembly and method of making the same utilize in another embodiment an interlayer interconnecting technology incorporating conductive posts that are deposited on one of a pair of contact pads formed on opposing printed circuit boards and thereafter bonded to the other in the pair of contact pads during lamination.

Abstract: This invention concerns lasable bond-ply materials comprising a nonwoven reinforcing material and at least one resin material. The present invention also includes methods for using the bond-ply of this invention to manufacture high density multilayer printed wiring boards.

Abstract: This invention concerns electronic substrates comprising a non-woven filler material and a resin material. The present invention also includes electronic products manufactured from the electronic substrates of this invention including, but not limited to prepregs, metal clad laminates, and printed wiring boards with and without lased via holes. The present invention further includes a method of manufacturing printed built-up wiring boards including the steps of forming a prepreg and forming at least one via in the prepreg.

Abstract: A method for coating substrates having sides of the substrate with unequal adhesion properties includes the steps of non-symmetrically coating the substrate by coating a first side under a first set of coating conditions and coating a second side under a second set of operating conditions wherein the operating conditions used to coat each side are varied so as to compensate for the unequal adhesion properties of the sides.

Abstract: A printed circuit assembly and method of making the same facilitates the attachment of high density modules onto a printed circuit board. In one embodiment, the high density modules are attached to the printed circuit board using an adhesive having a conductive material disposed within at least one via. In an alternate embodiment, an adhesive layer including a plurality of non-conductive "gauge particles" disposed within a non-conductive adhesive is used to attach the module to the printed circuit board. When the adhesive layer is disposed between a module and a printed circuit, individual gauge particles are interposed or sandwiched at various points between the layers such that the diameters of the particles control the layer separation throughout overlapping areas of thereof, thereby permitting careful control over layer separation.

Abstract: A method of forming circuit lines on a substrate by applying a roughened conductive metal layer using a copper foil carrier. The copper foil is etched away, leaving the roughened conductive metal embedded in the surface of the substrate. The conductive metal may be treated to remove an oxide layer. A photoresist may also be applied over the treated conductive metal layer to define a fine line circuit pattern. The photoresist defining the fine line circuit pattern is then removed to expose trenches in accordance with the desired circuit pattern. Copper is applied into the trenches over the exposed conductive metal, and the remaining photoresist, and conductive metal underlying the remaining photoresist, is removed to finish the fine line circuit pattern.

Abstract: Resin overflow in the interior cavity of a multilayer substrate assembly during lamination is restricted and controlled by a plug inserted into the cavity prior to bonding. The plug is shaped to mate with the stepped vertical profile of the cavity. The plug may include sections of materials of different hardness to support the stepped vertical profile of the plug and to facilitate removal of the plug after lamination. The plug may also include textured surfaces to facilitate removal of the plug. Pressurized gas is introduced at the interface between the plug and the cavity surface to dislodge the plug and a vacuum may be applied to the top of the plug to facilitate removal. The cavity may also be coated with layer of photo sensitive material to protect the metal bonding surfaces in the cavity from damage by the plug and to prevent particulate contamination during lamination.

Abstract: This invention is a partially or semi-cured foam used to form the pipe insulation. The semi-cured foam is very flexible and can be formed around a pipe for a long period of time after production. The semi-cured phenolic foam board of this invention is a closed cell foam. The semi-cured foam is further cured in the formed shape. Upon curing the foam retains the shape of the preform. The semi-cured product is very flexible, once fully cured, the insulation becomes rigid.

Abstract: The present invention is a non-woven fiber mat suitable for reinforcing resilient sheet floor coverings, such as vinyl floor coverings. The non-woven fiber mat is in the form of a sheet of reinforcement fibers which at least includes semi-coiled fibers and can also include coiled fiber, with one or more turns, and even some relatively straight or slightly curved fibers. It is desirable for most, if not all, of the reinforcement fibers to be made from glass. However, it may also be desirable for the reinforcement fibers to include glass fibers and synthetic fibers. It may even be possible for the reinforcement fibers to include only non-glass fibers. At least one polymeric binder is used for bonding together the reinforcement fibers so as to make the fiber mat a suitable substrate for reinforcing resilient sheet floor coverings, such as an interlayer for vinyl floor coverings.

Abstract: An acoustical diffuser is disclosed for diffusing sound. A preferred diffuser includes a first fibrous material, a first separator layer, a diffuser material a second separator layer, a second fibrous material and an acoustically transparent material. The subject invention also includes a preferred method of molding such diffuser. The subject invention further includes a panel that has an acoustically reflective side and an acoustically transparent side over a frequency range that can be attached to the walls of a room to enhance the acoustical characteristics of the room. A preferred method of installing such panels includes installing fabric retainer members to the walls between the panels and attaching an acoustically transparent material to the fabric retainer members such that the panels and fabric retainers are covered by the acoustically transparent material.

Abstract: A durable, corrosion-resistant glass fiber spinner is prepared by applying as a barrier layer a uniform layer of an alloy, compatible with the material of the spinner, on the walls of the spinner bores. A layer of platinum group metal is applied over the barrier layer.

Abstract: An apparatus for providing a roof structure having a plurality of purlins spaced apart from one another in a parallel arrangement is disclosed. The apparatus includes a carriage which is movable in a downstream direction along the length of the purlins. The carriage pays out a support sheet for support of insulation material as the carriage travels along the length of the purlins so that the support sheet depends from the top portion of adjacent purlins. The apparatus further includes at least one roller mounted on the carriage mounted to roll along the top portion of at least one purlin and thus support and guide the carriage along the downstream direction. The roller includes a frustum portion to hinder movement of the carriage in a direction lateral to the downstream direction and thus help to maintain the carriage in alignment with the purlins.

Abstract: A method of making a fibrous pack includes centrifuging at least two sets of mineral fibers from molten mineral material using at least two rotary mineral fiber spinners that are arranged in a machine direction along a collection surface, directing each set of the mineral fibers into a downwardly moving veil beneath one of the mineral fiber spinners, generating a downwardly moving array of aligned organic fibers from at least one orificed die that is spaced apart from each of the mineral fiber spinners and directing the array into contact with the mineral fibers, and collecting the mineral fibers and organic fibers as a fibrous pack.