Patents Represented by Attorney D. Austin Bonderer
  • Patent number: 7947145
    Abstract: A method for making a carbon nanotube composite includes: (a) providing at least one carbon nanotube film and at least one polymer film; (b) forming a carbon nanotube film structure with the carbon nanotube film on a surface of the polymer film to obtain a carbon nanotube composite preform; (c) pre-combining the carbon nanotube composite preform to obtain a treated carbon nanotube composite preform; and (d) heating and pressing at least one treated carbon nanotube composite preform to achieve a carbon nanotube composite.
    Type: Grant
    Filed: October 6, 2008
    Date of Patent: May 24, 2011
    Assignees: Tsinghua University, Hon Hai Precision Industry Co., Ltd.
    Inventors: Jia-Ping Wang, Qun-Feng Cheng, Kai-Li Jiang, Shou-Shan Fan
  • Patent number: 7947542
    Abstract: A method for making a thin film transistor, the method comprising the steps of: (a) providing a carbon nanotube array and an insulating substrate; (b) pulling out a carbon nanotube film from the carbon nanotube array by using a tool; (c) placing at least one carbon nanotube film on a surface of the insulating substrate, to form a carbon nanotube layer thereon; (d) forming a source electrode and a drain electrode; wherein the source electrode and the drain electrode being spaced therebetween, and electrically connected to the carbon nanotube layer; and (e) covering the carbon nanotube layer with an insulating layer, and a gate electrode being located on the insulating layer.
    Type: Grant
    Filed: April 2, 2009
    Date of Patent: May 24, 2011
    Assignees: Tsinghua University, Hon Hai Precision Industry Co., Ltd.
    Inventors: Kai Liu, Kai-Li Jiang, Shou-Shan Fan
  • Patent number: 7947977
    Abstract: A thin film transistor includes a source electrode, a drain electrode, a semiconducting layer, and a gate electrode. The drain electrode is spaced from the source electrode. The semiconducting layer is electrically connected to the source electrode and the drain electrode. The gate electrode is insulated from the source electrode, the drain electrode, and the semiconducting layer by an insulating layer. The at least one of the source electrode, drain electrode, and the gate electrode includes a metallic carbon nanotube layer. The metallic carbon nanotube layer includes a plurality of metallic carbon nanotubes.
    Type: Grant
    Filed: April 2, 2009
    Date of Patent: May 24, 2011
    Assignees: Tsinghua University, Hon Hai Precision Industry Co., Ltd.
    Inventors: Kai-Li Jiang, Qun-Qing Li, Shou-Shan Fan
  • Patent number: 7933058
    Abstract: A thermochromic component includes a thermochromic module and a heater. The heater is thermally coupled with the thermochromic module. The heater includes a carbon nanotube structure. The carbon nanotube structure directly transfers heat to the thermochromic module. A thermochromic display apparatus also is provided. The thermochromic display apparatus uses the thermochromic component.
    Type: Grant
    Filed: October 22, 2009
    Date of Patent: April 26, 2011
    Assignees: Tsinghua University, Hon Hai Precision Industry Co., Ltd.
    Inventors: Peng Liu, Duan-Liang Zhou, Liang Liu, Kai-LI Jiang, Shou-Shan Fan
  • Patent number: 7928912
    Abstract: A multiband antenna includes a long radiating branch, a short radiating branch, a short strip, a feed point, a grounding portion, a connecting portion, a long parasitic strip, and a short parasitic strip. The feed point, the long radiating branch, the short radiating branch, and the short strip are in a first plane. The grounding portion connects to the short strip. The connecting portion connects the long radiating branch, the short radiating branch, and the short strip. The long radiating branch, the short strip, and the connecting portion form a first inverted-L shaped antenna structure. The short radiating branch, the short strip, and the connecting portion form a second inverted-L shaped antenna structure. The long parasitic strip and the short parasitic strip are in a second plane and respectively connected to the grounding portion. The first plane is parallel to the second plane.
    Type: Grant
    Filed: July 11, 2008
    Date of Patent: April 19, 2011
    Assignees: Tsinghua University, Hon Hai Precision Industry Co., Ltd.
    Inventors: Wen-Hua Chen, Xin Wang, Zheng-He Feng
  • Patent number: 7929293
    Abstract: A heat dissipating assembly includes a heat generating component, a heat sink, and a fan. The heat sink includes a base attached on the heat generating component and a plurality of fins attached on the base. The fan is attached to a top surface of the fins. The top surface of the fins is wider than the base. The fins incline inwardly from the top surface to the base for gathering cooling air from the fan to the base.
    Type: Grant
    Filed: June 8, 2009
    Date of Patent: April 19, 2011
    Assignees: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.
    Inventor: Liang-Liang Cao
  • Patent number: 7929304
    Abstract: A heat dissipation apparatus for dissipating heat from two heat sources includes a heat sink, and a fan mounted on the heat sink. The heat sink includes a base and a plurality of parallel fins positioned on the base, the base contacts with one of the two heat sources for thermally conducting the heat generated by the one of the two heat sources. The fan is configured to generate airflow through the fins in such a manner that airflow flows from a second side of the fins to a first side of the fins. A deflecting member is mounted on the first side of the fins for deflecting airflow from the fan towards the second of the two heat sources.
    Type: Grant
    Filed: June 8, 2009
    Date of Patent: April 19, 2011
    Assignees: Hong-Fu Jin Precision Industry (ShenZhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.
    Inventors: Liang-Liang Cao, Jeng-Da Wu, Yang Li
  • Patent number: 7925999
    Abstract: A design method of printed circuit boards includes the following steps. First, simulate a printed circuit board including power layers, and vias connected to all the power layers. Then, change connections of the vias that tend to draw too much current to be connected to fewer power layers, than the vias that tend to draw less current. Repeat adjusting connections of the vias until all vias draw a similar amount of current such that no via draws more current than an upper limit the vias are designed for. Finally, according to the results, design/fabricate a PCB with vias respectively insulated, as needed, from the power layers that do not need to be connected to the vias.
    Type: Grant
    Filed: June 17, 2008
    Date of Patent: April 12, 2011
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventors: Ying-Tso Lai, Chien-Hung Liu, Shou-Kuo Hsu
  • Patent number: 7924557
    Abstract: A retaining apparatus for at least one data storage device includes a tray and a retaining device. The tray is used for receiving the at least one data storage device. The retaining device includes base member, an arm member, and a retaining member. The base member is attached to the tray. The arm member is pivotably attached to the base member about a pivot axis. The pivot axis is located at a first end of the arm member. The retaining member is movably attached to the base member along a first direction. The retaining member includes an engaging portion and a retaining portion. The arm member has a driving portion at the first end engaged with the engaging portion. The first direction is substantially perpendicular to the pivot axis. The retaining member is capable of being driven to move along the first direction by rotating the arm member.
    Type: Grant
    Filed: August 3, 2009
    Date of Patent: April 12, 2011
    Assignees: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.
    Inventor: Zhan-Yang Li
  • Patent number: 7923914
    Abstract: The field emission cathode device includes an insulating substrate with a number of cathodes mounted thereon. A number of field emission units are mounted on the cathodes. A dielectric layer is disposed on the insulating substrate and defines a number of voids corresponding to the field emission units. The dielectric layer has an upper and lower section and disposed on the insulating substrate. The dielectric layer defining a plurality of voids corresponding to the field emission units. A number of grids disposed between the upper and lower sections, and wherein each grid are secured by the upper and lower sections of the dielectric layer.
    Type: Grant
    Filed: January 13, 2009
    Date of Patent: April 12, 2011
    Assignees: Tsinghua University, Hon Hai Precision Industry Co., Ltd.
    Inventors: Hai-Yan Hao, Li Qian, Peng Liu, Liang Liu, Qi Cai, Shou-Shan Fan
  • Patent number: 7923731
    Abstract: A thin film transistor includes a source electrode, a drain electrode, a semiconducting layer, and a gate electrode. The drain electrode is spaced from the source electrode. The semiconducting layer is connected to the source electrode and the drain electrode. The gate electrode is insulated from the source electrode, the drain electrode, and the semiconducting layer by an insulating layer. The semiconducting layer includes a carbon nanotube layer, and the carbon nanotube layer comprises a plurality of semiconducting carbon nanotubes.
    Type: Grant
    Filed: April 2, 2009
    Date of Patent: April 12, 2011
    Assignees: Tsinghua University, Hon Hai Precision Industry Co., Ltd.
    Inventors: Kai-Li Jiang, Qun-Qing Li, Shou-Shan Fan
  • Patent number: 7915797
    Abstract: A thermionic electron source includes a substrate, two electrodes, and a thermionic emitter. The thermionic emitter is electrically connected to the two electrodes. The substrate has a recess formed on a surface thereof, and the thermionic emitter is located on the surface of the substrate corresponding to the recess.
    Type: Grant
    Filed: October 23, 2008
    Date of Patent: March 29, 2011
    Assignees: Tsinghua University, Hon Hai Precision Industry Co., Ltd.
    Inventors: Peng Liu, Liang Liu, Kai-Li Jiang, Shou-Shan Fan
  • Patent number: 7915850
    Abstract: An apparatus and method for servomotors of an electric injection molding machine includes a motion controlling unit, two driving amplifying units, and two servomotors respectively connected to the driving amplifying units. The motion controlling unit includes two servomotor position controllers both for receiving a first position command, and the driving amplifying units are respectively connected to the servomotor position controllers for receiving a second and third position command. Two position detectors are respectively received in the two screw caps that are mounted to the servomotors for detecting absolute positions of the corresponding screw caps. The screw caps are respectively connected to inputs of the first and second servomotor position controllers to form two screw cap position feedback circuits.
    Type: Grant
    Filed: June 3, 2008
    Date of Patent: March 29, 2011
    Assignee: Foxnum Technology Co., Ltd.
    Inventors: Chin-Hsien Ting, Rong-Hwang Horng, Yaw-Shen Lai, Hsing-Chang Liu
  • Patent number: 7915798
    Abstract: A thermionic emission device includes an insulating substrate, and one or more grids located thereon. Each grid includes a first, second, third and fourth electrode down-leads located on the periphery thereof, and a thermionic electron emission unit therein. The first and second electrode down-leads are parallel to each other. The third and fourth electrode down-leads are parallel to each other. The first and second electrode down-leads are insulated from the third and fourth electrode down-leads. The thermionic electron emission unit includes a first electrode, a second electrode, and a thermionic electron emitter. The first electrode and the second electrode are separately located and electrically connected to the first electrode down-lead and the third electrode down-lead respectively. The thermionic electron emitter includes at least one carbon nanotube wire.
    Type: Grant
    Filed: October 23, 2008
    Date of Patent: March 29, 2011
    Assignees: Tsinghua University, Hon Hai Precision Industry Co., Ltd.
    Inventors: Peng Liu, Liang Liu, Kai-Li Jiang, Shou-Shan Fan
  • Patent number: 7914358
    Abstract: A method for manufacturing a field emission electron source includes: (a) Providing a carbon nanotube (CNT) film, the CNT film has a plurality of CNTs, the CNTs are aligned along a same direction; a first electrode and a second electrode. (b) Fixing the two opposite sides of the CNT film on the first electrode and the second electrode, the CNTs in the CNT film extending from the first electrode to the second electrode. (c) Treating the CNT film with an organic solvent to form at least one CNT string. (d) Applying a voltage between two opposite ends of the CNT string until the CNT string snaps, thereby at least one CNT needle, the CNT needle has an end portion and a broken end portion. (e) Securing the CNT needle to a conductive base by attaching the end portion of the CNT needle to the conductive base.
    Type: Grant
    Filed: November 26, 2008
    Date of Patent: March 29, 2011
    Assignees: Tsinghua University, Hon Hai Precision Industry Co., Ltd.
    Inventors: Yang Wei, Liang Liu, Shou-Shan Fan
  • Patent number: 7915598
    Abstract: An electromagnetic signal measuring device includes a carbon nanotube structure. The carbon nanotube structure is capable of producing a sound by absorbing an electromagnetic signal. The electromagnetic signal measuring device is able to determine the intensity and polarization of the electromagnetic signal.
    Type: Grant
    Filed: September 3, 2009
    Date of Patent: March 29, 2011
    Assignees: Tsinghua University, Hon Hai Precision Industry Co., Ltd.
    Inventors: Kai-Li Jiang, Lin Xiao, Zhuo Chen, Shou-Shan Fan
  • Patent number: 7898800
    Abstract: A mounting apparatus is configured for securing at least one PCI card, and includes a chassis, a bracket, a positioning member, and a locking member. The chassis includes a bottom plate and a side plate perpendicular to the bottom plate. The bracket is secured on the bottom plate. The positioning member is secured on the bracket. The positioning member includes a securing plate perpendicular to the chassis side pate and parallel to the chassis bottom plate. The locking member is secured on the securing plate of the positioning member. The locking member includes a limiting plate parallel to the securing plate. The at least one PCI card is located between the limiting plate and the securing plate to secure the PCI card(s) in the chassis.
    Type: Grant
    Filed: August 19, 2009
    Date of Patent: March 1, 2011
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventors: Chen-Lu Fan, Li-Ping Chen
  • Patent number: 7898797
    Abstract: A mounting apparatus for PCI card, includes a mounting bracket, a securing piece adapted to attach the PCI card to the mounting bracket, and an elastic securing member pivotally mounted on the blocking plate of the mounting bracket. The mounting bracket has a base and a blocking plate perpendicular to the base. An opening is defined in the mounting bracket adjacent to the blocking plate. The securing piece includes a first end and a second end perpendicular to the first end. The first end abuts and engages with the mounting bracket base, and the second end abut the blocking plate of the mounting bracket. The elastic securing member includes a pressing portion and an actuating portion. The actuating portion is resiliently received in the opening to force the pressing portion to sandwich the second end of the securing piece between the blocking plate and the pressing portion.
    Type: Grant
    Filed: June 30, 2009
    Date of Patent: March 1, 2011
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventors: Chen-Lu Fan, Li-Ping Chen
  • Patent number: D638272
    Type: Grant
    Filed: November 30, 2010
    Date of Patent: May 24, 2011
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventor: Yun-Lung Chen
  • Patent number: D640124
    Type: Grant
    Filed: September 24, 2010
    Date of Patent: June 21, 2011
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventors: Chung-Cheng Hsieh, Li-Ping Chen