Abstract: A solder-bearing lead (10) includes a contact clamping finger (20) having an arcuate, reverse-bent clamping portion (34) which is wrapped about a solder preform (12) so that a surface portion (24) of the preform and an outer end surface portion (22) of the contact finger both directly engage a contact pad (14) on a substrate circuit device (16) when the lead is mounted on the device. When the lead (10) is temporarily subjected to heat in a soldering operation, the solder preform (12) melts and flows directly over the contact pad (14) and then resolidifies to form a soldered connection (28) having the outer end surface portion (22) of the reverse-bent clamping portion (34) of the contact clamping finger (20) embedded in the soldered connection in firm engagement with the contact pad (14).

Abstract: A pair of spaced holes (32 and 34) are drilled in a substrate blank (10) diametrically along a line (14) defining a future locating edge (22) of a printed circuit board (12). When the substrate blank (10) is then sheared to form the printed circuit board (12), semi-circular recesses (38 and 40) are formed from the spaced holes (32 and 34) in the resultant board locating edge (22). The printed circuit board (12) then is accurately aligned in a processing station in X- and Y-directions by seating board-locating pins (50 and 52) of special configurations in respective ones of the semi-circular recesses (38 and 40).

Abstract: A low-insertion force solder-bearing lead (10) includes a resilient clamping finger (20) having an inner planar surface (48) for engaging a planar surface (50) of a substrate circuit device (16) in parallel mating relationship. Respective portions (26 and 28) of a resilient contact finger (22) and a solder preform (12) define a noncircular camming surface (58) which extends relative to the inner planar surface (48) of the clamping finger (20) at an angle of not more that 45.degree. to facilitate flexing of the contact finger in the assembling of the lead (10) to the substrate circuit device (16). Portions (68) of the solder preform (12) smear across a contact pad (14) during the lead assembling operation to facilitate wetting of the preform to the contact pad in a subsequent soldering operation.

Abstract: A progressively-increasing clamping force lead (10) includes a resilient contact finger (22) having an outer arcuate loop portion (26) and a locking tab (34) having a camming surface (70) projecting at an angle from an outer end of the arcuate loop portion toward a planar surface (56) of a clamping finger (20). In the assembling of the lead (10) to the substrate circuit device (16), as the locking tab (34) engages and rides up an adjacent edge (64) of the substrate circuit device, the locking tab causes progresive flexing of an inner connecting portion (36) of the contact finger (22) and progressive coiling of the arcuate loop portion (26) of the contact finger to cause the arcuate loop portion to engage a contact pad (14) with a progressively-increasing force. Subsequently, the arcuate loop portion (26) and the locking tab (34) seat firmly on the contact pad (14) to retain the lead (10) securely on the substrate circuit device (16). The lead (10) then may be soldered to the contact pad (14).

Abstract: A substrate support module (10) includes a series of vertically arranged guide shelves (12, 14 and 16) having front, intermediate and rear circular bosses (34, 36 and 38) projecting from opposite ends thereof. The first and third bosses (34 and 38) are tangentially received in elongated horizontal slots (40 and 44) in side support plates (18) to position and lock the shelves (12, 14 and 16) against vertical movement. The intermediate bosses (36) are tangentially received in vertical elongated slots (42)in the side support plates (18) to position and lock the shelves (12, 14 and 16) against horizontal movement. During assembly, edges of the slots (40, 42 and 44) tend to flatten or shave off small peripheral portions (50) of the bosses when the bosses are slightly oversize, whereby the oversize bosses can readily be assembled into the slots.

Abstract: A solder-bearing lead (10) includes a contact clamping finger (20) having an arcuate, reverse-bent clamping portion (34) which is wrapped about a solder preform (12) so that a surface portion (22) of the preform directly engages a contact pad (14) on a substrate circuit device (16) when the lead is mounted on the device. When the lead (10) is temporarily subjected to heat in a soldering operation, the solder preform (12) melts and flows directly over the contact pad (14) and then resolidifies to form a soldered connection (26) having an outer end portion (28) of the reverse-bent clamping portion (34) of the contact clamping finger (20) embedded therein.

Abstract: A mini-oscillator assembly (20) is formed by initially bonding ribbon leads (34) to contact pads (32) on a planar substrate (26) of a hybrid integrated circuit device (22) such that the leads project from the substrate in the plane thereof. Inverted V-shaped notches (50) then are formed in the ribbon leads (34) as the leads are cut to length. The ribbon leads (34) then are formed over the substrate (26) so that the V-shaped notches (50) face away from the substrate (26) and are aligned with one another on opposite sides of a plane extending from an imaginary line (52) extending between and interconnecting the substrate contact pads (32). Wire leads (38) of a crystal resonator plate (24) then are soldered in the V-shaped notches (50) to form the mini-oscillator assembly (20).

Abstract: An argon-nitrogen sputtering gas mixture is introduced into a cylindrical sputtering chamber (20) at essentially the geometric center of the chamber. The gas mixture then disperses through open areas in the chamber about upper and lower edges of a cylindrical tantalum target (24) and homogeneously into a sputtering area (30) between the target and a plurality of substrates (12) on a rotatable carrousel (28). As tantalum material then is sputtered from the target onto the substrates (12), tantalum films (16), which are uniformly doped with nitrogen, are formed on the substrates. A target cooling cell assembly (26), comprising a pair of C-shaped cooling cells (92) having independent cooling water input-and-return systems (95), provides improved cooling of the target during the sputtering operation.

Abstract: Vapor condensation mass soldering apparatus (46) is of modular construction and includes a primary vapor zone assembly (50), a secondary vapor zone assembly (52), an ambient air moisture-removal zone assembly (54) and a hood assembly (56) mounted in readily separable, vertically stacked relationship. An article load-unload assembly (48) is secured to the front of the other assemblies (50, 52, 54 and 56). Each of the zone assemblies (50, 52 and 54) also includes respective condenser coil modules (142, 150 and 154) of special construction which can readily be mounted on and removed from their respective assemblies as integral units.

Abstract: A substrate-lead subassembly (34S), having relatively fragile lead retaining hooks (68) which project from opposite sides of the subassembly outward beyond the edges of an opening (38) in a housing (36) of a housing subassembly (32) in which the hooks are to be received, is partially assembled into the housing in an initial assembling station (80). More specifically, as the housing subassembly (32) is advanced horizontally into the initial assembling station (80) above the substrate-lead subassembly (34S), opposite sides of the housing (36) are released in sequence so that the housing subassembly drops by gravity through a series of controlled tipping and downward vertical movements to receive the lead-retaining hooks (68) on one side of the substrate-lead subassembly (34S) in the housing with outer ends (70) of the hooks in seated interlocking engagement with an inner support ledge (52) of the housing.

Abstract: A low-insertion force solder-bearing lead (10) includes a resilient clamping finger (20) having an inner planar surface (48) for engaging a planar surface (50) of a substrate circuit device (16) in parallel mating relationship. Respective portions (26 and 28) of a resilient contact finger (22) and a solder preform (12) define a noncircular camming surface (58) which extends relative to the inner planar surface (48) of the clamping finger (20) at an angle of not more than 45.degree. to facilitate flexing of the contact finger in the assembling of the lead (10) to the substrate circuit device (16). Portions (68) of the solder preform (12) smear across a contact pad (14) during the lead assembling operation to facilitate wetting of the preform to the contact pad in a subsequent soldering operation.

Abstract: Wires (30-1, 30-2, 30-3 and 30-4), which may be of different gauges, are selectively wound on bobbins (32) either singly or in parallel with one another. More specifically, wire guides (364) for first wires (30-1) are selectively transferable between a wire wrapping plate (222) for a bobbin winding operation, and inoperative positions on a storage block (71). Similarly, wire guides (428) for the additional wires (30-2, 30-3 and 30-4) are selectively transferable between the wire wrapping plate (222) for a bobbin winding operation, and inoperative positions in a magazine storage assembly (66). The wrapping radius of the wrapping plate (222) also is adjustable to accommodate bobbins (32) having different terminal spacings.

Abstract: The formation of dross in a molten solder bath (28) by surface agitation of the bath, and the adverse effects of dross on a solder pumping operation, are essentially eliminated by suspending a pump shaft (36) and an impeller (38) thereon for free rotation within a housing (96) in the molten solder bath so that solder in the solder bath is precluded from making any significant contact with the rotating shaft. To insure against binding between the impeller (38) and an opposed horizontal inner surface (132) of the housing (96), a small amount of solder is permitted to flow continuously between the impeller and the surface into contact with the rotating shaft (36) adjacent the impeller. The small solder flow then is exposed to the atmosphere to form a correspondingly small amount of light powdery solder dross (134).

Abstract: A solder mask (62) of special construction is mounted on each of a plurality of crystal filters (10) having continuous seams (16) defined by peripheral edges (20) of filter metal covers (14) and peripheral portions (18) of filter metal headers (12). The crystal filter-solder mask assemblies (10,62) then are passed over a solder wave (24) to solder the continuous seams (16) of the crystal filters (10) simultaneously. The crystal filters (10) are suspended on magnetic carriers (104) of an endless conveyor (106) as the filters pass over the solder wave. During the wave-soldering operation the solder masks (62) preclude solder from access to various critical areas of the crystal filters (10).

Abstract: Fabricating thin film RC networks (10) includes forming alpha tantalum capacitor base electrodes (14be) on a substrate (12), while simultaneously forming alpha tantalum anodization bus bars (14p and 14s) on the substrate. A portion of each base electrode (14be) then is anodized to form a capacitor dielectric (20) in a single anodizing step. A tantalum nitride resistor film (24) and electrically conductive films (26 and 28) then are deposited on the resultant assembly. Next, portions of the electrically conductive films are removed to define portions of capacitor counterelectrodes (22), to expose sections of the tantalum nitride resistor film (24) destined for use as resistors (24r). and to define conductor networks (30). Portions of the tantalum nitride resistor film (24) then are removed to define capacitor counterelectrode portions (24ce) and the resistors (24r), while simultaneously removing the anodization bus bars (14p and 14s). The resultant networks (10) then are thermally stabilized.

Abstract: In the wiring of connector plugs (18) to produce a wire mult, a wire (16) is first positioned in a terminal guide slot (32) on one side of a first connector plug (18) and then offset-dressed about a camming pin (52) of a wire insertion-and-slack forming tool (50) into alignment with a wire strain-relief slot (38) on an opposite side of the plug. Operation of the tool (50) then inserts the wire (16) into a terminal (24) on the one side of the first connector plug (18) and forms slack in the wire between the first connector plug and a second connector plug (18). The tool (50) next inserts the wire (16) into the wire strain-relief slot (38) of the first connector plug (18) and a terminal guide slot (38) on one side of the second connector plug (18) substantially simultaneously. The tool (50) includes dual air cylinders (64 and 66) and respective wire-engaging blades (54 and 56) which operate in sequence to perform the multing operation.

Abstract: A cable package (20) which includes two coiled cable lengths (22 and 24) interconnected by an intermediate section (26), is formed by winding wire bundles (28 and 30) onto first and second winding sections (44 and 46) of a collapsible reel (42) in sequence. The reel winding sections (44 and 46) are defined by radially-projecting pins 88 which are extendable or retractable by rotation of a hub 84, and which cooperate with cable support rods (80) of the reel to move the reel into an expanded condition for winding and a collapsed condition for removal of the cable package (20). During a winding operation, a wire bundle separator assembly (52) also cooperates with a cable tying device (54) to place memory ties (34) about one of the wire bundles (28 or 30) and binder ties (36) about both of the wire bundles (28 and 30) along the length of the cable package ( 20).

Abstract: First end portions (22c) of terminal pins (22) are gripped in a gripping means (54) on one side of a substrate (24) and intermediate portions (22cs) of the pins then are inserted into the substrate. In the insertion operation, second opposite end portions (22i) of the pins are extended into a straightening means (74) on the opposite side of the substrate (24). Tip portions of the first pin end portions (22c) then are disposed in the gripping means (54) and tip portions of the second pin end portions (22i) are disposed in the straightening means (74). To straighten the pins (22), relative reciprocating movement then is caused between the pin intermediate portions (22cs) and the pin tip portions to flex and coldwork the first and second pin end portions (22c and 22i) in a lateral direction simultaneously.

Abstract: A universal strand clamp (10) is provided for securing a strand or cable (12) to a wall panel (14) to provide strain relief for terminating ends (16) of individual conductors (18) of the cable. The cable (12) is secured into a body portion (22) of the clamp (10) by a cable tie (20) which extends about portions of the outer periphery of the body portion and into a cross bore (40) of the body portion.

Abstract: Terminal pins (18) in a terminal pin strip (16) are integrally interconnected by webs (22) located intermediate free insertion ends (18i) and free connector ends (18c) of the pins so that when the webs are severed to separate the terminal pins, the severing operation does not disrupt the integrity of smooth finished surfaces on the connector ends of the pins. Each terminal pin (18) also is formed with an intermediate push shoulder (18ps) for applying pressure on the pin to insert the pin into an aperture (20a) in a support structure, such as a printed wiring board (20), without damaging the connector end (18c) of the pin. Assembly of the terminal pins (18) into the printed wiring board (20), utilizing terminal pin strips (16) on respective supply reels (24), is accomplished with apparatus comprising a pair of pin transporter mechanisms (26), a pair of web-severing punch-and-die mechanisms (28), and a pin insertion mechanism 30.