Abstract: A film-application device (FAD) comprising a pair of exterior, tapered, "O" ring bearing plate members and a central plate member for simplifying the process of thermally bonding a thin dielectric film to a substrate comprising an optical element. In use, the film is sandwiched between the "O" rings and stretched across the optical element by squeezing the exterior plates together before bonding to the element. The film may be used for protecting the optical element or to reduce surface reflection of radiation.The FAD may also be used without the center plate to stretch a dielectric film prior to its attachment to or insertion in a holder to make pellicles or beam-splitters.