Patents Represented by Attorney, Agent or Law Firm David E. Huang
  • Patent number: 6516390
    Abstract: The invention is directed to techniques for accessing data within a data storage system having a circuit board that includes both a front-end circuit for interfacing with a host and a back-end circuit for interfacing with a storage device. To move data between the host and the storage device, an exchange of data between the front-end circuit and the back-end circuit can occur within the circuit board thus circumventing the cache of the data storage system. Such operation not only reduces traffic through the cache, but also shortens the data transfer latency. In one arrangement, a data storage system includes a cache, a first front-end circuit that operates as an interface between the cache and a first host, a second front-end circuit that operates as an interface between the cache and a second host, a first storage device (e.g., a disk drive, tape drive, CDROM drive, etc.
    Type: Grant
    Filed: October 26, 2000
    Date of Patent: February 4, 2003
    Assignee: EMC Corporation
    Inventors: Kendell A. Chilton, Daniel Castel
  • Patent number: 6511229
    Abstract: The invention is directed to techniques for controlling access to an optical interface using a shutter that moves away (e.g., sideways) from the optical interface when exposing the optical interface. Such movement away form the optical interface avoids pushing dirt and debris toward the optical interface when the shutter exposes the optical interface to form an optical connection. Such operation keeps the optical interface clean as well as prevents light from inadvertently escaping from the optical interface that could otherwise cause eye injury (e.g., due to the light intensity). One arrangement is directed to an optical connection system having a first optical connector and a second optical connector.
    Type: Grant
    Filed: December 21, 2000
    Date of Patent: January 28, 2003
    Assignee: Teradyne, Inc.
    Inventor: Sepehr Kiani
  • Patent number: 6509752
    Abstract: In one embodiment of the present invention, an apparatus is provided for use in testing a unit under test (UUT). The apparatus includes first and second assemblies. The first assembly has a plurality of members that extend from a surface of the first assembly and an electrically conductive test probe that extends from the surface. The second assembly includes openings dimensioned to receive respective ones of the members, and mechanisms that engage and apply a force to the members when the members are in the openings. When the UUT is under test, the members extend through openings in a PCB that are disposed around a ball grid array (BGA) device, and the force causes the assemblies to be urged toward each other so as to bring the probe into contact with a PCB via that is electrically connected to the BGA.
    Type: Grant
    Filed: March 5, 2001
    Date of Patent: January 21, 2003
    Assignee: EMC Corporation
    Inventors: Paul O'Keeffe, Robert Khoshabjian
  • Patent number: 6507849
    Abstract: The invention is directed to techniques for accessing a data storage system having both a filesystem and directory system. In one arrangement, an apparatus has memory that stores an application, and a controller coupled to the memory. The controller operates in accordance with the application stored in the memory to access a data storage system. In particular, the application configures the controller to obtain an access instruction which identifies a portion of the data storage system, and determine, in response to the obtained access instruction, whether the identified portion of the data storage system is a file of the filesystem or a directory entry of the directory system.
    Type: Grant
    Filed: March 15, 2000
    Date of Patent: January 14, 2003
    Assignee: Cisco Techno-ogy, Inc.
    Inventor: Jagjit Singh Choudhary
  • Patent number: 6503336
    Abstract: A nozzle applies fluid (e.g., heated gas) to a solder region of a circuit board component having a set of fluid-delivery edges and a set of fluid-escape edges. The nozzle includes a top member to connect with a fluid source, and a set of fluid-delivery side members coupled to the top member. Each fluid-delivery side member extends from the top member and around a respective fluid-delivery edge of the circuit board component when the circuit board component engages with the nozzle. Each fluid-delivery side member defines (i) at least a portion of a fluid-delivery channel that extends from a vicinity adjacent the top member toward the solder region of the circuit board component when the circuit board component engages with the nozzle, and (ii) a barrier that substantially prevents fluid from escaping from the solder region along the respective fluid-delivery edge for that fluid-delivery side member.
    Type: Grant
    Filed: March 21, 2001
    Date of Patent: January 7, 2003
    Assignee: EMC Corporation
    Inventor: Gordon O. Barr
  • Patent number: 6487071
    Abstract: The invention is directed to techniques for dampening vibration of a disk drive using a dampening member which is co-planar with a mid-plane of the disk drive, and which has at least a portion extending from a carrier toward a main assembly when the carrier is installed within the main assembly in order to dampen vibration of the disk drive when the disk drive is in operation. The use of the dampening member in this location results in vibration dampening which is superior to conventional disk drive mechanisms. In particular, since the dampening member is co-planar with the mid-plane of the disk drive, the dampening member dampens vibration along a critical direction providing substantial vibration isolation. Accordingly, disk drives configured in accordance with the invention are capable of providing high performance even in high rotation speed (i.e., high RPM) and high density configurations.
    Type: Grant
    Filed: July 31, 2000
    Date of Patent: November 26, 2002
    Assignee: EMC Corporation
    Inventors: Scot Tata, Frank Rienzo, Ronald Noret
  • Patent number: 6482042
    Abstract: A connection system includes a multi-port switch, multiple adaptors and multiple cable assemblies. The multi-port switch includes a primary port, multiple secondary ports, and a controller that is configured to connect the primary port individually to the multiple secondary ports. Each adaptor mates with a secondary port of the multi-port switch and includes (i) a circuit board connector having a set of circuit board connector contacts, (ii) a switchbox connector having a set of switchbox connector contacts, (iii) a fastener which physically fastens the circuit board connector of that adaptor and the switchbox connector of that adaptor together, and (iv) a set of conductors that electrically connects the set of circuit board connector contacts with the set of switchbox connector contacts. Each cable assembly includes a first circuit board connector for mating with an adaptor, and a second circuit board connector for connecting with a circuit board.
    Type: Grant
    Filed: August 29, 2001
    Date of Patent: November 19, 2002
    Assignee: EMC Corporation
    Inventor: Joel Tupper
  • Patent number: 6483041
    Abstract: The invention is directed to techniques for forming a soldered connection using a pin having a channel. The channel enables the pin to form a secure connection with a via (e.g., by facilitating gas percolation out of the via hole during soldering to improve solder flow, by holding solder prior to pin insertion and soldering, or by facilitating accurate pin bending to hold solder or a pin insert prior to pin insertion and soldering) to improve connection system reliability and increase manufacturing yields. In one arrangement, the pin has a surface which includes (i) a first surface area, (ii) a second surface area that is substantially parallel to the first surface area, and (iii) a channel surface area which defines a channel that extends from the first surface area toward the second surface area. To form a soldered connection, the pin is inserted into a cavity defined by a via of a connecting member (e.g., a circuit board), in a direction that is parallel to a central axis of the via.
    Type: Grant
    Filed: November 12, 1999
    Date of Patent: November 19, 2002
    Assignee: EMC Corporation
    Inventor: Stuart D. Downes
  • Patent number: 6481527
    Abstract: An apparatus attenuates noise from a cabinet that houses computer equipment. The apparatus includes a frame, a set of positioning members to position the frame relative to the cabinet, and lateral noise absorption members that are supported by the frame. The lateral noise absorption members define surfaces that form sides of airflow channels through the apparatus. The surfaces are substantially non-parallel to a direction of an airflow pathway through the cabinet when the set of positioning members positions the frame relative to the cabinet. The lateral noise absorption members absorb sound energy emanating from the cabinet (e.g., from a fan assembly within the cabinet). The lateral noise absorption members transform some of the sound energy into low level heat which can be dissipated into the air stream. Additionally, some of the sound energy is reflected back into the cabinet toward the source.
    Type: Grant
    Filed: March 14, 2001
    Date of Patent: November 19, 2002
    Assignee: EMC Corporation
    Inventors: F. William French, Paul Tirrell
  • Patent number: 6478604
    Abstract: A ribbon cable assembly includes a segment of ribbon cable having first and second ends, a first IDC connector mounted to the first end of the ribbon cable segment, and a second IDC connector mounted to the second end of the ribbon cable segment. Each connector includes a connector housing, and a set of terminals supported by the connector housing. Each terminal has a base portion (e.g., a pin, a pad, etc.) for coupling to an external device, and a cable attachment portion which is unitary with the base portion of that terminal. The cable attachment portion of each terminal defines (i) a slot that receives a wire, and (ii) wire positioners that position the wire within the slot when the slot receives the wire. The wire positioners of each terminal can precisely locate a wire within that terminal. The wire positioners facilitate wire retention and improve electrical connectivity thus providing a reliable electrical pathway between the wire and that terminal.
    Type: Grant
    Filed: June 12, 2001
    Date of Patent: November 12, 2002
    Assignee: EMC Corporation
    Inventors: Stuart D. Downes, Timothy M. Mulvihill
  • Patent number: 6480380
    Abstract: The invention is directed to techniques for cooling a disk drive using a louver to direct air from an air stream toward the disk drive. One arrangement is directed to a storage system which includes a cabinet assembly, and a fan assembly that provides an air stream through the cabinet assembly. The storage system further includes a disk drive assembly that fastens to the cabinet assembly. The disk drive assembly includes (i) a disk drive that stores and retrieves computerized data, and (ii) a support member that supports the disk drive. The support member defines an input louver that redirects air from the air stream toward the disk drive of the disk drive assembly. This arrangement enables forced convection air to adequately cool the disk drive thus reducing disk drive operating temperature and lowering the disk drive failure rate. This lowering of the failure rate translates into improved field reliability and lower repair costs. In one arrangement, the support member includes highly stiff material (e.g.
    Type: Grant
    Filed: July 18, 2000
    Date of Patent: November 12, 2002
    Assignee: EMC Corporation
    Inventors: F. William French, Larry Pignolet, Scot Tata
  • Patent number: 6452379
    Abstract: The invention is directed to techniques for connecting to a signal launch using a radio frequency (RF) probe having a flat-faced side with a ground post extending from a non-peripheral region (e.g., an intermediate region between a central region and a peripheral region of the flat-faced side). The use of such a probe alleviates the need to use many RF connectors permanently mounted to signal launches on a circuit board since the probe of the invention can be temporarily connected to the signal launches without such connectors. Furthermore, the ground post of the invention probe can be configured (e.g., positioned relative to a signal post) to avoid large inductance loops thus preserving signal integrity. One arrangement of the invention is directed to an RF probe for connecting to a signal launch. The RF probe includes a cabling portion for coupling to a cable, and a base portion attached to the cabling portion.
    Type: Grant
    Filed: October 20, 2000
    Date of Patent: September 17, 2002
    Assignee: Teradyne, Inc.
    Inventor: Marc Cartier
  • Patent number: 6449255
    Abstract: A technique manages packets in a data communications device having a memory using a real-time feedback signal. The technique involves transmitting an initial set of packets from the data communications device. The technique further involves monitoring transmission of the initial set of the packets from the data communications device, and providing the real-time feedback signal indicating transmission information regarding the initial set of packets. Additionally, the technique involves manipulating a new set of packets within the memory of the data communications device based on the real-time feedback signal, and transmitting the new set of packets from the data communications device based on how the new set of packets was manipulated within the memory of the data communications device. The use of the real-time feedback signal enables the data communications device to make on-the-fly adjustments to dynamically changing traffic patterns without the need for human intervention.
    Type: Grant
    Filed: April 26, 1999
    Date of Patent: September 10, 2002
    Assignee: Cisco Technology, Inc.
    Inventor: John G. Waclawsky
  • Patent number: 6430052
    Abstract: A circuit board assembly has (i) a circuit board including a section of circuit board material and a circuit board component mounted to the section of circuit board material, (ii) a support assembly that supports the circuit board, and (iii) a heatsink that cools the circuit board component mounted to the circuit board. The heatsink includes a receptacle that fastens to the support assembly, and an adjustable member that engages with the receptacle. The adjustable member is movable relative to the receptacle in order to control a distance between the adjustable member and the circuit board component. The adjustable member can be positioned properly (e.g., with the correct pressure) for proper heat transfer therethrough. Moreover, circuit board assembly can include multiple heatsinks for cooling multiple circuit board components with the adjustable member of each heatsink being individually adjusted to accommodate any tolerance differences between the circuit board components.
    Type: Grant
    Filed: May 8, 2001
    Date of Patent: August 6, 2002
    Assignee: Cisco Technology, Inc.
    Inventors: Kurt A. Kordes, John Mason, Nghi Luu
  • Patent number: 6398324
    Abstract: A bracket can selectively engage and disengage with a base in order to selectively secure and release a user station (e.g., a laptop computer configured to interface with a computer system) for access by a user (e.g., a system administrator). The use of the bracket enables a user station assembly to store the user station within a computer device cabinet in a compact manner, and subsequently unfold the user station assembly from the computer device cabinet for convenient access. In one arrangement, a user station assembly, includes a base, a support frame and a bracket which is pivotably attached to the support frame.
    Type: Grant
    Filed: March 17, 2000
    Date of Patent: June 4, 2002
    Assignee: EMC Corporation
    Inventor: Edward Claprood
  • Patent number: 6386435
    Abstract: The invention is directed to techniques for distributing solder paste using a tool that defines a solder paste aperture having a non-circular cross-sectional shape. When the non-circular shape coincides with a pad and at least a portion of a stringer leading to the pad during a solder paste distribution process, solder paste is deposited over the pad and the stringer portion. Since solder paste now resides on the stringer portion, solder is not drawn from the pad toward the stringer portion during the soldering process as with some conventional situations. Rather, solder within the solder paste that resides on the stringer portion tends to adhere to the stringer portion, while some of the solder volume over the stringer pulls back to join the solder over the pad due to surface tension of the solder. The end result is a robust solder joint between the pad and corresponding component contact.
    Type: Grant
    Filed: August 11, 2000
    Date of Patent: May 14, 2002
    Assignee: EMC Corporation
    Inventor: Stuart D. Downes
  • Patent number: 6385551
    Abstract: The invention is directed to techniques for obtaining a connection characteristic (e.g., pin wipe) of a connection assembly having a first set of contacts (e.g., pin-receiving contacts of circuit board connectors) and a second set of contacts (e.g., pins of backplane connectors) using less destructive approaches than a conventional disassembly approach. In particular, the invention does not rely on disassembling a backplane from a card cage and cutting connectors. Rather, in one arrangement, the invention uses a test structure in place of a normal operating circuit board. The test structure includes a support member (e.g., circuit board material) that supports the first set of contacts, and that is capable of moving relative to the second set of contacts. The test structure further includes a detection circuit, coupled to the support member, that detects an electrical event resulting from movement of the first set of contacts relative to the second set of contacts (e.g.
    Type: Grant
    Filed: July 5, 2000
    Date of Patent: May 7, 2002
    Assignee: EMC Corporation
    Inventor: Frank Rienzo
  • Patent number: 6356057
    Abstract: The invention is directed to techniques for testing a powerability characteristic of a backup power supply for a computerized device using a discharge circuit that is different than circuitry of the computerized device. The discharge circuit is capable of draining float charge of the backup power supply thus enabling a measuring circuit to properly determine whether the backup power supply is suitable for providing the operating power to the computerized device for the predetermined amount of time in the event the computerized device no longer receives main power from the main power supply. One arrangement of the invention is directed to a computer system that includes a computerized device, a main power supply that provides power to the computerized device, a backup power supply coupled to the main power supply to receive charge from the main power supply.
    Type: Grant
    Filed: September 15, 2000
    Date of Patent: March 12, 2002
    Assignee: EMC Corporation
    Inventors: Marcel Shilo, Eamonn O'Reilly
  • Patent number: 6356441
    Abstract: The invention is directed to latching techniques that respond to ergonomically pleasing user movements, and that are well-suited for maintaining low manufacturing costs. One arrangement of the invention is directed to a disk drive assembly having a housing, a disk drive attached to the housing, and a lever that secures the housing to and releases the housing from a main assembly. The lever includes a frame pivotably that is coupled to the housing at a pivot point that defines a pivot axis. The lever further includes a latch that is coupled to the frame. The latch selectively engages with the housing and disengages from the housing. The latch includes an actuation portion that requires movement in a direction along an axis that is substantially perpendicular to the pivot axis to disengage the latch from the housing. Accordingly, if the pivot axis is horizontally-oriented, a user can move the actuation portion in a vertical direction, e.g.
    Type: Grant
    Filed: April 18, 2000
    Date of Patent: March 12, 2002
    Assignee: EMC Corporation
    Inventor: Edward Claprood
  • Patent number: 6347734
    Abstract: The invention is directed to techniques for installing a module on a circuit board by simultaneously heating a perimeter portion of the module, and bringing an inner portion of the module to temperature that is lower than that of the perimeter portion. Heating the perimeter portion of the module melts solder disposed between contact members of the module and corresponding contact members of the circuit board in order to form solder connections. Bringing the inner portion of the module to temperature that is lower than that of the perimeter portion reduces the likelihood of causing heat-related damage to the module itself. One arrangement of the invention is directed to a module installation system for installing a module on a circuit board. The module has a perimeter portion and an inner portion. The module installation system includes a heating source, a cooling source, and a nozzle coupled to the heating and cooling sources.
    Type: Grant
    Filed: March 27, 2000
    Date of Patent: February 19, 2002
    Assignee: EMC Corporation
    Inventor: Stuart D. Downes