Patents Represented by Attorney David G. Pursel
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Patent number: 4839774Abstract: In a data processing system, the packages containing the electronic components are cooled by directing the cooling material through an array of nozzles toward the packages and components. The nozzles are fabricated in the circuit board, the flow of the coolant being the result of a difference in pressure of the coolant between the two sides of the circuit board. In the preferred embodiment, the nozzles are positioned directly below the component package. The component packages are removed from the surface of the circuit board, to which the component package is attached, to permit relatively uninhibited flow by the coolant past the component package. The nozzle arrays can be implemented to compensate for a non-uniform distribution of heat sources within a component package to provide a generally uniform temperature for the package or component.Type: GrantFiled: January 25, 1988Date of Patent: June 13, 1989Assignee: Digital Equipment CorporationInventor: William R. Hamburgen
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Patent number: 4800956Abstract: In order to provide thermal coupling of a package, particularly a package containing electronic components, and a heat sink, a thermal transfer assembly includes a first assembly having a group of generally parallel cooling fins coupled to the package. Coupled to the heat sink, such as cooling plate, is a second assembly also including a plurality of generally parallel cooling fins. The second set of cooling fins is positioned on the heat sink so that when the heat sink is in a predetermined position with respect to the package, the cooling fins overlap. The overlapping cooling fins permit efficient transfer of heat thus permitting heat generated in the package to be conveyed to the heat sink. The overlapping fins also permit convenient disassembly and reassembly for test and maintenance procedures. Techniques for fabrication of the thermal transfer assembly are described along with procedures for improving the operation of the heat transfer assembly.Type: GrantFiled: January 12, 1988Date of Patent: January 31, 1989Assignee: Digital Equipment CorporationInventor: William R. Hamburgen
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Patent number: 4447118Abstract: A system for transferring information via light signals from at least one station to at least one other station when the stations are generally capable of movement, one with respect to the other. In general, each station is capable of receiving and transmitting light signals through a light-conductor of light transparent material. At least one conical indentation is formed in the light conductor for the purpose of intercepting a portion of the light signals transmitted from one of the stations and reflecting the intercepted light signals to one of the other stations.Type: GrantFiled: September 21, 1981Date of Patent: May 8, 1984Assignee: The Boeing CompanyInventor: Owen R. Mulkey
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Patent number: 4377862Abstract: Error control, in the form of a modulo 2 division remainder checksum is added to a packet of reformatted asynchronous characters prior to transmission over a data link connecting two data devices such as a host computer and a teletype terminal. At one end of the link, data in asynchronous form, such as ASCII code, comprising seven data bits, start and stop bits, and a parity bit, is originated by one data device. The start, stop and parity bits of each character are eliminated. The remaining data bits for a selected number of characters are then grouped together to form a data grouping and the checksum and other control information bits added, forming an information packet. The information packet is then divided into sections or groups of eight bits. Start and stop bits are added to each group, forming ten bit characters. The ten bit characters are then transmitted over the data link in standard asynchronous format.Type: GrantFiled: December 6, 1978Date of Patent: March 22, 1983Assignee: The Boeing CompanyInventors: James S. Koford, William C. Jensen, Barry B. Woo
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Patent number: 4324981Abstract: A light transmission load control system including a light responsive load controller for controlling a load setable in two states in response to optical impulses generated by an optical impulse generator. The optical impulse generator includes a light-emitting device for emitting optical impulses in response to electrical impulses produced by an electrical impulse generator. In its simplest form, the electrical impulse generator has a single moving part for controlling and indicating the state in which the load is set.Type: GrantFiled: May 21, 1980Date of Patent: April 13, 1982Assignee: The Boeing CompanyInventor: Glen E. Miller
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Patent number: 4291905Abstract: A duct seal including a supporting assembly adapted to support a duct extending through an opening in a partition and a mounting assembly mountable by the partition for guiding and retaining the supporting assembly. The seal maintains a seal against overpressure while permitting the duct to shift bi-directionally lengthwise and about its axis rotatively and orbitally. The seal is particularly useful as an aircraft firewall duct seal.Type: GrantFiled: December 22, 1978Date of Patent: September 29, 1981Assignee: The Boeing CompanyInventor: Jesse C. E. Schrock
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Patent number: 4280221Abstract: A digital data communication system including a data source and a source interface, a digital data bus, for transferring encoded information from the data source to one or more receivers, each having a receiver interface. The source interface is adaptable for controlling the rise and fall times of the signals on the bus at a plurality of frequencies. It is directly coupled to the bus and terminates the bus in its characteristic impedance. The receiver interface operates at a plurality of frequencies and is directly coupled to the bus.Type: GrantFiled: May 31, 1979Date of Patent: July 21, 1981Assignee: The Boeing CompanyInventors: Randall K. B. Chun, Donn E. Larsen
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Patent number: 4199377Abstract: A solar cell including a dielectric isolation member to electrically isolate an active region of the cell from the unfinished edge thereof and to protect the p-n junction from surface contaminants. The isolation member is fabricated on top of a semiconductor wafer before diffusion.Type: GrantFiled: February 28, 1979Date of Patent: April 22, 1980Assignee: The Boeing CompanyInventors: Rudolph E. Corwin, Dietrich E. Riemer