Patents Represented by Attorney David Guglielmi

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  • Wirebond structure and method to connect to a microelectronic die
    Patent number: 7393772
    Abstract: A wirebond structure includes a copper pad formed on or in a surface of a microelectronic die. A conductive layer is included in contact with the copper pad and a bond wire is bonded to the conductive layer. The conductive layer is formed of a material to provide a stable contact between the bond wire and the copper pad in at least one of an oxidizing environment and an environment with temperatures up to at least about 350° C.
    Type: Grant
    Filed: December 1, 2004
    Date of Patent: July 1, 2008
    Assignee: Intel Corporation
    Inventors: Robert J. Gleixner, Donald Danielson, Patrick M. Paluda, Rajan Naik