Abstract: A support is provided for a component on a substrate to minimize unacceptable bending or displacement. In a preferred embodiment, a suitable amount of a thermoplastic material is injected through a hole in a PCB under the component after the component has been affixed to the PCB. This allows the support material to fill any space between the component and the PCB yet allow for variation in lead height and for thermal expansion of the support material.

Abstract: A probe card assembly includes a probe card, a space transformer having resilient contact structures (probe elements) mounted directly to (i.e., without the need for additional connecting wires or the like) and extending from terminals on a surface thereof, and an interposer disposed between the space transformer and the probe card. The space transformer and interposer are "stacked up" so that the orientation of the space transformer, hence the orientation of the tips of the probe elements, can be adjusted without changing the orientation of the probe card. Suitable mechanisms for adjusting the orientation of the space transformer, and for determining what adjustments to make, are disclosed. The interposer has resilient contact structures extending from both the top and bottom surfaces thereof, and ensures that electrical connections are maintained between the space transformer and the probe card throughout the space transformer's range of adjustment, by virtue of the interposer's inherent compliance.

Abstract: Resilient contact structures are mounted directly to bond pads on semiconductor dies, prior to the dies being singulated (separated) from a semiconductor wafer. This enables the semiconductor dies to be exercised (e.g., tested and/or burned-in) by connecting to the semiconductor dies with a circuit board or the like having a plurality of terminals disposed on a surface thereof. Subsequently, the semiconductor dies may be singulated from the semiconductor wafer, whereupon the same resilient contact structures can be used to effect interconnections between the semiconductor dies and other electronic components (such as wiring substrates, semiconductor packages, etc.). Using the all-metallic composite interconnection elements of the present invention as the resilient contact structures, burn-in can be performed at temperatures of at least 150.degree. C., and can be completed in less than 60 minutes.

Abstract: Resilient contact structures are mounted directly to bond pads on semiconductor dies, prior to the dies being singulated (separated) from a semiconductor wafer. This enables the semiconductor dies to be exercised (e.g., tested and/or burned-in) by connecting to the semiconductor dies with a circuit board or the like having a plurality of terminals disposed on a surface thereof. Subsequently, the semiconductor dies may be singulated from the semiconductor wafer, whereupon the same resilient contact structures can be used to effect interconnections between the semiconductor dies and other electronic components (such as wiring substrates, semiconductor packages, etc.). Using the all-metallic composite interconnection elements of the present invention as the resilient contact structures, burn-in can be performed at temperatures of at least 150.degree. C., and can be completed in less than 60 minutes.

Abstract: Method and apparatus for forming solder balls on electronic components and for forming solder joints between electronic components is described. A preform is fabricated having relatively large cross-section solder masses connected to one another by relatively small cross-section solder bridges. Upon reheating (reflow heating), the solder bridges melt first, and become subsumed into the solder masses. In instances where the preform is placed on a surface of an electronic component and reflowed, the solder masses become solder balls on pads of the electronic component. In instances where the preform is placed between two electronic components and reflowed, the solder masses become solder joints connecting the two electronic components. The preform may be prefabricated with a carrier, for later application to or between electronic components, and may be used to form solder balls on one or more unsingulated semiconductor dies on a semiconductor wafer.

Abstract: The efficacy of electrical discharges for severing bond wires and/or for forming balls at the ends of bond wires (including bond wires already severed by alternative mechanisms) is improved by performing the electrical discharges in the presence of ultraviolet light. A "spark gap" is formed between an EFO electrode and the wire, one of which serves as the cathode of the spark gap. Preferably, the ultraviolet light is directed at the element serving as the cathode of the spark gap. Providing photoemission at the cathode element of the spark gap stabilizes arc/plasma formation and produces more reliable and predictable results. This technique may be used in conjunction with negative EFO systems or with positive EFO systems, and may benefit from either direct or field-assisted photoemission.

Abstract: Surface-mount, solder-down sockets permit electronic components such as semiconductor packages to be releasably mounted to a circuit board. Resilient contact structures extend from a top surface of a support substrate, and solder-ball (or other suitable) contact structures are disposed on a bottom surface of the support substrate. Composite interconnection elements are used as the resilient contact structures disposed atop the support substrate. In any suitable manner, selected ones of the resilient contact structures atop the support substrate are connected, via the support substrate, to corresponding ones of the contact structures on the bottom surface of the support substrate. In an embodiment intended to receive a LGA-type semiconductor package, pressure contact is made between the resilient contact structures and external connection points of the semiconductor package with a contact force which is generally normal to the top surface of the support substrate.

Abstract: A signal delay apparatus delivers synchronous signals over long and short traces. For a signal that needs to be delayed because it will be carried on a relatively short trace, passing the signal through a clocked device such as a flip flop will delay the output by a selected number of clocks. If a relatively longer trace is longer than the shorter trace by the distance a signal travels during the selected number of clock cycles, then clock signals over the respective paths will be synchronized. In a preferred embodiment, the signals are clock signals from a clock generator.

Abstract: A method of designing improved CMOS input circuits by understanding and selecting appropriate drive strength for a CMOS output from a previous stage. The method involves modeling the net using HSPICE and including a transit time term to accurately model charge storage, then size drivers as needed to keep the V.sub.ss clamps out of forward conduction. Excessive ringing can cause data errors in the input stage if unterminated, falling edge transitions in such a net can turn on a receiver's V.sub.ss clamp diode (stored charge in the V.sub.ss clamp diode combined with the line's inductance and the receiver's capacitance form an energized resonant circuit which can release energy at a time to cause a data glitch). Currently, XNS simulation miscalculates the ring amplitude by a factor of three. Driver scaling and termination can eliminate the problem by keeping the receiver's V.sub.ss clamp out of forward conduction. Driver sizing can control the problem.

Abstract: A method and apparatus for formulating and responding to an inquiry through an interface which is topically organized. The dialogue system interface is comprised of various topical objects wherein each domain object has a set of object values. Selection of a desired object value of a domain object yields a set of potential inquiries, corresponding to the selected value, for selection. A selected inquiry is transmitted to an underlying system for formulation of a response. The formulated response of the underlying system is then transmitted to the user through the dialogue system interface. The dialogue system generates and displays further domain objects, object values, and inquiries that are logically anticipated from the selected inquiry.

Abstract: The present invention includes methods and apparatus for efficiently coupling an additional component to an electronic device. The invention is particularly useful in conjunction with modular electronic devices. An additional component may be mechanically and electrically coupled to a video electronic device. The added component is joined to the electronic device by a series of easy steps which include bringing the front bottom surface of the electronic device into contact with the front top surface of the added component and then rotating the rear surface of the electronic device, such that the front bottom surface of the electronic device is flush with the front top surface of the added component. The electronic device and added component include feet and receptors respectively that allow them to be easily aligned. Finally, the added component and electronic device are securely joined by a latch. Since the device and component are integral, the added device does not require a large amount of space.

Abstract: A user interface and corresponding algorithms allow a user to resize an object by manipulating a handle. In particular, the interface provides a large handle which is clearly oriented to suggest a direction of movement merely by its appearance. Each handle is noticeably wider than its associated edge, and oriented towards the interior of the object to clarify that this object is active. If one handle is moved towards the other handle, at some point, the handles would come into contact with each other. Since each handle is noticeably wider than its associated edge, this potential collision may occur at some distance from either edge, possibly limiting the range of motion of the edge. At least one, and preferably both, handles are displaced along each handle's respective edge so that the handles do not collide and so each handle can be brought closer to the opposite edge.