Patents Represented by Attorney David M. Sigmond
  • Patent number: 8178395
    Abstract: A method of making a semiconductor chip assembly includes providing a post, a base, a support layer and an underlayer, wherein the post extends above the base and the support layer is sandwiched between the base and the underlayer, mounting an adhesive on the base including inserting the post into an opening in the adhesive, mounting a conductive layer on the adhesive including aligning the post with an aperture in the conductive layer, then flowing the adhesive upward between the post and the conductive layer, solidifying the adhesive, then providing a conductive trace that includes a pad, a terminal and a selected portion of the conductive layer, providing a heat spreader that includes the post, the base, the underlayer and a thermal via that extends from the base through the support layer to the underlayer, then mounting a semiconductor device on the post, electrically connecting the semiconductor device to the conductive trace and thermally connecting the semiconductor device to the heat spreader.
    Type: Grant
    Filed: May 22, 2011
    Date of Patent: May 15, 2012
    Assignee: Bridge Semiconductor Corporation
    Inventors: Charles W. C. Lin, Chia-Chung Wang, Ming Yu Shih
  • Patent number: 8163603
    Abstract: A method of making a semiconductor chip assembly includes providing a post and a base, mounting an adhesive on the base including inserting the post through an opening in the adhesive, mounting a substrate on the adhesive including inserting the post into an aperture in the substrate, then flowing the adhesive between the post and the substrate in the aperture, solidifying the adhesive, then grinding the post and the adhesive, then mounting a semiconductor device on a heat spreader that includes the post and the base, electrically connecting the semiconductor device to the substrate and thermally connecting the semiconductor device to the heat spreader.
    Type: Grant
    Filed: November 21, 2011
    Date of Patent: April 24, 2012
    Assignee: Bridge Semiconductor Corporation
    Inventors: Charles W. C. Lin, Chia-Chung Wang
  • Patent number: 8153477
    Abstract: A method of making a semiconductor chip assembly includes providing first and second posts, first and second adhesives, first and second conductive layers and a dielectric base, wherein the first post extends from the dielectric base in a first vertical direction into a first opening in the first adhesive and is aligned with a first aperture in the first conductive layer, the second post extends from the dielectric base in a second vertical direction into a second opening in the second adhesive and is aligned with a second aperture in the second conductive layer and the dielectric base is sandwiched between and extends laterally from the posts, then flowing the first adhesive in the first vertical direction and the second adhesive in the second vertical direction, solidifying the adhesives, then providing a conductive trace that includes a pad, a terminal and selected portions of the conductive layers, wherein the pad extends beyond the dielectric base in the first vertical direction and the terminal extends
    Type: Grant
    Filed: July 30, 2011
    Date of Patent: April 10, 2012
    Assignee: Bridge Semiconductor Corporation
    Inventors: Charles W. C. Lin, Chia-Chung Wang
  • Patent number: 8148747
    Abstract: A semiconductor chip assembly includes a semiconductor device, a heat spreader, a conductive trace and an adhesive. The semiconductor device is electrically connected to the conductive trace and thermally connected to the heat spreader. The heat spreader includes a post, a base and a cap. The post extends upwardly from the base into an opening in the adhesive, the base extends below and laterally from the post, and the cap extends above and laterally from the post. The adhesive extends between the post and the conductive trace and between the base and the conductive trace. The conductive trace provides signal routing between a pad and a terminal and the heat spreader provides thermal dissipation between the cap and the base.
    Type: Grant
    Filed: November 28, 2009
    Date of Patent: April 3, 2012
    Assignee: Bridge Semiconductor Corporation
    Inventors: Charles W. C. Lin, Chia-Chung Wang, David M. Sigmond
  • Patent number: 8148207
    Abstract: A method of making a semiconductor chip assembly includes providing a post and a base, mounting an adhesive on the base including inserting the post into an opening in the adhesive, mounting a conductive layer on the adhesive including aligning the post with an aperture in the conductive layer, then flowing the adhesive into and upward in a gap located in the aperture between the post and the conductive layer, solidifying the adhesive, then providing a conductive trace that includes a pad, a terminal and a selected portion of the conductive layer, providing a cap on the post, mounting a semiconductor device on a heat spreader that includes the post, the base and the cap, electrically connecting the semiconductor device to the conductive trace and thermally connecting the semiconductor device to the heat spreader.
    Type: Grant
    Filed: November 30, 2009
    Date of Patent: April 3, 2012
    Assignee: Bridge Semiconductor Corporation
    Inventors: Charles W. C. Lin, Chia-Chung Wang, David M. Sigmond
  • Patent number: 8129742
    Abstract: A semiconductor chip assembly includes a semiconductor device, a heat spreader, a conductive trace and an adhesive. The heat spreader includes a post and a base. The conductive trace includes a pad, a terminal and a plated through-hole. The semiconductor device is electrically connected to the conductive trace and thermally connected to the heat spreader. The post extends upwardly from the base into an opening in the adhesive, and the base extends laterally from the post. The conductive trace provides signal routing between the pad and the terminal using the plated through-hole.
    Type: Grant
    Filed: April 2, 2011
    Date of Patent: March 6, 2012
    Assignee: Bridge Semiconductor Corporation
    Inventors: Charles W. C. Lin, Chia-Chung Wang
  • Patent number: 8110446
    Abstract: A method of making a semiconductor chip assembly includes providing a post and a base, mounting an adhesive on the base including inserting the post into an opening in the adhesive, mounting a conductive layer on the adhesive including aligning the post with an aperture in the conductive layer, then flowing the adhesive into and upward in a gap located in the aperture between the post and the conductive layer, solidifying the adhesive, then providing a conductive trace that includes a pad, a terminal and a selected portion of the conductive layer, mounting a semiconductor device on a heat spreader that includes the post and the base, electrically connecting the semiconductor device to the conductive trace and thermally connecting the semiconductor device to the heat spreader.
    Type: Grant
    Filed: November 13, 2009
    Date of Patent: February 7, 2012
    Assignee: Bridge Semiconductor Corporation
    Inventors: Charles W. C. Lin, Chia-Chung Wang
  • Patent number: 8076182
    Abstract: A method of making a semiconductor chip assembly includes providing a post and a base, mounting an adhesive on the base including inserting the post into an opening in the adhesive, mounting a substrate on the adhesive including aligning the post with an aperture in the substrate, then flowing the adhesive into and upward in a gap located in the aperture between the post and the substrate, solidifying the adhesive, then etching the post to form a cavity in the adhesive above the post, then mounting a semiconductor device on the post, wherein a heat spreader includes the post and the base and the semiconductor device extends into the cavity, electrically connecting the semiconductor device to the substrate and thermally connecting the semiconductor device to the heat spreader.
    Type: Grant
    Filed: February 28, 2010
    Date of Patent: December 13, 2011
    Assignee: Bridge Semiconductor Corporation
    Inventors: Charles W. C. Lin, Chia-Chung Wang, Sangwhoo Lim
  • Patent number: 8067784
    Abstract: A semiconductor chip assembly includes a semiconductor device, a heat spreader, a substrate and an adhesive. The semiconductor device is electrically connected to the substrate and thermally connected to the heat spreader. The heat spreader includes a post and a base. The post extends upwardly from the base into an opening in the adhesive and an aperture in the substrate, and the base extends laterally from the post. The adhesive extends between the post and the substrate and between the base and the substrate. The assembly provides signal routing between a pad and a terminal.
    Type: Grant
    Filed: November 11, 2009
    Date of Patent: November 29, 2011
    Assignee: Bridge Semiconductor Corporation
    Inventors: Charles W. C. Lin, Chia-Chung Wang
  • Patent number: 8067270
    Abstract: A method of making a semiconductor chip assembly includes providing a post and a base, mounting an adhesive on the base including inserting the post through an opening in the adhesive, mounting a substrate on the adhesive including inserting the post into an aperture in the substrate to form a gap in the aperture between the post and the substrate, then flowing the adhesive into and upward in the gap, solidifying the adhesive, then mounting a semiconductor device on a heat spreader that includes the post and the base, electrically connecting the semiconductor device to the substrate and thermally connecting the semiconductor device to the heat spreader.
    Type: Grant
    Filed: November 13, 2009
    Date of Patent: November 29, 2011
    Assignee: Bridge Semiconductor Corporation
    Inventors: Charles W. C. Lin, Chia-Chung Wang
  • Patent number: 8062912
    Abstract: A method of making a semiconductor chip assembly includes providing a post and a base, mounting an adhesive on the base including inserting the post through an opening in the adhesive, mounting a substrate on the adhesive including inserting the post into an aperture in the substrate to form a gap in the aperture between the post and the substrate, then flowing the adhesive into and upward in the gap, solidifying the adhesive, then mounting a semiconductor device on a heat spreader that includes the post and the base, electrically connecting the semiconductor device to the substrate and thermally connecting the semiconductor device to the heat spreader. The substrate includes first and second conductive layers and a dielectric layer therebetween and provides horizontal signal routing between a pad and a terminal at the first conductive layer.
    Type: Grant
    Filed: September 13, 2009
    Date of Patent: November 22, 2011
    Assignee: Bridge Semiconductor Corporation
    Inventors: Chia-Chung Wang, Charles W. C. Lin
  • Patent number: 8034645
    Abstract: A method of making a semiconductor chip assembly includes providing a post and a base that include a copper surface layer and an aluminum core, mounting an adhesive on the base including inserting the post into an opening in the adhesive, mounting a conductive layer on the adhesive including aligning the post with an aperture in the conductive layer, then flowing the adhesive into and upward in a gap located in the aperture between the post and the conductive layer, solidifying the adhesive, then providing a conductive trace that includes a pad, a terminal and a selected portion of the conductive layer, mounting a semiconductor device on a heat spreader that includes the post and the base, electrically connecting the semiconductor device to the conductive trace and thermally connecting the semiconductor device to the heat spreader.
    Type: Grant
    Filed: November 30, 2009
    Date of Patent: October 11, 2011
    Assignee: Bridge Semiconductor Corporation
    Inventors: Charles W. C. Lin, Chia-Chung Wang
  • Patent number: 8003415
    Abstract: A method of making a semiconductor chip assembly includes providing a post and a base, mounting an adhesive on the base including inserting the post through an opening in the adhesive, mounting a substrate on the adhesive including inserting the post into an aperture in the substrate to form a gap in the aperture between the post and the substrate, then flowing the adhesive into and upward in the gap, solidifying the adhesive, then mounting a semiconductor device on a heat spreader that includes the post and the base, electrically connecting the semiconductor device to the substrate and thermally connecting the semiconductor device to the heat spreader. The substrate includes first and second conductive layers and a dielectric layer therebetween, and the assembly provides the vertical signal routing between a pad at the first conductive layer and a terminal below the adhesive.
    Type: Grant
    Filed: September 13, 2009
    Date of Patent: August 23, 2011
    Assignee: Bridge Semiconductor Corporation
    Inventors: Chia-Chung Wang, Charles W. C. Lin
  • Patent number: 8003416
    Abstract: A method of making a semiconductor chip assembly includes providing a post and a base, mounting a first adhesive on the base including inserting the post through an opening in the first adhesive, mounting a conductive layer on the base including aligning the post with an aperture in the conductive layer, providing a conductive trace that includes a pad, a terminal and a selected portion of the conductive layer, then flowing a second adhesive into and downward in a gap between the post and the conductive trace, solidifying the second adhesive, then mounting a semiconductor device on a heat spreader that includes the post and the base, electrically connecting the semiconductor device to the conductive trace and thermally connecting the semiconductor device to the heat spreader.
    Type: Grant
    Filed: April 14, 2010
    Date of Patent: August 23, 2011
    Assignee: Bridge Semiconductor Corporation
    Inventors: Charles W. C. Lin, Chia-Chung Wang, Sangwhoo Lim
  • Patent number: 7993983
    Abstract: A method of making a semiconductor chip assembly includes mechanically attaching a semiconductor chip to a routing line, then forming an encapsulant that covers the chip, then grinding the encapsulant without grinding the chip and then grinding the encapsulant and the chip such that the encapsulant and the chip are laterally aligned.
    Type: Grant
    Filed: October 26, 2006
    Date of Patent: August 9, 2011
    Assignee: Bridge Semiconductor Corporation
    Inventor: Charles W. C. Lin
  • Patent number: 7951622
    Abstract: A method of making a semiconductor chip assembly includes providing a thermal post, a signal post and a base, mounting an adhesive on the base including inserting the thermal post into a first opening in the adhesive and the signal post into a second opening in the adhesive, mounting a conductive layer on the adhesive including aligning the thermal post with a first aperture in the conductive layer and the signal post with a second aperture in the conductive layer, then flowing the adhesive into and upward in a first gap located in the first aperture between the thermal post and the conductive layer and in a second gap located in the second aperture between the signal post and the conductive layer, solidifying the adhesive, then providing a conductive trace that includes a pad, a terminal, the signal post and a selected portion of the conductive layer, mounting a semiconductor device on a heat spreader that includes the thermal post and the base, electrically connecting the semiconductor device to the conduct
    Type: Grant
    Filed: December 21, 2009
    Date of Patent: May 31, 2011
    Assignee: Bridge Semiconductor Corporation
    Inventors: Charles W. C. Lin, Chia-Chung Wang
  • Patent number: 7948076
    Abstract: A semiconductor chip assembly includes a semiconductor device, a heat spreader, a substrate and an adhesive. The semiconductor device is electrically connected to the substrate and thermally connected to the heat spreader. The heat spreader includes a post and a base. The post extends upwardly through an opening in the adhesive into an aperture in the substrate, and the base extends laterally and supports the substrate. The adhesive extends between the post and the substrate and between the base and the substrate. The substrate includes first and second conductive layers and a dielectric layer therebetween, and the assembly provides vertical signal routing between a pad at the first conductive layer and a terminal below the adhesive.
    Type: Grant
    Filed: September 11, 2009
    Date of Patent: May 24, 2011
    Inventors: Chia-Chung Wang, Charles W. C. Lin
  • Patent number: 7939375
    Abstract: A method of making a semiconductor chip assembly includes providing a post and a base, mounting an adhesive on the base including inserting the post into an opening in the adhesive, mounting a substrate on the adhesive including aligning the post with an aperture in the substrate, then flowing the adhesive into and upward in a gap located in the aperture between the post and the substrate, solidifying the adhesive, then etching the post to form a cavity in the post, then mounting a semiconductor device on the post, wherein a heat spreader includes the post and the base and the semiconductor device extends into the cavity, electrically connecting the semiconductor device to the substrate and thermally connecting the semiconductor device to the heat spreader.
    Type: Grant
    Filed: February 28, 2010
    Date of Patent: May 10, 2011
    Assignee: Bridge Semiconductor Corporation
    Inventors: Charles W. C. Lin, Chia-Chung Wang, Sangwhoo Lim
  • Patent number: 7932165
    Abstract: A method of making a semiconductor chip assembly includes providing a metal base, a routing line, a bumped terminal and a filler, wherein the routing line contacts the bumped terminal and the filler, then mechanically attaching a semiconductor chip to the metal base, the routing line, the bumped terminal and the filler, then forming an encapsulant, then etching the metal base to expose the bumped terminal, then etching the bumped terminal to expose the filler, then forming an insulative base, and then grinding the insulative base to expose the filler.
    Type: Grant
    Filed: November 27, 2006
    Date of Patent: April 26, 2011
    Assignee: Bridge Semiconductor Corporation
    Inventors: Charles W. C. Lin, Cheng-Chung Chen
  • Patent number: 7901993
    Abstract: A method of making a semiconductor chip assembly includes providing a post and a base, mounting an adhesive on the base including inserting the post into an opening in the adhesive, mounting a copper layer on the adhesive including aligning the post with an aperture in the copper layer, then flowing the adhesive into and upward in a gap located in the aperture between the post and the copper layer, solidifying the adhesive, then providing a conductive trace that includes a pad, a terminal, a silver coating and a copper core that is a selected portion of the copper layer, mounting a semiconductor device on the post, wherein an aluminum heat spreader includes the post and the base, electrically connecting the semiconductor device to the conductive trace and thermally connecting the semiconductor device to the heat spreader.
    Type: Grant
    Filed: March 12, 2010
    Date of Patent: March 8, 2011
    Assignee: Bridge Semiconductor Corporation
    Inventors: Charles W. C. Lin, Chia-Chung Wang