Abstract: A precise volume, precisely registerable carrier is provided for use with injection molding for producing integrated circuit bump contacts in the “flip chip” technology. A hemispherical cavity is produced by etching through and undercutting a registered opening into a transparent carrier. The hemispherical cavity has related specific volume and visible peripheral shape that permits simple optical quality control when the injection molding operation has filled the cavity and simple optical registration for fusing to the pads on the integrated circuit.
Type:
Grant
Filed:
May 24, 2000
Date of Patent:
December 25, 2001
Assignee:
International Business Machines Corporation
Inventors:
Steven A. Cordes, Peter Alfred Gruber, Egon Max Kummer, Stephen Roux, Carlos Juan Sambucetti, James Louis Speidell