Abstract: A wire comb for mounting individual wires from multi-wire cables onto circuit boards that is mounted adjacent one or more ends of a circuit board to permit the individual wires to be spaced apart yet held in place during an over molding process; and to permit connecting the wires to the appropriate connections on the circuit board.
Type:
Grant
Filed:
August 2, 2006
Date of Patent:
October 2, 2007
Assignee:
Avocent Corporation
Inventors:
Steven F. Brown, Robert V. Seifert, Jr., Philip M. Kirshtein
Abstract: An approach is provided for mounting individual wires from multi-wire cables onto circuit boards. A wire comb is mounted adjacent one or more ends of the circuit board to permit a way to space apart individual wires, to hold them in place; and to permit welding or soldering of the wires to the appropriate connections or the circuit board during an overmolding process.
Type:
Grant
Filed:
December 7, 2005
Date of Patent:
March 13, 2007
Assignee:
Avocent Corporation
Inventors:
Steven F. Brown, Robert V. Seifert, Jr., Philip M. Kirshtein