Abstract: A hydraulic power source has a main body with a valve body and a valve assembly disposed in it. A reservoir and pump body assembly is connected to a top surface of the main body, and a hydraulic piston/cylinder assembly is connected to a bottom surface of the main body. A hydraulic circuit connects the various elements for fluid flow. The hydraulic power source is compact and can be located remotely on, for example a vehicle, at a point near an object or part to be moved.
Abstract: A patient support is disclosed having a contoured upper body support with an integral lumbar support area. The lower body support is curved at the knee and likewise contoured for patient comfort. The upper body support is pivotally attached to the lower body support at a point simulating the pivotal location of the human hip. A drive linkage raises the toe area of the lower body support simultaneously with, but only for the initial reclining movement of the upper body support, maintaining the oral cavity in fixed relation to the head support. Arm supports are upwardly rotatable from a down, locked position to an up, unlocked position. The patient support has automatic recline and sit-up mechanisms with emergency stop circuitry.
Type:
Grant
Filed:
November 5, 1982
Date of Patent:
September 17, 1985
Assignee:
Syntex (U.S.A.) Inc.
Inventors:
James H. Broadhead, Lawrence A. Wilbur, Ivan E. Sams
Abstract: A transversely pleated, longitudinally heat-shrinkable tape is made from a heat-shrinkable polymeric film. One side of the tape may be adhesive-coated, and the other side may be coated with a thermochromic paint. The tape is wrapped around a substrate, and is particularly adapted, by reason of the pleats, to be wrapped around a substrate of non-uniform cross-section, e.g. a splice in a telephone cable. On heating the tape to its recovery temperature, the pleats disappear and the tape shrinks longitudinally to tightly cover the substrate. The tape may additionally comprise integral heating means.
Abstract: A patch closure system for joining heat recoverable sheet material, especially for covering a substrate where the joined material is to be recovered around the substrate, comprises a layer of adhesive on one surface, a part of which is a pressure-sensitive adhesive and the remainder of which is a heat-activatable adhesive. The pressure-sensitive adhesive layer is of such an area and is placed such that, when the patch is placed over the overlap between the edges of the heat recoverable sheet material, the patch will continue to cover the overlap when the sheet material is recovered, even if the heat-activatable adhesive layer has not been used to attach the patch to the sheet material.
Abstract: An apparatus for monitoring the value of one or more physical parameters, the apparatus including a plurality of physical monitoring modules, master electronics, and structure for interconnecting each of the modules and the master electronics. Each module includes a logic section and a transducer section. The logic section receives a logic signal and responds by activating the transducer. The logic signal is passed to the next module according to a clock pulse which is generated from the master electronics. The transducer senses a physical parameter. When activated, the transducer responds to the physical parameter with an electrical signal and communicates the electrical signal to the master electronics which utilizes the electrical signal for monitoring purposes.
Type:
Grant
Filed:
September 18, 1981
Date of Patent:
November 1, 1983
Assignee:
Raychem Corporation
Inventors:
Michael A. Lutz, Howard B. Kroymann, Abdul M. Tayeb, Edward H. Softky
Abstract: A connector device comprises first and second layers of substantially cross-linkable material, the first layer having inserts in contact therewith, the second layer having been expanded and thereafter formed into working and bonding zones, and the sheets being bonded together at the bonding zones for acceptance of substrates to be connected. The device is so constructed that the working zone center-to-center spacing remains constant on recovery.
Abstract: A method and apparatus for sealing the end of a conductive polymeric strip heater, especially one for immersion use, greatly reduces the possibility of failure due to fluid ingress.
Abstract: A solder delivery system has a continuous element of solder material disposed between two polymeric layers, one of which is provided with window means to control the flow of solder. The layers may be separate pieces, or may be parts of a folded sheet or a tube of polymeric material. In use, the conductors to be soldered are placed on corresponding terminals of a connector body and the system placed in contact with and perpendicular to the conductors, with the side having the window means towards the conductors. On the application of heat and pressure, the solder melts and flows toward the terminals, and solder bridges are prevented by the "window frames" which lie between the terminals.
Type:
Grant
Filed:
June 9, 1980
Date of Patent:
October 19, 1982
Assignee:
Raychem Corporation
Inventors:
Willie K. Grassauer, William M. Robinson
Abstract: A composite connector for electrical conductors has a heat-shrinkable terminator for each conductor. Each terminator is secured to the connector body, and a guide and stop for each conductor are formed within each terminator. The method of manufacture involves the shrinkage of each terminator over the connector body and a forming mandrel.
Abstract: Nickel/titanium alloys containing less than a stoichiometric quantity of titanium, which are capable of having the property of heat recoverability imparted thereto at a temperature above the boiling point of liquid nitrogen, may be stabilized by the addition of from 1.5 to 9 atomic percent copper. These stabilized alloys also possess improved workability and machinability.
Abstract: A sealing cover for an hermetically sealed container comprises an environmentally resistant metal lid, an intermediate plated metallic "picture frame", and a solder deposit metallurgically bonded to that "frame". Such a cover is particularly adapted for the sealing of semiconductor packages, and is especially advantageous in that it need not employ precious metals.