Abstract: A method of forming a lithium orthophosphate sputter target or tile and resulting target material is presented. The target is fabricated from a pure lithium orthophosphate powder refined to a fine powder grain size. After steps of consolidation into a ceramic body, packaging and degassing, the ceramic body is densified to high density, and transformed into a stable single phase of pure lithium orthophosphate under sealed atmosphere. The lithium orthophosphate target is comprised of a single phase, and can preferably have a phase purity greater than 95% and a density of greater than 95%.

Abstract: The present invention relates to a stimulus-indicating device. More particularly, the present invention relates to an apparatus for evidencing when a stimulus sensitive product has been exposed to a designated or predetermined stimulus for a certain period of time, and the invention relates to a method for manufacturing aspects of that apparatus.

Abstract: The present invention relates to a stimulus-indicating device. More particularly, the present invention relates to an apparatus and method for evidencing when a product has been exposed to a designated stimulus for a certain period of time.

Abstract: The present invention relates to masking techniques and apparatuses, and in particular, to a method and apparatus for masking a flexible substrate to be coated with one or more material layers. The method involves flexing a substrate to provide a curved surface and providing a flexible sheet on the curved surface to properly apply a coating on the surface of the substrate. The apparatus includes a substrate and a flexible sheet. An elastic material, such as a spring pin, or an off-axis roll-down bar may be used to create the tension used to flex the substrate and or flexible sheet.

Abstract: The present invention relates to apparatus, compositions and methods of fabricating high performance thin-film batteries on metallic substrates, polymeric substrates, or doped or undoped silicon substrates by fabricating an appropriate barrier layer composed, for example, of barrier sublayers between the substrate and the battery part of the present invention thereby separating these two parts chemically during the entire battery fabrication process as well as during any operation and storage of the electrochemical apparatus during its entire lifetime. In a preferred embodiment of the present invention thin-film batteries fabricated onto a thin, flexible stainless steel foil substrate using an appropriate barrier layer that is composed of barrier sublayers have uncompromised electrochemical performance compared to thin-film batteries fabricated onto ceramic substrates when using a 700° C. post-deposition anneal process for a LiCoO2 positive cathode.

Abstract: The present invention relates to apparatus, compositions and methods of fabricating high performance thin-film batteries on metallic substrates, polymeric substrates, or doped or undoped silicon substrates by fabricating an appropriate barrier layer composed, for example, of barrier sublayers between the substrate and the battery part of the present invention thereby separating these two parts chemically during the entire battery fabrication process as well as during any operation and storage of the electrochemical apparatus during its entire lifetime. In a preferred embodiment of the present invention thin-film batteries fabricated onto a thin, flexible stainless steel foil substrate using an appropriate barrier layer that is composed of barrier sublayers have uncompromised electrochemical performance compared to thin-film batteries fabricated onto ceramic substrates when using a 700° C. post-deposition anneal process for a LiCoO2 positive cathode.

Abstract: In accordance with the present invention, deposition of LiCoO2 layers in a pulsed-dc physical vapor deposition process is presented. Such a deposition can provide a low-temperature, high deposition rate deposition of a crystalline layer of LiCoO2 with a desired (101) or (003) orientation. Some embodiments of the deposition addresses the need for high rate deposition of LiCoO2 films, which can be utilized as the cathode layer in a solid state rechargeable Li battery. Embodiments of the process according to the present invention can eliminate the high temperature (>700° C.) anneal step that is conventionally needed to crystallize the LiCoO2 layer. Some embodiments of the process can improve a battery utilizing the LiCoO2 layer by utilizing a rapid thermal anneal process with short ramp rates.

Abstract: The present invention relates to a stimulus-indicating device. More particularly, the present invention relates to an apparatus and method for evidencing when a product has been exposed to a designated stimulus for a certain period of time.

Abstract: The present invention relates to circuit boards with radially arrayed components. One specific embodiment is a memory circuit board with memory components, such as, for example, DRAM chips, radially arrayed around a central point. The present invention also relates to stacking and connecting multiple circuit boards with radially arrayed components. Another embodiment of the invention involves methods of preparing radially arrayed components on a circuit board module with substantially equidistant paths to the components.

Abstract: An improved multi-chip module includes a circuit board having an array of electrical interconnection pads to which are mounted a plurality of IC package units. Each IC package unit includes multiple IC packages, which are mounted on opposite sides of a package carrier. The package units may be mounted on one or both sides of the circuit board. A variety of package carriers are used to create a number of different modules. One type of package carrier has a pair of major planar surfaces. Each planar surface incorporates electrical contact pads. At least one IC package is surface mounted on each major planar surface, by interconnecting the connection elements, or leads, of the package with the contact pads on the planar surface, to form the IC package unit. Another type of package carrier substrate has a multiple recesses for back-to-back surface mounting of the IC packages. The package also includes in various versions heat sinks.

Abstract: A method and apparatus for fabricating a three dimensional array of semiconductor chips is disclosed. The method uses a multiple step fabrication process that automates the surface mounting of semiconductor chips with unique chip carriers to achieve the three dimensional array of chips. The method can include the steps of depositing solder on one or more chip modules, placing and interconnecting low-cost components on the chip modules, and storing the preprocessed chip modules in pallets or in a tape and reel. Later these chip carriers may then be mounted on a circuit board, possibly over; for example, low and/or high cost components and then populated with low and/or high cost components. The apparatus includes a unique stackable chip module pallet and print fixture pedestal.