Patents Represented by Attorney, Agent or Law Firm Dicke, Billig & Czaja
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Patent number: 8313489Abstract: A surgical micro-burring instrument including an outer tubular member coaxially maintaining an inner tubular member. The outer tubular member defines a proximal section, a distal section, and a central lumen extending from the proximal section to the distal section. The distal section forms a pocket and an elevator tip. The pocket has a bottom wall and an opposed upper opening. The elevator tip extends distal the pocket. The inner tubular member forms a bur received within the pocket. Upon final assembly, at least a portion of the bur is exposed relative to the outer tubular member via the upper opening of the pocket. The elevator tip is configured to facilitate lifting of soft tissue, such as mucosa, while positioning the bur, via the pocket, in an appropriate location for cutting contacted harder tissue, such as turbinate bone or septal bone/cartilage.Type: GrantFiled: August 9, 2010Date of Patent: November 20, 2012Assignee: Medtronic Xomed, Inc.Inventors: Kenneth M. Adams, Cecil O. Lewis
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Patent number: 8313321Abstract: A mold assembly for manufacturing concrete blocks in an automated dry-cast block machine. The mold assembly includes a plurality of liner plates which together form a mold cavity, wherein at least one of the liner plates includes an internal network of shafts which is configured to receive and provide a flow path for heated fluid to pass through to heat the at least one liner plate.Type: GrantFiled: June 7, 2010Date of Patent: November 20, 2012Assignee: Ness Inventions Inc.Inventors: John T. Ness, Jeffrey A. Ness
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Patent number: 8313762Abstract: The invention provides a flexible bioresorbable foam having hemostatic properties. The foam is formed from a carboxymethylcellulose suspension.Type: GrantFiled: July 5, 2006Date of Patent: November 20, 2012Assignee: Medtronic Xomed, Inc.Inventors: Dana A. Oliver, Matthew J. Halvorsen, Aimee Hodge
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Patent number: 8314447Abstract: A semiconductor including a lateral HEMT and to a method for production of a lateral HEMT is disclosed. In one embodiment, the lateral HEMT has a substrate and a first layer, wherein the first layer has a semiconductor material of a first conduction type and is arranged at least partially on the substrate. Furthermore, the lateral HEMT has a second layer, wherein the second layer has a semiconductor material and is arranged at least partially on the first layer. In addition, the lateral HEMT has a third layer, wherein the third layer has a semiconductor material of a second conduction type, which is complementary to the first conduction type, and is arranged at least partially in the first layer.Type: GrantFiled: April 21, 2010Date of Patent: November 20, 2012Assignee: Infineon Technologies Austria AGInventors: Franz Hirler, Walter Rieger, Markus Zundel
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Patent number: 8307825Abstract: A membrane oxygen humidifier including at least one water permeable membrane, an enclosure having an air inlet port and an air outlet port and a fan. The at least one water permeable membrane extends through the enclosure. The fan is positioned proximate at least one of the air inlet port and the air outlet port.Type: GrantFiled: March 11, 2009Date of Patent: November 13, 2012Assignee: Corad Healthcare, Inc.Inventor: Keith A. Roberts
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Patent number: 8307826Abstract: A method of providing a source of breathable humidified oxygen gas. A membrane oxygen humidifier is provided that includes at least one water permeable membrane and an enclosure. The at least one water permeable membrane has a first membrane side and a second membrane side that are in communication through the water permeable membrane. The enclosure extends over the second membrane side and wherein the enclosure has an air inlet port and an air outlet port. A first gas containing oxygen is directed past the first membrane side. The second gas is directed past the second membrane side with a fan. The first gas is humidified by transferring moisture through the at least one water permeable membrane from the second gas to the first gas.Type: GrantFiled: August 23, 2012Date of Patent: November 13, 2012Assignee: Corad Healthcare, Inc.Inventor: Keith A. Roberts
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Patent number: 8305793Abstract: An integrated circuit includes an array of resistance changing memory cells, and a circuit configured to apply an initialization signal to a first one of the memory cells that is in a virgin resistance state. The initialization signal is configured to modify the first memory cell without switching an operation state of the first memory cell.Type: GrantFiled: May 16, 2008Date of Patent: November 6, 2012Assignee: Qimonda AGInventors: Petra Majewski, Jan Boris Philipp
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Patent number: 8304884Abstract: A semiconductor device includes a metal carrier and a spacer element attached to the metal carrier. The semiconductor device includes a first sintered metal layer on the spacer element and a semiconductor chip on the first sintered metal layer.Type: GrantFiled: March 11, 2009Date of Patent: November 6, 2012Assignee: Infineon Technologies AGInventors: Ivan Nikitin, Joachim Mahler, Thomas Behrens
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Patent number: 8305834Abstract: A semiconductor memory including a plurality of memory banks disposed on an integrated circuit, each memory bank including an array of memory cells, wherein a first portion of memory cells of the plurality of memory banks has a first access speed and a second portion of memory cells of the plurality of memory banks has a second access speed, wherein the first access speed is different from the second access speed.Type: GrantFiled: February 23, 2010Date of Patent: November 6, 2012Assignee: Qimonda AGInventors: Michael Richter, Markus Balb, Christoph Bilger, Martin Brox, Peter Gregorius, Thomas Hein, Andreas Schneider
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Patent number: 8297887Abstract: A block having a top surface, a bottom surface opposing the top surface, a front surface, a rear surface opposing the front surface, the front and rear surfaces extending between the top and bottom surfaces, a first side surface, a second side surface opposing the first side surface, the first and second side surfaces extending between the front and rear surfaces, and a set of at least three leveling pads extending from the rear surface.Type: GrantFiled: October 14, 2008Date of Patent: October 30, 2012Assignee: Ness Inventions, Inc.Inventors: John T. Ness, Jeffrey A. Ness
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Patent number: 8301264Abstract: A thermal therapy of body tissue with electromagnetic energy is controlled by feedback from one or more temperature sensors placed in the vicinity of the tissue to be treated. The temperature sensors are calibrated by comparing stabilized temperature values of the one or more temperature sensors against a normal range of body temperature and adjusting sensed temperature to a value within a normal body temperature range if the actual temperature value of a stabilized temperature sensor is less than the normal body temperature range. The temperature adjustment to the temperature sensor is maintained throughout the thermal therapy which reduces the risk of thermal damage to healthy tissue located near the tissue to be treated.Type: GrantFiled: April 27, 2009Date of Patent: October 30, 2012Assignee: Urologix, Inc.Inventors: Jonathan Achenbach, James E. Burgett, Claude Tihon, Allen Putnam
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Patent number: 8298953Abstract: A method includes depositing a material layer over a semiconductor substrate and using a first mask in a first exposure/patterning process to pattern the material layer thereby forming a plurality of first and second features. The first features include patterns for the semiconductor device and the second features include printing assist features. The method includes using a second mask in a second exposure/patterning process to effectively remove the second features from the material layer and to define at least one separating structure between two first features.Type: GrantFiled: December 20, 2010Date of Patent: October 30, 2012Assignee: Infineon Technologies AGInventor: Henning Haffner
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Patent number: 8298168Abstract: An implantable medical device is disclosed that includes a valve seat and a valve member movable with respect to the valve seat. An adjustment circuit assembly includes a resistive element that is coupled to the valve member and operable to position the valve member relative to the valve seat so as to alter the pressure setting in response to a current applied to the resistive element. A reading circuit assembly includes an antenna coil, a sensing coil and a member moveable with respect to the sensing coil, the member configured to alter a resonant frequency of the reading circuit assembly as a function of a position of the member with respect to the sensing coil.Type: GrantFiled: January 27, 2011Date of Patent: October 30, 2012Assignee: Medtronic Xomed, Inc.Inventors: William Jeffrey Bertrand, Robert K. Vaccaro, Chun Man Alan Leung, Michael Ayoub, Pierre Jaquier, Laetitia Mayor, Thomas Junker, Guillaume Schmit
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Patent number: 8299820Abstract: A circuit for actuation of a transistor. One embodiment provides an actuation output for connection to the actuation connection of the transistor. A measurement arrangement is provided for ascertaining a load current flowing through the load path or a voltage across the load path and for providing a measurement signal. An actuation current source having an actuation current output is connected to the actuation output and supplied with the measurement signal and designed to produce an actuation current at the actuation current output. The actuation current is at a current level dependent on the measurement signal.Type: GrantFiled: September 30, 2008Date of Patent: October 30, 2012Assignee: Infineon Technologies Austria AGInventor: Gerald Deboy
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Patent number: 8299905Abstract: A system 1 for applying tactile stimulation to the controller of a remote vehicle. The system 1 includes one or more sensors 2 disposed on the remote vehicle and configured to measure a physical property of the remote vehicle and generate output data indicative thereof. A transmitter 3 is disposed in the remote vehicle and is in communication with the sensor(s) 2 to receive the output data where the transmitter 3 is configured to send the output data to the controller at a remote location. The system 1 further includes a tactile stimulator 4 configured to be placed in directly or indirectly in contact with a skin surface of the controller of the remote vehicle to whom an output of the tactile stimulation is to be provided. The tactile stimulator 4 is in communication with the output of the sensor 2 to deliver tactile stimulation corresponding to the magnitude of the sensed physical property.Type: GrantFiled: April 9, 2009Date of Patent: October 30, 2012Inventor: Quentin King
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Patent number: 8299585Abstract: A power semiconductor device having a first active semiconductor component and a second active semiconductor component, the electrical connections of which are routed out of the semiconductor components in the form of connecting legs is disclosed. In one embodiment, the first semiconductor component is at least partially electrically connected to the second semiconductor component by means of a plug-in connection. The plug-in connection is realized by virtue of the connecting legs of the second semiconductor component engaging in the electrical connections of the first semiconductor component.Type: GrantFiled: May 4, 2005Date of Patent: October 30, 2012Assignee: Infineon Technologies AGInventor: Ralf Otremba
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Patent number: 8299824Abstract: A system including a sensing system, a first chopped circuit, a second chopped circuit, and a clock generator. The sensing system is configured to provide sensed input signals. The first chopped circuit is configured to provide a switched output signal that switches in response to values of the sensed input signals crossing a limit. The second chopped circuit is configured to provide a high resolution output signal that corresponds to the sensed input signals and has a higher resolution than the switched output signal. The clock generator is configured to provide clock signals that synchronize chopping of the first chopped circuit and the second chopped circuit.Type: GrantFiled: February 16, 2010Date of Patent: October 30, 2012Assignee: Infineon Technologies AGInventors: Mario Motz, Udo Ausserlechner, Bernhard Schaffer
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Patent number: 8294206Abstract: An integrated circuit device includes a semiconductor body fitted with a first electrode and a second electrode on opposite surfaces. A control electrode on an insulating layer controls channel regions of body zones for a current flow between the two electrodes. A drift section adjoining the channel regions comprises drift zones and charge compensation zones. A part of the charge compensation zones includes conductively connected charge compensation zones electrically connected to the first electrode. Another part includes nearly-floating charge compensation zones, so that an increased control electrode surface has a monolithically integrated additional capacitance CZGD in a cell region of the semiconductor device.Type: GrantFiled: June 15, 2011Date of Patent: October 23, 2012Assignee: Infineon Technologies Austria AGInventors: Armin Willmeroth, Winfried Kaindl, Carolin Tolksdorf, Michael Rueb
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Patent number: 8293586Abstract: A method of manufacturing an electronic system. One embodiment provides a semiconductor chip having a first main face and a second main face opposite to the first main face. A mask is applied to the first main face of the semiconductor chip. A compound is applied to the first main face of the semiconductor chip. The compound includes electronically conductive particles. The semiconductor chip is coupled to a carrier with the compound facing the carrier.Type: GrantFiled: September 25, 2008Date of Patent: October 23, 2012Assignee: Infineon Technologies AGInventor: Ivan Nikitin
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Patent number: 8288258Abstract: A method for producing a semiconductor includes providing a p-doped semiconductor body having a first side and a second side; implanting protons into the semiconductor body via the first side to a target depth of the semiconductor body; bonding the first side of the semiconductor body to a carrier substrate; forming an n-doped zone in the semiconductor body by heating the semiconductor body such that a pn junction arises in the semiconductor body; and removing the second side of the semiconductor body at least as far as a space charge zone spanned at the pn junction.Type: GrantFiled: April 29, 2010Date of Patent: October 16, 2012Assignee: Infineon Technologies Austria AGInventors: Anton Mauder, Hans-Joachim Schulze, Helmut Strack, Hans-Joerg Timme, Wolfgang Werner