Abstract: A laminated printed wiring board having surfaces thereof fabricated from conventional fiber reinforced laminates which are secured together by means of an adhesive fabricated of a reinforced thermosetting resin having a coefficient of thermal expansion (CTE) which is substantially smaller than the CTE of the surface laminate whereby the apparent CTE of the overall printed wiring board assembly is substantially controlled.
Type:
Grant
Filed:
March 5, 1985
Date of Patent:
October 16, 1990
Assignee:
Unisys Corporation
Inventors:
Alan M. Buchanan, Jay S. Abramowitz, Roberta A. Y. Flygare