Patents Represented by Attorney Donald M. Boles
  • Patent number: 4483203
    Abstract: A multi-axis force transducer capable of producing discrete output signals for forces and moments in each of three orthogonal directions is taught. Briefly stated, a base having three U shaped slots nested within each other are disposed inside a base or body. A series of holes through the base are placed parallel to the leg of the U-shaped slots with strain gages positioned therein thereby providing a plurality of beams. The body is relatively rigidly supported so as to allow free movement of the beams with an additional beam attached thereto to provide measurement capability for moments about one of the orthogonal axis. The strain gages are electrically interconnected so as to provide discrete output signals for forces and for moments in each of three orthogonal directions.
    Type: Grant
    Filed: June 2, 1983
    Date of Patent: November 20, 1984
    Assignee: AMP Incorporated
    Inventor: Harry M. Capper
  • Patent number: 4477133
    Abstract: A miniature circuit board edge connector having a very short electrical contact path is taught. Briefly stated, an insulative housing has contained therein a resiliently flexible contact holder which has electrically conductive contacts pivotally attached thereto. A camming device is disposed on top of the contact holder so as to cause resilient flexing of the contact holder. Flexing of the contact holder causes the contacts to pivot downward and outward from the contact holder and thereby come in contact with an electrically conductive path on a daughter board which is adjacent thereto and also with a conductive post which is mounted in the base of the connector assembly and attached to a mother board. The electrical path between the daughter board circuit path and the mother board conductive posts through the contact is very short and in a slightly arcuate manner which minimizes inductive, capacitive and propagation delay effects which may come about.
    Type: Grant
    Filed: August 23, 1982
    Date of Patent: October 16, 1984
    Assignee: AMP Incorporated
    Inventor: Nicola Cosmo
  • Patent number: 4469389
    Abstract: A miniature circuit board edge connector assembly includes an insulative housing 2, electrical spring blades 12A in the housing, conductor portions 12B pivotally interlocked with the spring blades 12A and pivotally impinged against corresponding conductive post portions 11, a cam 30 resiliently flexes the spring blades 12A, causing the conductor portions to pivot and engage circuit conductors 37 of a circuit board 38, and to provide circuit paths, from this circuit conductors 37 to the post portions 11, that are shorter than the lengths of the spring blades 12A.
    Type: Grant
    Filed: July 6, 1982
    Date of Patent: September 4, 1984
    Assignee: AMP Incorporated
    Inventors: Dimitry Grabbe, Johannes C. W. Bakermans, Nicola Cosmo, Iosif Korsunsky
  • Patent number: 4468568
    Abstract: A power generation system is taught utilizing a ferromagnetic material contained in a tape and rotatably disposed in a triangular configuration around a series of pulleys. The entire system is under water in the ocean so as to utilize the temperature differentials available between just below the surface of the ocean and approximately 100 meters below. The tape which is ferromagnetic passes through superconducting coils having parallel fields and thereby providing a very large magnetic field. The lower portion of the ferromagnetic tape, which is cooled by the ocean, experiences greater magnetization than the upper warmer portions of the magnetic tape. The lower portion of the tape experiencing greater magnetization is pulled up into the magnetic field and thereby causes movement of the tape. As the tape moves upward it is warmed by the ocean currents with the result that a lower portion of the tape now experiences the greater magnetization. This therefore causes continual movement.
    Type: Grant
    Filed: July 2, 1982
    Date of Patent: August 28, 1984
    Inventors: Walter J. Carr, Jr., Robert C. Miller
  • Patent number: 4461522
    Abstract: A miniature circuit board edge connector having a very short electrical contact path is taught. Briefly stated, an insulative housing has contained therein a resiliently flexible and electrically conductive contact. A camming device is disposed in the housing and impinges upon the contact and through lateral motion of the cam, urges the contact vertically downward so as to cause downward and outward movement of a portion of the contact with respect to the housing which thereby comes in contact with an electrically conductive path on a daughter board which is adjacent thereto. A portion of the contact is in slidable electrical communication with a conductive post which is mounted in the base of the connector assembly and attached to a mother circuit board. The electrical path between the daughter board circuit board and the mother board conductive post through the contact is very short and in a slightly arcuate manner and minimizes inductive, capacitive and propagation delay effects.
    Type: Grant
    Filed: August 23, 1982
    Date of Patent: July 24, 1984
    Assignee: AMP Incorporated
    Inventors: Johannes C. W. Bakermans, Dimitry G. Grabbe, Iosif Korsunsky
  • Patent number: 4453309
    Abstract: The present invention relates to manufacture of electrical conductors by winding small gauge wires helically on a drum, bonding the wires to a flexible sheet of polymeric material also wrapped on the drum, and stripping from the drum the composite of wires and polymeric material that form an array of flat, spring resilient, lengths of substantially parallel conductors.
    Type: Grant
    Filed: November 20, 1981
    Date of Patent: June 12, 1984
    Assignee: AMP Incorporated
    Inventor: Albert Shirk
  • Patent number: 4451696
    Abstract: A toolless splice sealant device is taught. Briefly stated, a splice enclosure suitable for enclosing a splice or connection is utilized. Disposed in the splice enclosure is a sealant material. The splice enclosure has one or more compression buttons such that upon application of the splice enclosure to the splice, compression of the compressable buttons causes the sealant, through hydraulic pressure, to completely fill all voids which may exist, forcing the sealant around and along connector and wire. This thereby environmentally seals the splice and prohibits the contamination of the splice which may affect the electrical integrity thereof.
    Type: Grant
    Filed: November 15, 1982
    Date of Patent: May 29, 1984
    Assignee: AMP Incorporated
    Inventor: Ernest L. Beinhaur
  • Patent number: 4449770
    Abstract: A connector for connecting leads from an integrated circuit package to a printed circuit board or the like wherein the connection between the circuit board and the semiconductor chip leads are as short as possible. This is accomplished by providing a frame which abuts the chip carrier and leads extending therefrom whereby the leads are formed over a frame and travel in a direct path to pads on the printed circuit board. Spring members are held in the frame by a yoke, there being one spring element for each lead which forces the chip carrier leads against the printed circuit pad directly thereby obtaining the shortest possible path.
    Type: Grant
    Filed: May 22, 1981
    Date of Patent: May 22, 1984
    Assignee: AMP Incorporated
    Inventors: Dimitry G. Grabbe, Iosif Korsunsky
  • Patent number: 4438997
    Abstract: An electrical contact (1) includes a plate portion (10), flaps (16) are on the plate portion. A notch (12) in the plate portion straddles an insulated conductor (40), the plate portion (10) is pivoted against the conductor to penetrate sides of the notch into the conductor and establish an electrical connection, and the flaps (16) press against the conductor and establish a strain relief.
    Type: Grant
    Filed: July 30, 1981
    Date of Patent: March 27, 1984
    Assignee: AMP Incorporated
    Inventor: William R. Evans
  • Patent number: 4431198
    Abstract: A device for conduit sealing and repair is taught. Briefly stated, a cable or conduit is passed through an opening in a foundation or bulk head enclosure. A substantially cylindrical collar which is longitudinally split into two portions is placed onto the conduit with the conduit and collars then placed into the enclosure opening. An expandable foam is injected into an opening in the collar which, when expanded forces apart the two portions thereby snuggly fitting the collar into the opening. The foam is also allowed to exit through openings in the collar and thereby fills any voids between the exterior of the collar and the interior portion of the opening and which thereby forms a water tight as well as gas tight seal. Reentry into the opening for removal and/or replacement of the conduit is accomplished by pulling on stainless steel strap which are positioned in openings and around portions of the collar.
    Type: Grant
    Filed: November 5, 1982
    Date of Patent: February 14, 1984
    Assignee: AMP Incorporated
    Inventors: Ernest L. Beinhaur, Marshall S. Mountz
  • Patent number: 4418322
    Abstract: Electronic switching means for synchronizing a voltage controlled oscillator output with a variable input Baud Rate Clock. A Baud rate counter ratio input to a Phase Lock Loop circuit is selected or electronically switched automatically according to the input signal Baud rate. Binary counters count down a clock during the time an input signal is high, and the result of the count is transferred to an output register which controls, on the basis of the count, the electronic switching of a Baud rate counter to select the appropriate counter ratio output.
    Type: Grant
    Filed: February 5, 1982
    Date of Patent: November 29, 1983
    Assignee: AMP Incorporated
    Inventor: Paul S. Chang
  • Patent number: 4417266
    Abstract: A chip carrier having a plurality of leads thereon for external interconnection with preferably only one of the leads utilized to provide a source of power to the chip and preferably a single lead utilized as a ground connection. The power and ground leads are connected in a bus structure around the chip at the center of the chip carrier with the chip being secured to the chip carrier with the bus structure over a thermal pad formed within the bus structure. A decoupling capacitor is located in close proximity to the chip on the substrate to assure low reaction due to switching.
    Type: Grant
    Filed: August 14, 1981
    Date of Patent: November 22, 1983
    Assignee: AMP Incorporated
    Inventor: Dimitry G. Grabbe
  • Patent number: 4410906
    Abstract: A package and system for elimination or reduction to a minimum of reflection of the signal when transmitting from a substrate into an integrated circuit package at very high speed. This is accomplished by providing a conductor grid at a proper distance from a conductor plane to act as a reference ground plane. The grid is designed so that the difference of coefficient of expansion of the ceramic insulator and the metal conductors, which results in the deformation of the plane substrate surface due to "bimetallic" effects, is essentially cancelled due to the symmetrical construction with about the same amount of the same metal placed on both sides of the ceramic substrate. In this way, forces provided due to the thermal mismatch are mutually cancelled.
    Type: Grant
    Filed: August 14, 1981
    Date of Patent: October 18, 1983
    Assignee: AMP Incorporated
    Inventor: Dimitry G. Grabbe
  • Patent number: 4410905
    Abstract: A chip carrier having a plurality of leads thereon for external interconnection with preferably only one of the leads utilized to provide a source of power to the chip and preferably a single lead utilized as a ground connection. The power and ground leads are connected to an interdigitated lead array at the center of the chip carrier with the chip being secured to the chip carrier above the interdigitated pattern. The chip is bonded to a dielectric sliver which rests above a glass filler and bonding agent which fills the space between the interdigitated pattern and the sliver. The chip is hermetically sealed within the ceramic cap which is bonded to the chip carrier. Power and ground connections are made, from the chip directly to a pair of buses surrounding the interdigitated pattern rather than to leads extending outwardly to the edge of the chip carrier.
    Type: Grant
    Filed: August 14, 1981
    Date of Patent: October 18, 1983
    Assignee: AMP Incorporated
    Inventor: Dimitry G. Grabbe
  • Patent number: 4347540
    Abstract: A solid state load protection system whereby the current supplied to a load is monitored enabling ground fault sensing to be used. A current sensor is utilized so as to produce an output current which is proportional to the current in the electrical circuit. Attached to the current sensing function is a resistive load which converts the current produced by the current sensing function to a voltage which is also proportional to the current utilized by the motor. Attached between two resistors which comprise the resistive load is a ground fault resistor which has its remaining end connected to the neutral leg of the current transformers of the current sensing function. The ground fault sensor monitors the voltage across the resistors in the resistive load and the current in the neutral leg of the current sensors.
    Type: Grant
    Filed: April 27, 1981
    Date of Patent: August 31, 1982
    Assignee: Westinghouse Electric Corp.
    Inventors: Wardell Gary, Ernest F. Conroy, Jr.