Abstract: A method for manufacturing a microelectronic assembly to have a resistor, and particularly a metal resistive film, with desirable processing and dimensional characteristics. The method generally entails applying a photosensitive dielectric to a substrate to form a dielectric layer. The dielectric layer is photoimaged to polymerize a first portion of the dielectric layer on a first region of the substrate, leaving the remainder of the dielectric layer unpolymerized. An electrically resistive film is then applied to the dielectric layer, and the dielectric layer is developed to remove concurrently the unpolymerized portion thereof and the portion of the resistive film overlying the unpolymerized portion, so that a portion of the resistive film remains over the second portion to form the resistor. An alternative process order is to apply the resistive film prior to exposing the dielectric layer to radiation, and then exposing the dielectric layer through the resistive film.

Abstract: A process for forming a thick-film resistor whose dimensions can be accurately obtained, thereby yielding a precise resistance value. The method includes providing on a substrate a photoimageable layer that preferably forms a permanent dielectric layer of a multilayer structure. An opening is photodefined in the surface of the photoimageable layer, and then overfilled with an electrically-resistive material to form a resistive mass having an excess portion that lies on the surface of the photoimageable layer surrounding the opening. Following curing which causes the surface of the resistive material to become recessed below the surface of the photoimageable layer, the excess portion of the resistive mass is removed, preferably by abrading or a similar operation, such that the lateral dimensions of the resistive mass are determined by the lateral dimensions of the opening in the photoimageable layer.

Abstract: A process for forming a resistor whose dimensions can be accurately determined by a photoimaging process, thereby yielding a resistor whose size and resistance value render the resistor a viable alternative to discrete chip resistors. The resistor is formed of a photoimageable resistive thick-film material that enables the dimensions of a resistor to be determined directly by photodefinition instead of conventional screen printing. Electrically-conductive terminations are provided that determine the electrical length of the resistor. The terminations may be formed prior to depositing the resistive layer, or after the resistive layer has been photoimaged and developed. If the latter approach is used, the terminations may be formed by depositing a photoimageable layer on the resistor, photoimaging and developing the photoimageable layer so as to form openings that expose regions of the resistor, and then plating, e.g.

Abstract: A multi-format communications client-server (50) has a number of communication interfaces (52-64). A controller and processor (68) is coupled to each of the communication interfaces (52-64) and convert messages from a first communication format to a second communication format. A memory (70) is coupled to the controller and processor (68) and the communication interfaces (52-64). The memory (70) stores a number of messages in a number of communication formats.

Abstract: The present invention provides an apparatus (200) that includes a heat-generating component (202) and a heat-dissipating apparatus (120). The heat-generating component (202) is mounted on a substrate (204). The heat-dissipating apparatus (120) includes a housing piece (100) that includes a sealed chamber (102) and a phase change material (106) disposed within the sealed chamber (102). The heat-dissipating apparatus (120) is thermally coupled to the heat-generating component (202) and provides for heat dissipation by an endothermic process of changing phase from solid to liquid, thereby lowering the operating temperature of the heat-generating component (202).

Abstract: A microelectronic assembly (10) includes a printed circuit board (12) that includes a substrate (14) having a die attach region (22) and a plurality of first bond pads (24) disposed and spaced apart at the die attach region (22). A channel (26) effective in improving fluid flow extends across the die attach region (22) apart from the first bond pads (24). An integrated circuit die (16) is mounted onto the printed circuit board (12) and includes a major face (28) facing the substrate (14) and spaced apart therefrom by a gap (30) and second bond pads (25) disposed on the major face (28) in a pattern such that each of the second bond pads (25) registers with a first bond pad (24). Solder bump interconnections (18) connect the first bond pads (24) to the second bond pads (25). Encapsulant (20) is disposed within the gap (30) and flows over the substrate (14) and the channel (26) to encapsulate the solder bump interconnections (18).

Abstract: A microelectronic assembly (10), such as a smart card, is formed by attaching a component subassembly (34) to a substrate (12). The substrate (12) includes a face (26) and defines a via (28) having a via opening (30) at the face (26). The substrate (12) further defines a component cavity (32) at the face (26) that is spaced apart from the via (28). An electrical element (14), such as a wound antenna, is disposed within the substrate (12) and includes a terminal (24) at the via (28). The component subassembly (34) is formed by mounting an integrated circuit component (16) onto a metallic lead (18). The integrated circuit component (16) is electrically connected to the metallic lead (18) by a wire lead (36). A protuberance (20) is connected to the metallic lead (18), preferably by forming a loop from a wire bond. A polymeric body (56) is formed about the component (16) and wire leads (36).

Abstract: The present invention provides a method (400), error control system (200), phone (209) and error control apparatus (208) including a hexacode-based Golay decoder (210) adapted to receive values defining Golay encoded data signals and to generate a estimate of original input data signals (216) and a plurality of metrics associated with Golay encoded data signals, and an error detection circuit (212) coupled to the hexacode-based Golay decoder (210) for comparing the plurality of metrics and providing an error detection flag (214).

Abstract: Apparatus for estimating carrier and clock frequency offsets in OFDM systems employs a maximun likelihood estimator operation on the demodulated signals. The invention has the benefit of low complexity and obviates the need for any requirement for a dedicated training channel.

Abstract: A microelectronic package (10) is formed by placing a lead frame (22) onto an adhesive polyimide tape (38). The lead frame (22) includes a plurality of metallic leads (16) and an opening. An integrated circuit die (12) is positioned onto the molding support (38) within the opening such that a non-active face (32) of the integrated circuit die (12) rests against the molding support (38). Wire leads (18) connect an active face (28) of the integrated circuit die (12) to the metallic leads (16). A plurality of metallic bumps (20) are attached to the metallic leads (16), and a polymeric precursor is dispensed. The precursor embeds the active face (28) of the integrated circuit die (12), the inner surface (19) of the metallic leads (16), the wire leads (18), and the metallic bumps (20). The microelectronic package (10) is then heated to cure the polymeric precursor to form a polymeric body (14).

Abstract: A thin-film metal resistor (44) suitable for a multilayer printed circuit board (12), and a method for its fabrication. The resistor (44) generally has a multilayer construction, with the individual layers (34, 38) of the resistor (44) being self-aligned with each other so that a negative mutual inductance is produced that very nearly cancels out the self-inductance of each resistor layer (34, 38). As a result, the resistor (44) has a very low net parasitic inductance. In addition, the multilayer construction of the resistor (44) reduces the area of the circuit board (12) required to accommodate the resistor (44), and as a result reduces the problem of parasitic interactions with other circuit elements on other layers of the circuit board (12).

Abstract: A printed circuit board comprises a metallic layer (12) cooperating with a metallic plate (26) to form a generally polygonal cross-section (48) of an integral waveguide (46) filled with a solid dielectric layer. The metallic layer (12) is on a substrate (10). The metallic layer (12) has a first strip (14) and a second strip (16) spaced apart from the first strip (14). A solid dielectric layer (18) overlies the metallic layer (12). The solid dielectric layer (18) has a first channel (36) exposing the first strip (14), a second channel (38) exposing the second strip (16), and a land (34) disposed between the first channel (36) and the second channel (38). A metallic plate (26) overlies the land (34), extends through the first channel (36) to the first strip (14), and extends through the second channel (38) to the second strip (16).

Abstract: A method (900), device (200) and system (100) provide, in response to text/linguistic input, one of a set of pre-determined meanings which is the most likely intended meaning of that input. A trained meaning discriminator is generated from an annotated training corpus and a meaning discriminator trainer. The trained meaning discriminator generates a meaning vector from an input utterance. The intended meaning encoder analyzes the meaning vector to determine the most likely intended meaning and confidence measures.

Abstract: A process for forming a thick-film resistor whose dimensions can be accurately obtained, thereby yielding a precise resistance value. The method includes providing on a substrate a photoimageable layer that preferably forms a permanent dielectric layer of a multilayer structure. An opening is photodefined in the surface of the photoimageable layer, and then overfilled with an electrically-resistive material to form a resistive mass having an excess portion that lies on the surface of the photoimageable layer surrounding the opening. Following curing which causes the surface of the resistive material to become recessed below the surface of the photoimageable layer, the excess portion of the resistive mass is removed, preferably by abrading or a similar operation, such that the lateral dimensions of the resistive mass are determined by the lateral dimensions of the opening in the photoimageable layer.

Abstract: The display device includes an optical cell having a cell front with at least one cell region being capable of an optically transmissive mode and an optically nontransmissive mode with reference to the cell front. The optical cell contains an optically active material responsive to an applied electrical field such that optical properties of the material are controllably changeable. A reflector may be optically coupled to the cell. A prismatic film including a prismatic surface is optically coupled to the optical cell. The prismatic surface preferably comprises a series of prisms. The prisms have first faces and second faces intersecting the first faces. The first faces are oriented to refract light obliquely intercepting the first faces and the second faces are oriented to minimize refractive, reflective, and optical interactions of the light with the second faces.

Abstract: A card assembly (10) comprises a polymeric layer (16) having a generally planar surface (24), an integrated circuit component (38) adjacent to the polymeric layer (16), and a loop antenna (24) formed of a bare conductor (32) having ends. The loop antenna (24) comprises a first section (26) embedded into the polymeric layer (16), a second section (28) embedded into the polymeric layer (16), and a transverse section (30) spaced apart from the first section (26) by a dielectric region. The transverse section (30) crosses the first section (26). The ends (34) are electrically coupled to the integrated circuit component (38). The dielectric region preferably comprises a reflowed flash region of the polymeric layer (16) such that the transverse section (30) is encapsulated within the polymeric layer (16). Alternately, the dielectric region comprises a dielectric insert separating the transverse section from the first section.

Abstract: A method for attaching a flip chip or other microelectronic device to a circuit board or other substrate. The method entails the forming of recesses having precise volumes above and surrounding each terminal pad so as to enable the deposition on each pad of a controlled volume of conductive material, such that reduced spacing between terminals can be enabled. If a conductive adhesive is used as the conductive material, the method drastically reduces the likelihood that an inadequate amount of adhesive will be deposited, while excess adhesive can be accommodated without causing shorting between adjacent terminals. If flip chip attachment is achieved with a solder composition, the method eliminates the prior art requirement for circuit board terminal bumping and bump flattening.

Abstract: The present invention provides a two-phase thermosyphon (100) and a method for forming the two-phase thermosyphon (100). The two-phase thermosyphon (100) includes a hermetically sealed housing (101) including a first outer surface (107), a second outer surface (109) opposite the first outer surface (107), a first inner surface (111), and a second inner surface (113). The two-phase thermosyphon (100) also includes a finned area (114) thermally coupled to the hermetically sealed housing (101), the finned area (114) including a plurality of fins (115) disposed on a part of the first outer surface (107). The two-phase thermosyphon (100) also includes a plurality of air feed through slots (105) disposed in the housing (101). The air feed through slots (105) underlie the fins(115) and provide increased heat dissipation by increasing the air flow about the fins (115). The present invention is particularly useful in applications that require a two-phase thermosyphon utilized in a generally horizontal orientation.

Abstract: A method and device in a communication system including a receiver having a plurality of receiving antennas for receiving a plurality of information bursts transmitted by at least one transmitting user device where the information bursts contain a number of data symbols and a pilot symbol sequence of content known at both the transmitting user device and the receiver. The method provides for computing a channel transfer function between the transmitting user device at each of the plurality of receiving antennas, by computing a simulated received pilot signal for each receiving antenna, computing an error signal between the simulated received pilot signal and the received pilot symbol sequence, computing a channel modeling sequence, wherein the power of the error signal is minimized, and computing the channel transfer function by weighting predetermined basis functions by the channel modeling sequence.

Abstract: The present invention provides a method (200, 400, 500, 600), device (300, 400, 500, 600, 700) and digital camera (800) for error control of a wavelet-based image codec, wherein wavelet coefficients are encoded using entropy coding. The method includes: A) utilizing, in a decoder, control information and a plurality of resynchronization markers inserted at arbitrary positions in a wavelet-based image bitstream wherein the control information provides decoding information for decoding at least a forward sequence of wavelet coefficients; and B) detecting errors in an image bitstream and limiting propagation of errors in a decoded image utilizing the control information and the plurality of resynchronization markers.