Abstract: A signal processing module can be manufactured from a plurality of composite substrate layers, each substrate layer includes elements of multiple individual processing modules. Surfaces of the layers are selectively metalicized to form signal processing elements when the substrate layers are fusion bonded in a stacked arrangement. Prior to bonding, the substrate layers are milled to form gaps located at regions between the processing modules. Prior to bonding, the leads are positioned such that they extend from signal coupling points on said metalicized surfaces into the gap regions. The substrate layers are then fusion bonded to each other such that the plurality of substrate layers form signal processing modules with leads that extend from an interior of the modules into the gap areas. The individual modules may then be separated by milling the substrate layers to de-panel the modules.

Abstract: An apparatus for self-serve checkout of large order purchases is provided. The apparatus includes one or more product code entry devices for entering a product code of an item to be purchased, a controller and a carousel assembly that includes a rotating mechanism, a rack coupled with the rotating mechanism, and a scale underneath the rotating mechanism and rack. The rack holds a plurality of bags open for packing a plurality of items, and may be rotated along with the rotating mechanism to present a select one of the bags for packing the item to be purchased. The scale provides a weight signal corresponding to a weight of packed items in the plurality of bags on the carousel. The controller monitors the weight signal to detect any abnormal weights or weight changes. The apparatus also may be provided with a large item holding assembly that includes a second scale which provides a second weight signal corresponding to the weight of one or more oversized items on the large item holding assembly.

Abstract: A platform is provided for the manufacture of microwave, multilayer integrated circuits and microwave, multifunction modules. The manufacturing process involves bonding fluoropolymer composite substrates into a multilayer structure using fusion bonding. The bonded multilayers, with embedded semiconductor devices, etched resistors and circuit patterns, and plated via holes form a self-contained surface mount module. Film bonding, or fusion bonding if possible, may be used to cover embedded semiconductor devices, including embedded active semiconductor devices, with one or more layers.

Abstract: A microwave coupler is constructed in a multilayer, vertically-connected stripline architecture provided in the form of a microwave integrated circuit that has a homogeneous, multilayer structure. Such a coupler has a vertically-connected stripline structure in which multiple sets of stripline layers are separated by interstitial groundplanes, and wherein more than one set of layers has a segment of coupled stripline. A typical implementation operates at frequencies from approximately 0.5 to 6 GHz, although other frequencies are achievable.

Abstract: A double-balanced ring mixer is provided in the form of a microwave integrated circuit that has a homogeneous, multilayer structure. The mixer utilizes baluns comprising rectangular coaxial transmission lines that are capable of operating over a wide range of frequencies while taking up little space. A typical implementation operates at frequencies from approximately 0.9 to 6 GHz, although other frequencies, such as approximately 0.1 to 10 GHz, are achievable.