Abstract: The present invention is a socket for removably connecting electrical conductors directly to the bond pads of an integrated circuit chip, and includes a chip holder that locks into the socket for burn-in and other testing and then can be removed and easily handled by automated equipment in the further processing of the chip. The socket has a series of contacts that are guided into electrical engagement with the bond pads through precisely positioned openings in a ceramic plate. The ceramic plate and the chip holder are aligned by a pair of guide pins that project from a housing. A pair of latching members secure the chip holder to the housing during burn-in and testing.