Abstract: An apparatus is provided for treating pollutants in a gaseous stream. The apparatus comprises tubular inlets for mixing a gas stream with other oxidative and inert gases for mixture and flame production within a reaction chamber. The reaction chamber is heated by heating elements and has an interior wall with orifices through which heated air enters into the central reaction chamber. The oxidized gases are treated also for particles removal by flowing through a packed bed. The packed bed is cooled and its upper portion with air inlets to enhance condensation and particle growth in the bed. The treated gas stream is also scrubbed in a continuous regenerative scrubber comprising at least two vertically separated beds in which one bed can be regenerated while the other is operative so that the flow may be continuously passed through the bed.

Abstract: An ultrasonic etching apparatus for chemically-etching a workpiece is disclosed. The apparatus includes an outer tank at least partially filled with an aqueous solution, an inner tank at least partially disposed within the outer tank and in contact with aqueous solution, the inner tank at least partially filled with an etching solution, a lid engaged with the mouth of said inner tank; and an ultrasonic transducer coupled to the outer tank to impart ultrasonic energy to the etching solution in said inner tank. Also disclosed are methods of using the apparatus to etch workpieces.

Abstract: A cassette stocker includes a plurality of cassette storage shelves positioned adjacent a cleanroom wall and vertically disposed relative to a plurality of cassette docking stations, and a cassette mover to carry a cassette between the shelves and the docking stations. An interstation transfer apparatus includes a support beam and a transfer arm adapted to carry a cassette between processing stations.

Abstract: A set of lift pins defines a storage location for a substrate in a substrate processing chamber. Each lift pin has an actuating mechanism including a translating mechanism that translates vertical actuation into horizontal motion. The actuating mechanism may include a base, a mechanism adapted to raise and lower the base, and a lever pivotally mounted on the base. The lift pin may be fixedly mounted on the lever. A stop may be adjacent the base and adapted to engage the lever to pivot the lever as the base is lowered.

Abstract: A split operation such as a split read or a split write is handled by a bus bridge circuit. The bus bridge receives the read or write command from a requesting device, where the command includes a bus number for routing a completion of the command. The bus bridge then compares the bus number received from the requesting device with the return route bus number range of the bus bridge, and issues a split response to the requesting device if the bus number matches the return route bus number range of the bus bridge. If the bus number does not match the return route bus number range, then the command is aborted.

Abstract: In a first aspect, a shelf module is adapted to store a plurality of substrate carriers. The shelf module includes (1) a plate; and (2) a plurality of shelves attached to the plate at respective elevations, each of the shelves being adapted to store a respective substrate carrier. Also provided are (1) an upper attachment mechanism adapted to attach an upper portion of the plate to a frame of a storage location; and (2) a lower attachment mechanism adapted to attach a lower portion of the plate to the frame of the storage location. At least one of the upper attachment mechanism and the lower attachment mechanism is adjustable so as to allow the plurality of shelves attached to the plate to be aligned to a reference as a unit.

Abstract: A valve control system for a semiconductor processing chamber includes a system control computer and a plurality of electrically controlled valves associated with the processing chamber. The system further includes a programmable logic controller in communication with the system control computer and operatively coupled to the electrically controlled valves. The refresh time for control of the valves may be less than 10 milliseconds. Consequently, valve control operations do not significantly extend the period of time required for highly repetitive cycling in atomic layer deposition processes. A hardware interlock may be implemented through the output power supply of the programmable logic controller.

Abstract: Systems, methods and computer program products are provided for calibrating integrated the inspection tools of one or more processing tools. In a first aspect, a system is provided that includes (1) a processing tool adapted to process substrates; (2) an integrated inspection tool coupled to the processing tool; and (3) a controller adapted to communicate with the integrated inspection tool. The controller includes computer program code adapted to receive a first result generated by inspecting a production substrate with a stand-alone inspection tool, and to receive a second result generated by inspecting the production substrate with the integrated inspection tool. The computer controller further includes computer program code adapted to calibrate the integrated inspection tool based on the first and second results. Numerous other systems are provided, as are methods and computer program products.

Abstract: A workpiece loading interface is included within a workpiece processing system which processes workpieces, typically wafers, in a vacuum. The workpiece loading interface includes two separate chambers. Each chamber may be separately pumped down. Thus, while a first cassette of wafers, from a first chamber is being accessed, a second cassette of wafers may be loaded in the second chamber and the second chamber pumped down. Each chamber is designed to minimize intrusion to a clean room. Thus a door to each chamber has a mechanism which, when opening the door, first moves the door slightly away from an opening in the chamber and then the door is moved down parallel to the chamber. After the door is opened, a cassette of wafers is lowered through the opening in a motion much like a drawbridge. The cassette may be pivoted within the chamber when the position from which wafers are accessed from the cassette differs from the position from which the cassette is lowered out of the chamber.

Abstract: A multi-set robot is provided that includes a first robot set having a first motor coupled to a first rotatable member that is rotatable about an axis; a second motor coupled to a second rotatable member that is rotatable about the axis; a first plurality of blades vertically spaced from one another; and a first linkage adapted to enable coordinated movement of the blades on rotation of the first and second rotatable members. The robot also includes a second robot set positioned above the first robot set having a third motor coupled to a third rotatable member that is rotatable about the axis; a fourth motor coupled to a fourth rotatable member that is rotatable about the axis; a second plurality of blades vertically spaced from one another; and a second linkage adapted to enable coordinated movement of the blades on rotation of the third and fourth rotatable members. Other aspects are provided.

Abstract: A loader conveyor adapted so as to receive a wafer carrier from a transfer conveyor and adapted to terminate at an intersection with a processing system, is provided. Thus, the need for a front-end loader robot may be eliminated.

Abstract: A storage surface for a semiconductor substrate carrier has substrate carrier sensors that are integrated with locator pins. Each locator pin includes a pin body mounted on, and extending upwardly from, the surface. The pin body has a slot formed at an upper portion of the pin body. A paddle is mounted in the slot of the pin body and is adapted to be actuated in a downward direction when a substrate carrier is seated on the pin body. The pin body has an uppermost point, and when the paddle is unactuated, the paddle does not extend above the uppermost point of the pin body.

Abstract: An improved apparatus and method is provided for storing semiconductor wafer carriers, and for loading wafers or wafer carriers to a fabrication tool. The apparatus preferably provides an elevated port for receipt of wafer carriers from an overhead factory transport, allows for local interconnection among a plurality of the inventive apparatuses, and enables independent loading of the factory load port and the tool load port. An inventive wafer handling method which divides a lot of wafers into sublots and distributes the sublots among tools configured to perform the same process is also provided.

Abstract: A multiple substrate orienter is provided that includes a rotatable substrate handler having a plurality of substrate support portions, each adapted to support a substrate. The multiple substrate orienter also includes a plurality of stacked substrate supports, each adapted to support a substrate. A plurality of substrate orientation marking (SOM) detectors are provided, and each SOM detector is coupled to a different one of the substrate supports and is adapted to identify a presence of an SOM of a substrate positioned close enough to the SOM detector to allow SOM detection by the SOM detector. The multiple substrate orienter further includes a plurality of lift and lower mechanisms, each lift and lower mechanism coupled to a different one of the substrate supports and adapted to individually lift and lower the substrate support to which the lift and lower mechanism is coupled. Numerous other aspects are provided.

Abstract: The present invention provides a wafer positioning device having wafer storage capability. The wafer positioning device has a wafer platform with wafer lift pins, a wafer position sensor, and a storage location in close proximity to the wafer platform and the wafer position sensor. The storage location may be above the wafer position sensor, in which case the wafer position sensor retracts or rotates so that the wafer lift pins may elevate a positioned wafer past the position sensor to the storage location. Alternatively, the storage location may be between the wafer platform and the wafer positioning device. The storage location is preferably formed by a plurality of rotatable towers or a plurality of retractable lift pins that are operatively coupled to the wafer platform and that have wafer support portions capable of assuming both a wafer storage position and a wafer passage position.

Abstract: A cassette stocker includes a plurality of cassette storage shelves positioned adjacent a cleanroom wall and vertically disposed relative to a plurality of cassette docking stations, and a cassette mover to carry a cassette between the shelves and the docking stations. An interstation transfer apparatus includes a support beam and a transfer arm adapted to carry a cassette between processing stations.

Abstract: Multiple levels of interlocks are provided relative to gas flow for a chemical vapor deposition chamber. When a chamber lid used for normal processing is in place, no interlock is in effect. When a lid used during maintenance operations is in place, flow of toxic gas to the chamber is interlocked, but flow of purge gas is permitted. When no lid is in place, all gas flow to the chamber is interlocked. The interlock arrangement may be implemented with two switches, both of which are actuated when the lid for normal processing is in place, and only one of which is actuated by the lid for the maintenance process.

Abstract: A multichannel parallel IC amplifier includes a plurality of amplifier circuits formed on an IC substrate. Each amplifier circuit is coupled to respective inputs via a pair of capacitors. The capacitors are configured so as to substantially equalize like sense and unlike sense coupling between adjacent channels, leading to cancellation of crosstalk signals.

Abstract: A method and apparatus are provided for substrate handling. In a first aspect, a temperature adjustment plate is located below a substrate carriage and is configured such that a substrate may be transferred between the temperature adjustment plate and the substrate carriage by lifting and lowering the substrate carriage above and below the top surface of the temperature adjustment plate. The temperature adjustment plate may be configured to heat and/or cool a substrate positioned thereon. In a second aspect, the substrate carriage is magnetically coupled so as to rotate and/or lift and lower magnetically, thereby reducing particle generation via contact between moving parts (and potential chamber contamination therefrom). In a third aspect, a substrate handler positioned below the substrate carriage is both magnetically coupled and magnetically levitated, providing further particle reduction.

Abstract: A workpiece loading interface is included within a workpiece processing system which processes workpieces, typically wafers, in a vacuum. The workpiece loading interface includes two separate chambers. Each chamber may be separately pumped down. Thus, while a first cassette of wafers, from a first chamber is being accessed, a second cassette of wafers may be loaded in the second chamber and the second chamber pumped down. Each chamber is designed to minimize intrusion to a clean room. Thus a door to each chamber has a mechanism which, when opening the door, first moves the door slightly away from an opening in the chamber and then the door is moved down parallel to the chamber. After the door is opened, a cassette of wafers is lowered through the opening in a motion much like a drawbridge. The cassette may be pivoted within the chamber when the position from which wafers are accessed from the cassette differs from the position from which the cassette is lowered out of the chamber.