Abstract: The invention concerns flip chip technology using non-conductive adhesives and gold ball bumps or connectors. The concept is to simultaneously attach and interconnect bare chips with gold ball bumps to organic substrates. The chip is fixed by cooling the insulative adhesive. Environmental testing has demonstrated that performance characteristics were acceptable after 1000 hours of continuous exposure to humidity, and were excellent after 1000 temperature cycles. Such stable interconnections can only be realized by the compliance of the flip chip joint. This stability, can be achieved by precise control of the bonding parameters such as temperature and pressure. This bonding technique allows quality attachment of bare chips on low cost organic substrates.

Abstract: On a frame, a headstock and a tool rest are provided being free to relatively move so as to perform machining operations. The headstock is rotatably provided with spindle. The spindle is provided with a workpiece gripping means. One or more than one bar supporting means for movably supporting a bar stock in a predetermined feeding direction are provided at a predetermined position with respect to the spindle. A cutting means, for cutting the bar stock supported by the bar stock supporting means at a cutting position on the feeding direction side to the bar supporting means, is provided. A workpiece carrying means is provided being free to move relative to the headstock so as to deliver the workpiece produced by cutting of the bar stock with the cutting means to the workpiece gripping means of the spindle from the workpiece gripping means side to the spindle.