Abstract: A process for evaluating a cleaning solution is described. The process includes: (i) subjecting a solution, including a solute and a solvent, to sonic energy to create a sonicated solution; (ii) measuring UV absorption of the sonicated solution to produce a sample UV absorbance spectra; (iii) obtaining a reference solution, which includes a solute concentration that is similar to that of solute concentration in the sonicated solution; (iv) measuring UV absorption of the reference solution to produce a reference UV absorbance spectra; (v) scaling the reference UV absorbance spectra to the sample UV absorbance spectra at a lower range of the UV spectrum; (vi) subtracting from the reference UV absorbance spectra the sample UV absorbance spectra to produce a differential UV spectra; and (vii) evaluating at or near a peak of the sample UV absorbance spectra the differential UV absorbance spectra to determine whether the sonicated solution is activated.
Abstract: A method of wastewater treatment is described. The method includes: (i) receiving wastewater; (ii) performing a first type of treatment on wastewater to produce wastewater having a first property which is capable of changing; (iii) preventing the first property from changing; (iv) performing a second type of treatment on wastewater; and wherein the first property includes at least one property selected from a group consisting of biochemical oxygen demand (“BOD”) level, dissolved oxygen level, solid content and nutrient level.
Abstract: A generally spherical turbine configured to rotate transversely within a cylindrical pipe under the power of fluid flowing either direction therethrough is operatively coupled with a rotating machine or generator to produce electricity. In one embodiment, the blades of the spherical turbine curve in an approximately 180 degree arc in a plane that is at an inclined angle relative to the rotational axis of a central shaft. In another embodiment, a deflector is provided upstream of the spherical turbine and within the cylindrical pipe to control flow through the spherical turbine by shielding a part thereof. The blades of the spherical turbine are airfoil in cross section to optimize hydrodynamic flow, to minimize cavitation, and to maximize conversion from axial to rotating energy.
Type:
Grant
Filed:
April 7, 2009
Date of Patent:
June 14, 2011
Assignees:
Northwest Pipe Company, Lucid Energy Technologies, LLP
Inventors:
Roderic A. Schlabach, Mark Rydell Cosby, Edward Kurth, Igor Palley, Greg Smith
Abstract: Inventive methods, systems and compositions of cleaning integrated circuit (“IC”) substrates are described. The cleaning methods of the present invention include: charging a solution, which contains at least a solute selected to promote cleaning of the IC substrate, to produce a charged solution, such that at least a portion of the solute is present as clusters in the charged solution; and conveying the charged solution for cleaning the IC substrate. The cleaning systems of the present invention include: a charging chamber for holding a solution, which contains at least a solute selected to promote cleaning of the integrated circuit substrate; and a first acoustic energy source capable of vibrating the solution in the charging chamber to produce a charged solution such that at least a portion of the solute is present as clusters in the charged solution.
Abstract: Inventive methods and systems of cleaning patterned integrated circuit (“IC”) substrates are described. The cleaning methods of the present invention include: (1) providing the patterned integrated circuit substrate having thereon poly silicon lines adjacent to each other; (2) charging a solution, which contains at least a solute selected to promote cleaning of the patterned integrated circuit substrate, to produce a charged solution, wherein at least a portion of the solute is present as clusters in the charged solution; and (3) conveying the charged solution for cleaning the patterned integrated circuit substrate.
Abstract: Inventive methods, systems and compositions of cleaning integrated circuit (“IC”) substrates are described. The cleaning methods of the present invention include: charging a solution, which contains at least a solute selected to promote cleaning of the IC substrate, to produce a charged solution, such that at least a portion of the solute is present as clusters in the charged solution; and conveying the charged solution for cleaning the IC substrate.