Abstract: Several embodiments of an uninterruptible power supply (UPS) system, which system provides highly reliable output power to a load using a slip-ring induction machine and a flywheel combination, are disclosed as well as methods relating thereto. In a preferred embodiment, the UPS system comprises a back-up power source, e.g., an engine and generator, and a slip-ring, or wound-rotor, induction motor and flywheel combination, which are in parallel to a primary power source, e.g., a utility grid. During normal operation of the UPS, the primary power source supplies alternating current and voltage to the load and the UPS compensates for voltage drop across the isolating inductor. Moreover, the primary power source keeps the slip-ring induction machine and flywheel in an excited state, i.e., the rotor of the slip-ring induction machine, the shaft of which is shared by the flywheel, is excited above normal synchronous speed.

Abstract: Novel oligomers, and synthesis thereof, comprising one or more bi-, tri, or polycyclic nucleoside analogues are disclosed herein. The nucleoside analogues have a “locked” structure, termed Locked Nucleoside Analogues (LNA). LNA's exhibit highly desirable and useful properties. LNA's are capable of forming nucleobase specific duplexes and triplexes with single and double stranded nucleic acids. These complexes exhibit higher thermostability than the corresponding complexes formed with normal nucleic acids. The properties of LNA's allow for a wide range of uses such as diagnostic agents and therapeutic agents in a mammal suffering from or susceptible to, various diseases.

Abstract: A low profile stack semiconductor package is proposed. A lower chip having centrally-situated bond pads is mounted on a substrate, and electrically connected to the substrate by bonding wires. A cushion member is peripherally situated on the lower chip, allowing the bonding wires to extend from the bond pads in a direction parallel to the lower chip, and to reach the cushion member beyond which the bonding wires turn downwardly to be directed toward the substrate. An adhesive is applied on the lower chip, for encapsulating the bond pads, cushion member and bonding wires. This allows an upper chip to be readily stacked on the lower chip by attaching the upper chip to the adhesive, without affecting or damaging structural or electrical arrangement formed on the lower chip.

Abstract: The present invention provides methods for inhibiting blood clotting. In general, the methods include adding corn trypsin inhibitor (CTI) to blood or a blood product in an amount sufficient to inhibit the clotting. The CTI can be used alone or in combination with other anti-coagulants. In one aspect, the invention features plasma clotting assays featuring substantially prolonged clotting times. Clotting assays using whole or minimally altered blood are also provided. Further provided are methods for storing blood or blood products at low temperature with the CTI.

Abstract: The present invention relates to polyspecific binding molecules and particularly single-chain polyspecific binding molecules that include at least one single-chain T-cell receptor (sc-TCR) covalently linked through a peptide linker sequence to at least one single-chain antibody (sc-Ab). Further disclosed are methods and compositions for testing and using the molecules.

Abstract: The invention relates to a method for permeabilization of a cell structure consisting of a single cell, an intracellular structure or an organelle comprising the following steps: (a) microelectrodes, preferably two carbon fibre electrodes or hollow fibre electrodes, are provided, (b) the microelectrodes are connected to a power supply, (c) the electrodes, individually controlled by high-graduation micromanipulators, are placed close to the cell structure at an appropriate inter-electrode distance, and (d) a highly focused electric field of a strength sufficient to obtain electroporation is applied between the electrodes. The method may be used in order to transfer cell impermeant solutes, such as drugs or genes, into the cell structure or out of the cell structure, in biosensors, in the treatment of tumours and neurodegenerative diseases and in the study of biophysical processes.

Abstract: The image forming apparatus includes an original document size detector device for detecting a size of an original document to be processed and a non-standard size input instruction screen for inputting a size of an original document to be processed. Normally, the detector device detects the size of an original document, and the original document image data is processed based on the obtained original document size to reproduce an image on the recording material. The non-standard size input instruction screen includes an X key and a Y key that enable the operator to input a new original document size by inputting a difference between the actual document size and reference values, where the reference values are provided based on the original document size obtained by the detector device.

Abstract: A process for forming a polycrystalline TFT LCD is provided, thereby greatly reducing the manufacturing cost and time. The process includes steps of performing a first masking procedure to define a gate conductive region, successively forming an insulation layer, an amorphous channel semiconductor layer, a catalytic layer and a doped semiconductor layer, performing a second masking procedure to remove portions of the semiconductor layer and the catalytic layer to define an electrode region, performing a thermal treatment to respectively convert the electrode region and the amorphous semiconductor channel layer into a source/drain region and a crystalline semiconductor channel layer by the catalytic layer, performing a third masking procedure to define data lines, performing a fourth masking procedure to form a contact hole, and performing a fifth masking procedure to define a transparent pixel electrode region, thereby forming the TFT.

Abstract: A heat-dissipating device is designed for use in an integrated circuit package for heat dissipation. The heat-dissipating device is a molded piece of a heat-conductive material, having an exterior side which is to be exposed to the outside of the integrated circuit package. The heat-dissipating device is characterized in the forming of a staircase-like cutaway part at the edge of the exterior side thereof, which is formed with a plurality of stepped surfaces. During the molding process, the staircase-like cutaway part can help slow down the flowing speed of the encapsulation resin flow, so that the resin flow would hardly flash onto the exterior side of the heat-conductive device. In addition, the staircase-like form of the cutaway part provides a lengthier path that would hardly allow outside moisture to penetrate to the inside of the integrated circuit package and cause popcorn effect in the integrated circuit package. The manufactured integrated circuit package is therefore more reliable to use.