Patents Represented by Attorney Edward James Mischell

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  • Semiconductor bond pad patterns and method of formation
    Patent number: 8153510
    Abstract: In a semiconductor wafer, the polyimide film underneath a power metal structure is partially etched to create corresponding surface depressions of the conformal top power metal. The depressions at the surface of power metal are visible under optical microscopy. Arrangement of the depressions in a pattern facilitates the alignment of probe needles, set-up of automated wire bonding and microscopic inspection for precise alignment of wire bonds.
    Type: Grant
    Filed: April 26, 2010
    Date of Patent: April 10, 2012
    Assignee: Power Gold LLC
    Inventor: James Jen-Ho Wang