Abstract: Apparatus and method for obtaining improved control of the temperature of a semiconductor wafer over its area during plasma processing including reactive ion etching (RIE) and similar processing. RIE reactor apparatus is provided with a novel chuck arrangement both for holding and for controlling the temperature of a wafer during processing. A top face of a chuck (either mechanical or electrostatic), against which the wafer is held, is configured into a plurality of zones into which zone coolant gas, such as helium, is admitted. The zone coolant gas passes through narrow channels between the top face of the chuck and the Underside of the wafer. Heat transfer from the wafer through the zone coolant gas and to the body of the chuck is controlled zone by zone by separately setting the pressure of zone coolant gas in each of the zones. By properly choosing pressures of zone coolant gas in the respective zones the temperature across the area from the center to the rim of both small and large diameter wafers (e.g.

Abstract: Video signal scrambling and descrambling methods and apparatus for a subscription TV system are provided which are compatible with other equipment operating in accordance with pre-existing modes of signal scrambling and descrambling. Coded indicator signals generated in accordance with the invention are inserted into selected lines of video signals before they are scrambled by a previously installed scrambler located at a central office. The scrambled video signals, with indicator signals inserted, are then sent to all subscriber locations within the TV system. At new subscriber locations, descrambling receivers, in accordance with the present invention, detect and decode the indicator signals and in accordance with a new mode of operation properly descramble the video signals. At old subscriber locations, previously installed descrambling receivers ignore the indicator signals and descramble the video signals in accordance with pre-existing modes of operation.

Abstract: There is disclosed a high density electronic connector assembly (system) having a first insulating portion and a second insulating portion adapted to be mated together and held in precise dimensional relation to each other with a suitable steady force. There are a plurality of contact members projecting down beneath the first portion on very close centers. There is a like plurality of socket holes in the second portion, with a respective printed-circuit (conductor) land at the bottom of each hole. Each land is adapted to act as a spring element to establish a minimum normal contact force. Seated in each hole is a small metal ball. Each ball is adapted to press against a respective contact member of the first portion when the upper and lower portions are fully mated. There is also disclosed a method of seating and re-flow soldering the balls to the respective lands in the socket holes.

Abstract: An oscillator system and method in which a time period (inverse of frequency) of a multi-stage ring oscillator (ROSC) is adjusted by a bias current which controls the charging and discharging times of respective capacitors (e.g., interelectrode capacities) within each stage. The time periods of the unadjusted oscillator are counted along with the time periods of a reference clock over a same period of time and a count difference between the two counts is determined. The count difference is applied by a logic circuit in accordance with an algorithm relating count differences to incremental bias current levels to adjust the frequency of the oscillator. The logic circuit generates digital gate signals corresponding to the count difference and these signals automatically select the bias current level needed to bring the oscillator frequency into close agreement with the reference clock frequency.

Abstract: There is disclosed a high density electronic connector assembly (system) having a first insulating portion and a second insulating portion adapted to be mated together and held in precise dimensional relation to each other with a suitable steady force. There are a plurality of contact members projecting down beneath the first portion on very close centers. There is a like plurality of socket holes in the second portion, with a respective printed-circuit (conductor) land at the bottom of each hole. Each land is adapted to act as a spring element to establish a minimum normal contact force. Seated in each hole is a small metal ball. Each ball is adapted to press against a respective contact member of the first portion when the upper and lower portions are fully mated. There is also disclosed a method of seating and re-flow soldering the balls to the respective lands in the socket holes.