Abstract: A process for producing electrical contact connections for a component integrated in a substrate material is provided, the substrate material having a first surface region, and at least one terminal contact being arranged at least partially in the first surface region for each component, which is distinguished in particular by application of a covering to the first surface region and production of at least one contact passage which, in the substrate material, runs transversely with respect to the first surface region, in which process, in order to form at least one contact location in a second surface region which is to be provided, at least one electrical contact connection from the contact location to at least one of the terminal contacts is produced via the respective contact passages.

Abstract: A multi-memory media adapter to read a plurality of different types of memory media cards. Signals are mapped to the contact pins depending upon the type of memory media card. In one embodiment, a controller connected to an interconnection means maps at least one signal to the contact pins depending upon the type of memory card inserted.

Abstract: An electronic wiping torsional connector for use in connecting to mating contacts on an insulating base. The connector includes a plurality of contacts 1-10 each having a contact 13 and an anchor 14. Contacts 1-10 twist against anchor 14 when the insulating base is inserted into the connector to provide the wiping contact. In an alternative embodiment, the conductors are wires having two bends at different angles. One bend is elongated such that it engages a paddle before the other and rotates the other bend into contact with a ribbon contact located on the paddle.

Abstract: An electrical connector. An electrical connector a pair of cylindrical housings, one having a plurality of torsion bar conductors and a second having a plurality of ramps. Rotating the pair of housings relative to one another causes an angled tip on the torsion bar to rotate as it moves up the ramp. A land is provided to discontinue further rotation of the torsion bar tip as the housings continue to rotate.

Abstract: A wafer level packaging process for packaging components is provided. The process includes permanently connecting a functional side of a base substrate to a covering substrate at wafer level so that a plurality of functional regions on the functional side are in each case packaged to form a wafer level package, the plurality of functional regions being spaced apart from one another on the functional side; producing contact-connection recesses in the base substrate to uncover contact surfaces on the base substrate from a back surface of the base substrate; dividing the base substrate into body regions and connection regions; thinning the body regions or the connection regions until the wafer level package has different thicknesses in the body regions and the connection regions; and dicing wafer level package into chips along predefined cutting lines between the plurality of functional regions.

Abstract: An apparatus is disclosed that improves density of electrical components in a circuit assembly. Electrical components 202, 204 are stacked so that they overlap each other and are encapsulated in an electronic insulating material 104. The resulting subassembly may be integrated onto a printed circuit board or into a reverse-interconnection process assembly.

Abstract: An electronic wiping torsional connector for use in connecting to mating contacts on an insulating base. The connector includes a plurality of contacts 1-10, each having a contact area 93 adapted for wiping contact to a pad, an anchor area 92, and flattened, ribbon-like connector for receiving a wiping contact. Contacts 1-10 twist against an anchor 92 when the insulating base is inserted into the connector to provide the wiping contact.

Abstract: Systems and methods of providing security to an external Serial Advanced Technology Attachment (SATA) device are described herein. A controller is connected between the eSATA device and the computing device. On startup, the controller presents a first partition of eSata device as a Read Only Memory, e.g., CD-ROM, but at the same time it restricts access of the computing device to a second partition of the eSata device until receiving a valid identity authentication. The second partition is preferably encrypted with a key stored on a first partition. Decryption is performed in the controller as part of presenting the eSata device. The authentication process is preferably stored in the first partition and downloaded to the computing device on startup.

Abstract: The present invention provides an electronic assembly 400 and a method for its manufacture 800, 900, 1000 1200, 1400, 1500, and 1700. The assembly 400 uses no solder. Components 406 or component packages 402, 802, 804, 806 with I/O leads 412 are placed 800 onto a planar substrate 808. The assembly is encapsulated 900 with electrically insulating material 908 with vias 420, 1002 formed or drilled 1000 through the substrate 808 to the components' leads 412. Then the assembly is plated 1200 and the encapsulation and drilling process 1500 repeated to build up desired layers 422, 1502, 1702. The planar substrate 808 may be a flexible substrate 2016 allowing bending of an assembly 2000 to fit into various enclosures.

Abstract: A method and apparatus for connecting multiple cores to form a multi core processor. Each processor is connected to at least two other processors, each of which is a mirror image of the first processor. The processors are connected to form a two dimensional matrix connected by one drop busses.

Abstract: A method and apparatus for dynamic partial reconfiguration on an array of processors. The method includes the steps of verifying if a processor is ready for dynamic partial reconfiguration to begin, deciding the degree of dynamic partial reconfiguration, including the number and identity of all processors to be modified, executing native machine code in the port of a processing device, and modifying a segment of the internal memory of said single processing device. Additional embodiments allow modification of multiple processors in the array, including the modification of all processors on a die or system.

Abstract: In order to achieve an integration of functional structures into the housing of electronic components, provision is made of a method for producing an electronic component comprising at least one semiconductor element having at least one sensor-technologically active and/or emitting device on at least one side, the method comprising the following steps: provision of at least one die on a wafer, production of at least one patterned support having at least one structure which is functional for the sensor-technologically active and/or emitting device, joining together of the wafer with the at least one support, so that that side of the die which has the sensor-technologically active and/or emitting device faces the support, separation of the die.

Abstract: A zoned interactive control area (10) wherein an architectural space is divided in to a plurality of zones (16), each having its own sensor (22) and zone lights (18). In a normal operating mode (50) the sensors (22) are used to detect the presence of a person such that the zone lights (18) can be turned on and/or adjusted for light level. Each zone light (18) also has a light sensor (24) used, at least in part, for communication with the other zone lights (18), such that the light level can be adjusted not just in response to a presence in the respective zone (16) but also in response to presence in other zones (16). According to a security method (70) when the zone lights (18) are not in use for normal lighting (as when they are turned off) then if the sensors (22) detect the presence of an intruder the zone lights (18) flash to deter the intruder and also communicate the fact of the presence of the intruder to the other zone lights (18) via the light sensors (22).

Abstract: A method (10) for manufacturing a monolithic molded electronic assembly (12). A mold (14) having first and second mold potions (14a-b) that mate to form an interior chamber (16) is provided. The mold has an injection port (22) and channel (24) connecting into the chamber. Electronic parts (30) having electronic contacts (32) are populated onto the second mold portion, to be substantially contained in the chamber. The mold potions are mated together and a liquid insulating molding material (36) is injected through the injection port channel to fill the chamber. The molding material is hardened to a solid, thereby embedding the electronic parts in the molding material as a monolithic sub-assembly (40). The monolithic sub-assembly is removed from the mold and one or more solderless conductive circuits (50) are applied to the electronic contacts of the electronic parts, thereby providing the electronic assembly.

Abstract: An electrical connector. An electrical connector comprising a connector body having a first channel and a first conductive element extending through the first channel in a first tip section. The first tip section having a first moment arm that, when forced in contact with a first conductive surface, twists the first conductive element to produce a torsion force. The torsion force holds the first tip section in contact with the first conductive surface.

Abstract: An electrical device containing multiple light emitting diode (LED) dies each having respective first and second connectors suitable to receive current through the LED die. A common base layer of a first electrically conductive material has cavities into which at least one LED die is mounted with its second connector electrically connected by a conductive bonding material to the first conductive material of the base layer. One or more over-layer sections of a second electrically conductive material each are electrically connected by a bond to at least one of the first connector of an LED die. And an insulator electrically separates the first conductive material of the base layer from the second conductive material of over-layer sections.

Abstract: The present invention relates to the field of electronic devices and their associated driver and/or controller integrated circuits and in particular to the mechanical packaging of electronic devices and to the packaging of electronic devices and their associated driver and/or controller integrated circuits.

Abstract: A multi-memory media adapter having a plurality of ports, each having at least one set of contact pins adapted to connect to different types of flash cards. Signals are mapped to the contact pins depending upon the type of flash card. In one embodiment, a controller has signal lines connected to an interconnection means which connects wires, cables or traces to the sets of contact pins. Signals are mapped on the signal lines depending upon the type of flash card inserted.

Abstract: There is described a hearing aid comprising input transducer means for converting input acoustic signals into electrical input signals, signal processor means and output transducer means. The signal processor means is operable to divide said electrical input signals into a plurality of frequency bands and to perform a contrast enhancement operation in each said frequency band, to increase the difference between the amplitudes of those frequency components of the input electrical signals having a relatively high amplitude and those frequency components thereof having a relatively low amplitude to produce output electrical signals in each said respective frequency bands. The output transducer means is operable to produce an output acoustic signal corresponding to a combination of said output electrical signals.

Abstract: An electronic commerce process that facilitates online transactions among multiple participants, that prevents consumer fraud due to pirated payment card numbers, with calculated risk, involving at least one trusted payment card host (3), where buyer's payment card number is registered and corresponding secret keys are set up. The buyer (1b) initiates an online transaction by selecting a host from a list of hosts that served by the seller's web server (2a). Then, the buyer participant (1a) sends an order online (4), SSL encrypted. The seller participant (2a) receives and decrypts the order, confirms the availability of ordered items, assigns an orderID to the order, and sends a response (5a), SSL encrypted, to the buyer participant (1a) with the assigned orderID. The buyer participant (1a) encrypts and notifies the selected host (3) of this order and orderID, and authorizes the payment (6a) using secret keys.