Abstract: The vibration forces between a frame and a continuously oscillating mass are absorbed by making the oscillating mass system and its drive means equal and by fitting each such system and means to the frame with identical resilient elements such that oscillation movements of system and means occur out of phase one with the other to absorb the exciting vibration forces.

Abstract: This invention is directed to an arrangement for compensating and absorbing vibratory oscillations of a driven spring-mass system by means of an auxiliary spring mass system. The drive for a main spring-mass system is designed such that it is guided along the same axis as the main system and oscillates out of phase with the main system.

Abstract: A charge electrode array for use in an ink jet printing apparatus is formed by anisotropic etching of apertures through a single crystal silicon substrate of (110) orientation. Conductive diffusion layers in the walls of and adjacent to the apertures permit a charge to be placed on a jet stream passing through the apertures. Contacts can be formed on the adjacent diffusion layers to provide connection to an externally located charging circuit or the contacts may be omitted when the charging circuit is formed in the substrate itself and connected by diffusion or a metal layer to each adjacent diffusion layer. Jet nozzles and synchronization electrodes are shown incorporated in the charge electrode array to form a monolithic structure capable of performing a plurality of functions. Substrate contacts are also provided for biasing.

Abstract: Multiple nozzle arrays are formed from an assembly of at least one pair of plates having intersecting channels for receiving orifice elements and sealant. The joined plates, with inserted orifice elements in one channel and sealant in the other channel are then mounted vertically or at an appropriate angle and exposed to a temperature sufficient to cause the sealant alone to melt and to flow by capillary action to seal the orifice elements in a void-and-bubble free manner and to seal the plates to form a plate block. After cooling, the plate block is sliced into multiple nozzle wafers.